摘要:
A location awareness system using RFID and a wireless communication apparatus for the location awareness are provided. The location awareness system includes a RFID tag, a wireless communication apparatus for location awareness, more than three anchors, a coordinator, and a server. The wireless communication apparatus identifies the target object with the RFID attached through communicating with the RFID tag. The anchors receive information about the identified target object and measuring a distance by communication with the wireless communication apparatus using a predetermined wireless communication scheme. The coordinator collects the measure distance and the information from each of the anchors. The server calculates a location of the target object by receiving information about the measured distances and the target objects from the coordinator and calculating the location of the wireless communication apparatus using the received information.
摘要:
A method for processing and transmitting data packet is disclosed. The method includes receiving a data packet with a first Redundancy Version (RV) from a serving cell, receiving a data packet with a second RV different from the first RV from a collaborative cell, and combining and decoding the data packets received from the serving cell and the collaborative cell.
摘要:
A method and apparatus for transmitting data in a wireless communication system are disclosed, which transmit uplink data in consideration of mobile station (MS) consumption power such that a UE can be stably operated at a cell edge. A method for transmitting data by a mobile station (MS) of a wireless communication system includes transmitting, if MS power consumption is higher than limitation of power consumption, data to a base station (BS) with power higher than the limitation of power consumption using power supplied from a primary power-supply unit and a storage unit during a first time, and charging the storage unit using the primary power-supply unit during a second time, wherein the limitation of power consumption indicates maximum power amount capable of being normally supplied from the primary power-supply unit.
摘要:
A method for multiplexing a control information stream, and a data information stream comprised of systematic symbols and non-systematic symbols in a wireless mobile communication system is described. The multiplexing method includes mapping the data information stream to a resource area, so that the systematic bit symbols are not mapped to a specific resource area where the control information stream is to be mapped, and mapping the control information stream to the specific resource area.
摘要:
A method of transport block retransmission in a wireless communication system employing carrier aggregation is disclosed. A method of retransmitting transport blocks in a base station of a wireless communication system employing carrier aggregation comprises mapping each of a plurality of transport blocks to each of a plurality of component carriers using a first mapping pattern and transmitting the plurality of transport blocks to a mobile station; recognizing that the plurality of transport blocks are not transmitted successfully; and mapping each of the plurality of transport blocks to each of the plurality of component carriers using a second mapping pattern and retransmitting the plurality of transport blocks to the mobile station.
摘要:
Disclosed herein is a printed circuit board having a bump and a method of manufacturing the same. The printed circuit board having a bump includes an insulating layer into which an inner circuit layer is impregnated; a protective layer that is formed under the insulating layer and has an opening exposing a pad unit of the inner circuit layer; and a bump that is integrally formed with the pad unit and is protruded from the inner side of the protective layer to the outside of the protective layer through the opening. The bump is integrally formed with the pad unit, thereby improving bonding strength between the bump and the printed circuit board, and the surface area of the bump is formed to be wide, thereby improving bonding strength between a solder ball and the printed circuit board.
摘要:
Disclosed herein is a printed circuit board, including: metal bumps having constant diameters and protruding over an insulation layer; a circuit layer formed beneath the insulation layer; and vias passing through the insulation layer to connect the metal bumps with the circuit layer.
摘要:
A method of transmitting data in a wireless access system includes: calculating a number C of code blocks using a size B of an input bit sequence, a maximum size Z of the code blocks, and a size L of a cyclic redundancy check (CRC) which is to be attached to each of the code blocks; calculating a size B′ of a modified input bit sequence using the number C, the size L, and the size B; obtaining a size K of each of the code blocks using the size B′ and the number C; segmenting the input bit sequence to have the number C of the code blocks and the obtained size K of each of the code blocks; generating the code blocks by attaching the CRC to each of the segmented input bit sequences; and channel-coding the code blocks.
摘要:
A method of transport block retransmission in a wireless communication system employing carrier aggregation is disclosed. A method of retransmitting transport blocks in a base station of a wireless communication system employing carrier aggregation comprises mapping each of a plurality of transport blocks to each of a plurality of component carriers using a first mapping pattern and transmitting the plurality of transport blocks to a mobile station; recognizing that the plurality of transport blocks are not transmitted successfully; and mapping each of the plurality of transport blocks to each of the plurality of component carriers using a second mapping pattern and retransmitting the plurality of transport blocks to the mobile station.
摘要:
Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.