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43 条记录 (耗时 0.026 秒)

    Imaging assembly and inspection method
    24.
    发明授权
    Imaging assembly and inspection method 失效
    成像组装和检查方法

    公开(公告)号：US07547895B2

    公开(公告)日：2009-06-16

    申请号：US11846990

    申请日：2007-08-29

    申请人： Venkatesan Manivannan ,  Clifford Bueno ,  Stephen Jude Duclos ,  Stanley John Stoklosa ,  Douglas Albagli ,  Paul Alan Mc Connelee

    发明人： Venkatesan Manivannan ,  Clifford Bueno ,  Stephen Jude Duclos ,  Stanley John Stoklosa ,  Douglas Albagli ,  Paul Alan Mc Connelee

    IPC分类号： G01N21/64 ,  G01F23/00

    CPC分类号： G01T1/2018 ,  C09K11/02 ,  C09K11/675 ,  C09K11/684 ,  C09K11/7703 ,  C09K11/7733 ,  C09K11/7771 ,  C09K11/7787 ,  C09K11/7789 ,  G01T1/202 ,  G21K4/00

    摘要： An adaptable imaging assembly is provided. The adaptable imaging assembly includes a free-standing phosphor film configured to receive incident radiation and to emit corresponding optical signals. An electronic device is coupled to the free-standing phosphor film. The electronic device is configured to receive the optical signals from the free-standing phosphor film and to generate an imaging signal. A free-standing phosphor film is also provided and includes x-ray phosphor particles dispersed in a silicone binder. A method for inspecting a component is also provided and includes exposing the component and a free-standing phosphor film to radiation, generating corresponding optical signals with the free standing phosphor film, receiving the optical signals with an electronic device coupled to the free-standing phosphor film and generating an imaging signal using the electronic device.

    摘要翻译： 提供了可适应的成像组件。 适应性成像组件包括独立荧光体膜，其被配置为接收入射辐射并发射相应的光信号。 电子设备耦合到独立荧光膜。 电子设备被配置为从独立荧光膜接收光信号并产生成像信号。 还提供了独立的荧光体膜，并且包括分散在硅酮粘合剂中的x射线荧光体颗粒。 还提供了用于检查部件的方法，包括将部件和独立的荧光体膜暴露于辐射，用自立式荧光膜产生相应的光信号，用与独立荧光体耦合的电子器件接收光信号 并使用该电子设备产生成像信号。

    Photovoltaic device which includes all-back-contact configuration; and related processes
    25.
    发明申请
    Photovoltaic device which includes all-back-contact configuration; and related processes 审中-公开
    包括全背接触配置的光伏装置; 和相关过程

    公开(公告)号：US20080000522A1

    公开(公告)日：2008-01-03

    申请号：US11480161

    申请日：2006-06-30

    申请人： James Neil Johnson ,  Venkatesan Manivannan

    发明人： James Neil Johnson ,  Venkatesan Manivannan

    IPC分类号： H01L31/00 ,  H02N6/00

    CPC分类号： H01L31/02363 ,  H01L31/02167 ,  H01L31/065 ,  H01L31/0747 ,  H01L31/20 ,  Y02E10/50

    摘要： A semiconductor structure is described, which includes a semiconductor substrate of one conductivity type, having a front surface and a back surface. A first amorphous semiconductor layer is applied on the front surface; and second and third amorphous semiconductor layers are disposed on portions of the back surface of the substrate. The second and third layers are each compositionally graded through their depth, from substantially intrinsic at the interface with the substrate, to substantially conductive at their opposite surfaces. In some instances, the first semiconductor layer is also compositionally graded, while in other instances, it is intrinsic in character. The semiconductor structures can function as solar cells; and modules which include a number of such cells represent another embodiment of the invention. Methods for making a photovoltaic device are also described.

    摘要翻译： 描述了一种半导体结构，其包括具有前表面和后表面的一种导电类型的半导体衬底。 第一非晶半导体层施加在前表面上; 并且第二和第三非晶半导体层设置在基板的背面的部分上。 第二层和第三层各自经过它们的深度组成分级，从与衬底的界面处的本质上基本相同，在其相对表面上基本上是导电的。 在一些情况下，第一半导体层也是组成分级的，而在其它情况下，其性质是内在的。 半导体结构可用作太阳能电池; 并且包括多个这样的单元的模块表示本发明的另一个实施例。 还描述了制造光伏器件的方法。