Method of fabricating a MESFET with a sloped MESA structure
    1.
    发明授权
    Method of fabricating a MESFET with a sloped MESA structure 失效
    制造具有倾斜MESA结构的MESFET的方法

    公开(公告)号:US07655514B2

    公开(公告)日:2010-02-02

    申请号:US12001806

    申请日:2007-12-13

    IPC分类号: H01L21/338

    CPC分类号: H01L29/8128 H01L29/1608

    摘要: A silicon carbide metal semiconductor field-effect transistor includes a bi-layer silicon carbide buffer for improving electron confinement in the channel region and/or a layer disposed over at least the channel region of the transistor for suppressing surface effects caused by dangling bonds and interface states. Also, a sloped MESA fabrication method which utilizes a dielectric etch mask that protects the MESA top surface during MESA processing and enables formation of sloped MESA sidewalls.

    摘要翻译: 碳化硅金属半导体场效应晶体管包括用于改善沟道区域中的电子限制的双层碳化硅缓冲器和/或设置在晶体管的至少沟道区域上的层,用于抑制由悬挂键和界面引起的表面效应 状态。 而且,倾斜的MESA制造方法利用在MESA处理期间保护MESA顶表面的电介质蚀刻掩模,并且能够形成倾斜的MESA侧壁。

    Semiconductor device and method of processing a semiconductor substrate
    2.
    发明申请
    Semiconductor device and method of processing a semiconductor substrate 审中-公开
    半导体器件和半导体衬底的处理方法

    公开(公告)号:US20070015373A1

    公开(公告)日:2007-01-18

    申请号:US11181427

    申请日:2005-07-13

    IPC分类号: H01L21/31 H01L21/469

    摘要: A method of processing a semiconductor substrate is provided. The method includes depositing an amorphous hydrogenated carbon film on a semiconductor substrate using a low temperature plasma deposition process and performing at least one high temperature processing step on the semiconductor substrate. The SiC substrate is processed by ion implanting at least one dopant species into at least one selected region of the SiC substrate, depositing a amorphous hydrogenated carbon film on the SiC substrate using a plasma enhanced chemical vapor deposition (PECVD) process, performing at least one high temperature processing step on the SiC substrate and removing the amorphous hydrogenated carbon film after performing the high temperature processing step.

    摘要翻译: 提供一种处理半导体衬底的方法。 该方法包括使用低温等离子体沉积工艺在半导体衬底上沉积无定形氢化碳膜,并在半导体衬底上执行至少一个高温处理步骤。 通过将至少一种掺杂剂物质离子注入到SiC衬底的至少一个选定区域中来处理SiC衬底,使用等离子体增强化学气相沉积(PECVD)工艺在SiC衬底上沉积无定形氢化碳膜,执行至少一个 高温处理步骤,并且在进行高温处理步骤之后除去无定形氢化碳膜。

    Semiconductor transistors having reduced channel widths and methods of fabricating same
    4.
    发明申请
    Semiconductor transistors having reduced channel widths and methods of fabricating same 有权
    具有减小的沟道宽度的半导体晶体管及其制造方法

    公开(公告)号:US20070238253A1

    公开(公告)日:2007-10-11

    申请号:US11400842

    申请日:2006-04-10

    申请人: Jesse Tucker

    发明人: Jesse Tucker

    IPC分类号: H01L21/336

    摘要: A method of forming a channel in a semiconductor device including forming an opening in a masking layer to expose a portion of an underlying semiconductor layer through the opening is provided. The method further includes disposing a screening layer and implanting a first type of ions in the portion of the underlying semiconductor layer through the screening layer and through the opening in the masking layer. A second type of ions are implanted in the portion of the underlying semiconductor layer through the screening layer and through the opening in the masking layer at an oblique ion implantation angle wherein a lateral spread of second type ions is greater than a lateral spread of first type ions. Semiconductor devices fabricated in accordance to above said method is also provided.

    摘要翻译: 提供一种在半导体器件中形成通道的方法,包括在掩模层中形成开口以通过开口暴露下面的半导体层的一部分。 该方法还包括设置屏蔽层并且通过屏蔽层和穿过屏蔽层中的开口将下一半导体层的部分中的第一类型的离子注入。 第二类型的离子通过屏蔽层注入到下面的半导体层的部分中,并以斜离子注入角通过掩模层中的开口,其中第二类型离子的横向扩展大于第一类型的横向扩展 离子。 还提供了根据上述方法制造的半导体器件。

    SiC metal semiconductor field-effect transistors and methods for producing same
    6.
    发明申请
    SiC metal semiconductor field-effect transistors and methods for producing same 失效
    SiC金属半导体场效应晶体管及其制造方法

    公开(公告)号:US20080096335A1

    公开(公告)日:2008-04-24

    申请号:US12001806

    申请日:2007-12-13

    IPC分类号: H01L21/04

    CPC分类号: H01L29/8128 H01L29/1608

    摘要: A silicon carbide metal semiconductor field-effect transistor includes a bi-layer silicon carbide buffer for improving electron confinement in the channel region and/or a layer disposed over at least the channel region of the transistor for suppressing surface effects caused by dangling bonds and interface states. Also, a sloped MESA fabrication method which utilizes a dielectric etch mask that protects the MESA top surface during MESA processing and enables formation of sloped MESA sidewalls.

    摘要翻译: 碳化硅金属半导体场效应晶体管包括用于改善沟道区域中的电子限制的双层碳化硅缓冲器和/或设置在晶体管的至少沟道区域上的层,用于抑制由悬挂键和界面引起的表面效应 状态。 而且,倾斜的MESA制造方法利用在MESA处理期间保护MESA顶表面的电介质蚀刻掩模,并且能够形成倾斜的MESA侧壁。

    METHOD FOR IMPROVED TRENCH PROTECTION IN VERTICAL UMOSFET DEVICES
    7.
    发明申请
    METHOD FOR IMPROVED TRENCH PROTECTION IN VERTICAL UMOSFET DEVICES 审中-公开
    用于在垂直UMOSFET器件中改进TRENCH保护的方法

    公开(公告)号:US20080038890A1

    公开(公告)日:2008-02-14

    申请号:US11463709

    申请日:2006-08-10

    申请人: Jesse Tucker

    发明人: Jesse Tucker

    IPC分类号: H01L21/336

    摘要: A method of forming a self-aligned protective layer within a UMOSFET device includes forming a trench within an upper surface of a drift layer, the drift layer of a first polarity type, and epitaxially growing a protective layer on a bottom surface of the trench, the protective layer comprising dopant of the second polarity type. The protective layer is disposed beneath a gate insulating layer formed thereupon.

    摘要翻译: 在UMOSFET器件内形成自对准保护层的方法包括在漂移层的上表面形成沟槽,第一极性类型的漂移层,以及在沟槽的底面上外延生长保护层, 所述保护层包括第二极性类型的掺杂剂。 保护层设置在其上形成的栅极绝缘层的下方。

    SiC metal semiconductor field-effect transistor
    8.
    发明授权
    SiC metal semiconductor field-effect transistor 失效
    SiC金属半导体场效应晶体管

    公开(公告)号:US07345309B2

    公开(公告)日:2008-03-18

    申请号:US10930584

    申请日:2004-08-31

    IPC分类号: H01L31/0312

    CPC分类号: H01L29/8128 H01L29/1608

    摘要: A silicon carbide metal semiconductor field-effect transistor includes a bi-layer silicon carbide buffer for improving electron confinement in the channel region and/or a layer disposed over at least the channel region of the transistor for suppressing surface effects caused by dangling bonds and interface states. Also, a sloped MESA fabrication method which utilizes a dielectric etch mask that protects the MESA top surface during MESA processing and enables formation of sloped MESA sidewalls.

    摘要翻译: 碳化硅金属半导体场效应晶体管包括用于改善沟道区域中的电子限制的双层碳化硅缓冲器和/或设置在晶体管的至少沟道区域上的层,用于抑制由悬挂键和界面引起的表面效应 状态。 而且,倾斜的MESA制造方法利用在MESA处理期间保护MESA顶表面的电介质蚀刻掩模,并且能够形成倾斜的MESA侧壁。

    SIC metal semiconductor field-effect transistors and methods for producing same
    9.
    发明申请
    SIC metal semiconductor field-effect transistors and methods for producing same 失效
    SIC金属半导体场效应晶体管及其制造方法

    公开(公告)号:US20060043379A1

    公开(公告)日:2006-03-02

    申请号:US10930584

    申请日:2004-08-31

    IPC分类号: H01L21/338 H01L29/80

    CPC分类号: H01L29/8128 H01L29/1608

    摘要: A silicon carbide metal semiconductor field-effect transistor includes a bi-layer silicon carbide buffer for improving electron confinement in the channel region and/or a layer disposed over at least the channel region of the transistor for suppressing surface effects caused by dangling bonds and interface states. Also, a sloped MESA fabrication method which utilizes a dielectric etch mask that protects the MESA top surface during MESA processing and enables formation of sloped MESA sidewalls.

    摘要翻译: 碳化硅金属半导体场效应晶体管包括用于改善沟道区域中的电子限制的双层碳化硅缓冲器和/或设置在晶体管的至少沟道区域上的层,用于抑制由悬挂键和界面引起的表面效应 状态。 而且,倾斜的MESA制造方法利用在MESA处理期间保护MESA顶表面的电介质蚀刻掩模,并且能够形成倾斜的MESA侧壁。