公开(公告)号：US08047877B1

公开(公告)日：2011-11-01

申请号：US12880055

申请日：2010-09-10

申请人： Fei Liu ,  Ou Yang ,  Hong-Tu Zhang ,  Ping-Chih Chen ,  Ming-Chiang Chen

发明人： Fei Liu ,  Ou Yang ,  Hong-Tu Zhang ,  Ping-Chih Chen ,  Ming-Chiang Chen

IPC分类号： H01R24/00 ,  H01R33/00

CPC分类号： H01R13/506 ,  H01R13/4367 ,  H01R13/652 ,  H01R24/60 ,  H01R2107/00

摘要： A USB (Universal Serial Bus) connector includes an insulating body which has a base portion, an inserting portion, and a pair of clipping walls and defines a receiving space therebetween. A plurality of signal terminals is assembled to the insulating body. Each of the signal terminals has a connecting arm disposed in the inserting portion and a signal contacting arm hanging out of the receiving space. A fixing body is mounted in the receiving space and clipped between the clipping walls. The signal contacting arms are restrained under the fixing body and further stretching behind the fixing body. A ground terminal has a fixing slice fixed in the fixing body, a resilient arm stretching out of the fixing body to be located above the inserting portion and a ground contacting arm restrained under the fixing body and further stretched behind the fixing body to be aligned with the signal contacting arms.

摘要翻译： USB（通用串行总线）连接器包括绝缘体，其具有基部，插入部分和一对夹持壁，并且限定了它们之间的接收空间。 多个信号端子组装到绝缘体上。 每个信号端子具有设置在插入部分中的连接臂和从接收空间悬挂的信号接触臂。 固定体安装在容纳空间中并夹在夹壁之间。 信号接触臂被限制在固定体的下方并进一步在固定体的后面拉伸。 接地端子具有固定在固定体上的固定片，弹性臂伸出固定体以位于插入部分的上方，并且接地臂限制在固定体的下方，并进一步在固定体的后方延伸以与固定体对准 信号接触臂。

公开(公告)号：US20110241185A1

公开(公告)日：2011-10-06

申请号：US12754108

申请日：2010-04-05

申请人： Steven J. Koester ,  Fei Liu

发明人： Steven J. Koester ,  Fei Liu

IPC分类号： H01L23/538 ,  H01L21/768

CPC分类号： H01L21/76898 ,  H01L21/568 ,  H01L23/481 ,  H01L23/552 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/1461 ,  H01L2924/00

摘要： A shielded through-substrate via (TSV) structure includes a first through-substrate via configured to transmit a signal at least from a top surface of a semiconductor device layer in a substrate to a bottommost surface of the substrate. The shielded TSV structure includes at least one second TSV located on the outside of the first TSV and configured to laterally shield the first TSV from external electrical signals. The at least one second TSV can be a unitary cylindrical structure including the first TSV therein, or a plurality of discrete structures configured to laterally shield the first TSV with gaps thereamongst. The at least one second TSV can include a conductive material that is different from the material of the substrate, or the at least one TSV can include a doped semiconductor material that is derived from the semiconductor material within the substrate.

摘要翻译： 屏蔽穿通基板通孔（TSV）结构包括：第一穿通基板通孔，其经配置以至少从衬底中的半导体器件层的顶表面向衬底的最底表面传输信号。 所述屏蔽TSV结构包括位于所述第一TSV的外部上并被配置为横向地屏蔽所述第一TSV与外部电信号的至少一个第二TSV。 至少一个第二TSV可以是包括其中的第一TSV的单一圆柱形结构，或者多个分立结构，其被配置成在其之前横向地屏蔽具有间隙的第一TSV。 至少一个第二TSV可以包括不同于衬底的材料的导电材料，或者至少一个TSV可以包括源自衬底内的半导体材料的掺杂半导体材料。

公开(公告)号：US20110188605A1

公开(公告)日：2011-08-04

申请号：US12993181

申请日：2009-05-20

申请人： Dongshan Bao ,  Fei Liu ,  Yubao Zhou ,  Bin Wang

发明人： Dongshan Bao ,  Fei Liu ,  Yubao Zhou ,  Bin Wang

IPC分类号： H04L27/20 ,  H04L27/00

CPC分类号： H04L5/0046 ,  H04L1/0057 ,  H04L1/0071 ,  H04L1/0084

摘要： A framing method of the common interleaved frame is provided, which includes the following steps: obtaining the position information of each sub-channel in the common interleaved frame; depositing data bits in each sub-channel accordingly based on the position information of each sub-channel and the number of bits comprised in the capacity unit CU; wherein the number of bits comprised in the CU is determined by a symbol mapping mode of each sub-channel. The method can help the skilled in the art to make a CIF with the data bits at the transmitter of the T-MMB system. A framing device of the common interleaved frame is also provided in the present invention.

摘要翻译： 提供了公共交错帧的成帧方法，其包括以下步骤：获得公共交织帧中每个子信道的位置信息; 基于每个子信道的位置信息和容量单元CU中包含的位数，相应地在每个子信道中存储数据位; 其中包括在CU中的比特数由每个子信道的符号映射模式确定。 该方法可以帮助本领域技术人员使用T-MMB系统的发射机处的数据位进行CIF。 在本发明中还提供了公共交错帧的成帧装置。

公开(公告)号：US07985615B2

公开(公告)日：2011-07-26

申请号：US11561733

申请日：2006-11-20

申请人： Fei Liu ,  Ma Siguang ,  Kang L. Wang

发明人： Fei Liu ,  Ma Siguang ,  Kang L. Wang

IPC分类号： H01L21/00

CPC分类号： H01L51/4206 ,  B82Y10/00 ,  H01L51/002 ,  H01L51/0048 ,  Y02E10/549

摘要： The present invention relates to embodiments of TPV cell structures based on carbon nanotube and nanowire materials. One embodiment according to the present invention is a p-n junction carbon nanotube/nanowire TPV cell, which is formed by p-n junction wires. A second embodiment according to the present invention is a carbon nanotube/nanowire used as a p-type (or n-type), and using bulk material as the other complementary type to a form p-n junction TPV cell. A third embodiment according to the present invention uses a controllable Schottky barrier height between a one-dimensional nanowire and a metal contact to form the built-in potential of the TPV cells.

摘要翻译： 本发明涉及基于碳纳米管和纳米线材料的TPV电池结构的实施方案。 根据本发明的一个实施方案是由p-n结线形成的p-n结碳纳米管/纳米线TPV电池。 根据本发明的第二实施方案是用作p型（或n型）的碳纳米管/纳米线，并且使用块状材料作为p-n结TPV电池形式的另一种互补型。 根据本发明的第三实施例使用一维纳米线和金属接触之间的可控肖特基势垒高度来形成TPV电池的内置电位。

公开(公告)号：US20110104798A1

公开(公告)日：2011-05-05

申请号：US12675839

申请日：2008-08-28

申请人： Daniel Tschumperlin ,  Fei Liu ,  Justin Mih

发明人： Daniel Tschumperlin ,  Fei Liu ,  Justin Mih

IPC分类号： C12N5/071 ,  C12M3/00 ,  C40B60/00 ,  B05D3/00

CPC分类号： C12N5/0068 ,  C12M23/12 ,  C12N2533/30

摘要： A multi-well plate can be loaded with a range of compliant substrates. Commerically-available assays can be used to test cellular responses across a plate with shear modulus from 50 to 51200 Pascals. Cells can be grown in the plates, and can be manipulated and analyzed. Hydrogels can be attached to the bottom of a well. The plates can support the attachment and growth of different cell types and can be compatible with standard 96-well and 384-well plate assays. The mechanical properties of the hydrogels can be reproducible and stable to increase the shelf life of the substrate. The hydrogel can be compatible with growth of a variety of cell types, various attachment ligands such as collagen I, collagen IV, fibronectin, vitronectin, laminin, or RGD peptides and can be coupled to the gel surface.

摘要翻译： 多孔板可以装载一系列柔顺基板。 商业上可用的测定可以用于测试横跨板的细胞反应，剪切模量为50至51200帕斯卡。 细胞可以在板中生长，并且可以被操纵和分析。 水凝胶可以附着在井的底部。 板可以支持不同细胞类型的附着和生长，并且可以与标准的96孔和384孔板测定相兼容。 水凝胶的机械性能可重现和稳定，以增加基材的保质期。 水凝胶可以与各种细胞类型，各种附着配体如胶原I，胶原IV，纤连蛋白，玻连蛋白，层粘连蛋白或RGD肽的生长相容并且可以与凝胶表面偶联。

公开(公告)号：US20110083786A1

公开(公告)日：2011-04-14

申请号：US12575968

申请日：2009-10-08

申请人： Dechao Guo ,  Fei Liu ,  Leathen Shi ,  Keith Kwong Hon Wong

发明人： Dechao Guo ,  Fei Liu ,  Leathen Shi ,  Keith Kwong Hon Wong

IPC分类号： B29C65/78 ,  H01L21/683

CPC分类号： H01L21/6833 ,  B32B37/0007 ,  B32B2457/14 ,  Y10T156/1002

摘要： An electrostatic chuck includes an array of independently biased conductive chuck elements, an array of sensor-conductor assemblies, and/or a combination of an array of sensor-conductor assemblies and at least one motorized chuck. Conductive chuck elements, either standing alone or embedded in a sensor-conductor assembly, are independently biased electrostatically to compensate for bowing and/or warping of a substrate thereupon so that the substrate can be bonded with a planar surface. A single electrostatic chuck can be employed to reduce the bowing and warping of one of the two substrates to be bonded, or two electrostatic chucks can be employed to minimize the bowing and warping of two substrates to be bonded.

摘要翻译： 静电卡盘包括独立偏置的导电卡盘元件的阵列，传感器 - 导体组件的阵列，和/或传感器 - 导体组件阵列和至少一个电动卡盘的组合。 独立地或嵌入传感器 - 导体组件中的导电卡盘元件被静电地独立地偏置以补偿其上的衬底的弯曲和/或翘曲，使得衬底可以与平坦表面结合。 可以使用单个静电卡盘来减少要接合的两个基板中的一个的弯曲和翘曲，或者可以使用两个静电卡盘来最小化要接合的两个基板的弯曲和翘曲。

公开(公告)号：USD620444S1

公开(公告)日：2010-07-27

申请号：US29352062

申请日：2009-12-15

申请人： Fei Liu ,  Ou Yang ,  Hong-Tu Zhang ,  Ping-Chih Chen ,  Ming-Chiang Chen

设计人： Fei Liu ,  Ou Yang ,  Hong-Tu Zhang ,  Ping-Chih Chen ,  Ming-Chiang Chen

公开(公告)号：US10351825B2

公开(公告)日：2019-07-16

申请号：US15323893

申请日：2015-07-08

申请人： THE TEXAS A&M UNIVERSITY SYSTEM ,  TEMPLE THERAPEUTICS, INC. ,  Darwin J. Prockop ,  Fei Liu ,  Qingguo Zhao ,  Barry A. Berkowitz

发明人： Darwin J. Prockop ,  Fei Liu ,  Qingguo Zhao ,  Barry A. Berkowitz

IPC分类号： A61K35/28 ,  C12N5/0775

摘要： A method of producing mesenchymal stem cells from induced pluripotent stem cells in which induced pluripotent stem cells are cultured in the presence of a TGF-β inhibitor an in an atmosphere containing from about 7 vol. % to about 8 vol. % CO2 for a period of time from about 20 day to about 35 days. The cells then are transferred to a culture dish having a hydrophilic surface, and the cells are cultured in a medium containing a TGF-β inhibitor for a period of time sufficient to produce mesenchymal stem cells. Such mesenchymal stem cells are more stable and less likely to form tumors, cancers, or teratomas. Also, the induced pluripotent stem cells may be genetically engineered with at least one polynucleotide encoding a therapeutic agent and then are cultured as hereinabove described to provide genetically engineered mesenchymal stem cells that express sustained amounts of a biologically active protein or polypeptide.

公开(公告)号：US08829329B2

公开(公告)日：2014-09-09

申请号：US12858535

申请日：2010-08-18

申请人： Hariklia Deligianni ,  Fei Liu

发明人： Hariklia Deligianni ,  Fei Liu

IPC分类号： H01M10/46 ,  H01M10/44 ,  H01M16/00 ,  H02J7/35 ,  G06F17/50

CPC分类号： H01M10/39 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5081 ,  H01L31/022458 ,  H01L31/053 ,  H01L31/068 ,  H01M10/465 ,  H01M14/005 ,  H01M16/00 ,  H01M16/006 ,  H02J7/35 ,  H02S40/38 ,  Y02E10/547 ,  Y10T156/10 ,  Y10T307/50

摘要： An integrated photovoltaic cell and battery device, a method of manufacturing the same and a photovoltaic power system incorporating the integrated photovoltaic cell and battery device. The integrated photovoltaic cell and battery device includes a photovoltaic cell, a battery, and interconnects providing three-dimensional integration of the photovoltaic cell and the battery into an integrated device for capturing and storing solar energy. Also provided is a design structure readable by a machine to simulate, design, or manufacture the above integrated photovoltaic cell and battery device.

摘要翻译： 集成光伏电池和电池装置，其制造方法以及并入有集成光伏电池和电池装置的光伏发电系统。 集成光伏电池和电池装置包括光伏电池，电池和将光伏电池和电池三维集成在一起的用于捕获和存储太阳能的集成装置的互连。 还提供了用于模拟，设计或制造上述集成光伏电池和电池装置的机器可读的设计结构。

公开(公告)号：US20140000712A1

公开(公告)日：2014-01-02

申请号：US13534519

申请日：2012-06-27

申请人： Qing Cao ,  Zhengwen Li ,  Fei Liu ,  Zhen Zhang

发明人： Qing Cao ,  Zhengwen Li ,  Fei Liu ,  Zhen Zhang

IPC分类号： H01L31/0264 ,  H01L31/18

CPC分类号： H01L31/02167 ,  H01L31/022425 ,  H01L31/022441 ,  H01L31/022475 ,  H01L31/0296 ,  H01L31/0322 ,  H01L31/0326 ,  H01L31/0749 ,  Y02E10/541 ,  Y02P70/521

摘要： A method of forming a photovoltaic device includes forming a thermal stress relieving layer on top of a substrate and forming a sacrificial back electrode metal layer on the thermal stress relieving layer. A semiconductor photon absorber layer is formed on the sacrificial back electrode metal layer, and the absorber layer is reacted with substantially an entire thickness of the sacrificial back electrode metal layer, thereby forming a back ohmic contact comprising a metallic compound of the sacrificial back electrode metal layer and the absorber layer, in combination with the thermal stress relieving layer.

摘要翻译： 形成光伏器件的方法包括在衬底的顶部形成热应力消除层，并在热应力消除层上形成牺牲背电极金属层。 在牺牲背电极金属层上形成半导体光子吸收层，吸收层与牺牲背极金属层的大致整个厚度反应，形成包含牺牲背电极金属的金属化合物的反欧姆接触 层和吸收层，与热应力消除层组合。