摘要:
In an embodiment of the present invention, a memory card includes a bottom plastic piece having a plurality of lateral sides, one of which includes a notch, and a cavity interposed along the lateral sides. A printed circuit board (PCB) assembly, including memory, is positioned in the cavity. A fin-structure is created as part of the manufacturing process of the bottom plastic piece of the card. The memory card is configured to function in a read-write mode when the fin-structure is present, and in a write-protect mode when the fins are snapped off, and the notch is exposed. Alternatively, a plug device can be insertably positioned into the notch, causing the memory card to function in a read-write mode when the plug device is positioned into the notch, and in a write-protect mode when the plug device is removed and the notch is exposed.
摘要:
A Universal-Serial-Bus (USB) device includes a PCBA mounted inside a plastic housing molded from a hard plastic (e.g., PC), and includes a handle portion mounted over a body section of the PCBA, and a plug support portion that is snap-coupled onto the housing and disposed under a plug section of the PCBA. The plug shell portion of the housing is integrally connected to (i.e., molded at the same time as or connected by way of molding to) the handle portion, and combines with the plug support structure extending under the plug section of the PCBA to form a structural arrangement similar to a conventional male USB connector plug that allows access to metal contacts formed on the PCBA, but without having the plug shell soldered to the PCBA.
摘要:
A low-profile Universal-Serial-Bus (USB) connector includes a substantially flat base structure that is received in the lower section of a conventional female USB connector, and includes metal contacts formed on an upper surface of the base structure. Wobble or vertical play is reduced by rails extending along side edges of the base structure that are partially inserted into gaps formed between the metal case and base structure of the female USB connector. Between metal contacts on the low-profile USB connector are raised ribs (dividers) that prevent undesirable damage or contamination to the metal contacts. The connector base structure of the low-profile USB connector can be separate or can be integrated with a circuit board that holds a flash memory chip and a USB controller chip.
摘要:
A two-piece flash-memory-drive card has an integrated slim Universal-Serial-Bus (USB) connector that fits into a standard USB socket. The slim USB connector has 4 metal contacts on a board that is encapsulated by a lower plastic case but no upper plastic case. Components are mounted onto the board on the side opposite the metal contacts and are covered by the lower plastic case. A thinner portion of the plastic case forms a light window that allows a light-emitting diode on the board to shine through the case. The lower plastic case is bonded to the board with adhesive or using snaps. Supporting underside ribs in the lower plastic case opposite the metal contacts allow most of the card to be thinner than the space inside the standard USB socket.
摘要:
A Universal-Serial-Bus (USB) device includes a PCBA mounted inside a molded plastic housing structure such that metal contacts are exposed on a plug portion of the housing structure, and includes a plastic plug shell integrally molded to the housing structure such that an upper wall of the plug shell is spaced from the metal contacts by a predetermined gap distance. A USB controller IC is mounted onto a relatively narrow portion of the PCBA under the metal contacts to reduce overall length of the USB device. An optional locking collar strengthens a rear edge of the plastic plug shell and front handle wall of the housing structure. An optional rear cover is attached over a rear opening of the housing structure and secures a rear edge of the PCBA.
摘要:
A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.
摘要:
A Universal-Serial-Bus (USB) device includes a PCBA mounted inside a molded plastic housing structure such that metal contacts are exposed on a plug portion of the housing structure, and includes a plastic plug shell integrally molded to the housing structure such that an upper wall of the plug shell is spaced from the metal contacts by a predetermined gap distance. A USB controller IC is mounted onto a relatively narrow portion of the PCBA under the metal contacts to reduce overall length of the USB device. An optional locking collar strengthens a rear edge of the plastic plug shell and front handle wall of the housing structure. An optional rear cover is attached over a rear opening of the housing structure and secures a rear edge of the PCBA.
摘要:
A Universal-Serial-Bus (USB) device includes a PCBA mounted inside a molded plastic housing structure such that metal contacts are exposed on a plug portion of the housing structure, and includes a metal plug shell attached to the housing structure such that an upper wall of the metal plug shell is spaced from the metal contacts by a predetermined gap distance. A USB controller IC is mounted onto a relatively narrow portion of the PCBA under the metal contacts to reduce overall length of the USB device. The metal plug shell is molded or snap-coupled onto tabs formed on the plug portion of the housing structure. An optional locking collar secures a rear edge of the metal plug shell to the housing structure. An optional rear cover is attached over a rear opening of the housing structure and secures a rear edge of the PCBA.
摘要:
A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.
摘要:
A memory card including a PCB assembly that is consistent with existing 13-pad MMC mechanical form factors, and a housing that is consistent with the SD mechanical form factor, thereby providing a single PCBA and housing arrangement that can be used to produce both MMC and SD memory cards. The thirteen contact pads support all MMC and SD contact pad patterns, but are modified to facilitate a write protect switch. The housing includes an enlarged window (or windows) that exposes two or more contact pads in each of the multiple rows, thereby facilitating slidable insertion of the memory card into a socket of a host system. Alignment notches are formed in the side edges of the PCB, and/or alignment pins are utilized for properly aligning the PCBA within the housing.