公开(公告)号：US07781900B2

公开(公告)日：2010-08-24

申请号：US11630930

申请日：2005-06-09

申请人： Manuel Carmona ,  Anton Legen ,  Ingo Wennemuth

发明人： Manuel Carmona ,  Anton Legen ,  Ingo Wennemuth

IPC分类号： H01L23/29 ,  H01L23/28

CPC分类号： H01L23/427 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/00

摘要： One aspect of the invention relates to a semiconductor device including a housing and a semiconductor chip partly embedded in a plastic housing composition. Another aspect relates to a method for producing the same. The plastic housing composition has at least one host component having a softening temperature and an incorporated component having a phase change temperature. In this case, the softening temperature of the host component is greater than the phase change temperature of the incorporated component.

摘要翻译： 本发明的一个方面涉及一种半导体器件，其包括壳体和部分地嵌入在塑料外壳组合物中的半导体芯片。 另一方面涉及其制造方法。 塑料外壳组合物具有至少一种具有软化温度的主体组分和具有相变温度的掺入组分。 在这种情况下，主体成分的软化温度大于引入成分的相变温度。

公开(公告)号：US20080230910A1

公开(公告)日：2008-09-25

申请号：US12054126

申请日：2008-03-24

申请人： Minka Gospodinova-Daltcheva ,  Ingo Wennemuth ,  Hayri Burak Goekgoez

发明人： Minka Gospodinova-Daltcheva ,  Ingo Wennemuth ,  Hayri Burak Goekgoez

IPC分类号： H01L23/52 ,  H01L21/4763 ,  H01L21/44

CPC分类号： H01L23/5389 ,  H01L23/60 ,  H01L24/05 ,  H01L24/48 ,  H01L27/0251 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K3/4664 ,  H05K3/4685 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： An integrated circuit provides a carrier substrate, a wiring level above a carrier substrate, wherein the wiring level comprises a first conductor track composed of a first conductive material and a second conductor track composed of the first conductive material, an insulating layer above the wiring level, wherein the insulating layer comprises a first opening in a region of the first conductor track of the wiring level and a second opening in a region of the second conductor track of the wiring level and a contact bridge composed of a second conductive material, wherein the contact bridge is connected to the first conductor track in a region of the first opening and is connected to the second conductor track in a region of the second opening.

摘要翻译： 集成电路提供载体衬底，载体衬底上的布线层，其中布线层包括由第一导电材料构成的第一导体轨道和由第一导电材料构成的第二导体轨道，布线层上方的绝缘层 ，其中所述绝缘层包括布线层的第一导体轨道的区域中的第一开口和布线层的第二导体轨道的区域中的第二开口和由第二导电材料构成的接触桥，其中， 接触桥在第一开口的区域中连接到第一导体轨道，并且在第二开口的区域中连接到第二导体轨道。

公开(公告)号：US20080111231A1

公开(公告)日：2008-05-15

申请号：US11630930

申请日：2005-06-09

申请人： Manuel Carmona ,  Anton Legen ,  Ingo Wennemuth

发明人： Manuel Carmona ,  Anton Legen ,  Ingo Wennemuth

IPC分类号： H01L23/14 ,  H01L21/02

CPC分类号： H01L23/427 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/00

摘要： One aspect of the invention relates to a semiconductor device including a housing and a semiconductor chip partly embedded in a plastic housing composition. Another aspect relates to a method for producing the same. The plastic housing composition has at least one host component having a softening temperature and an incorporated component having a phase change temperature. In this case, the softening temperature of the host component is greater than the phase change temperature of the incorporated component.

摘要翻译： 本发明的一个方面涉及一种半导体器件，其包括壳体和部分地嵌入在塑料外壳组合物中的半导体芯片。 另一方面涉及其制造方法。 塑料外壳组合物具有至少一种具有软化温度的主体组分和具有相变温度的掺入组分。 在这种情况下，主体成分的软化温度大于引入成分的相变温度。

公开(公告)号：US07253514B2

公开(公告)日：2007-08-07

申请号：US11038574

申请日：2005-01-21

申请人： Anton Legen ,  Jochen Thomas ,  Ingo Wennemuth

发明人： Anton Legen ,  Jochen Thomas ,  Ingo Wennemuth

IPC分类号： H01L23/48 ,  H01L25/065 ,  H01L23/50 ,  H01L23/52 ,  H01R12/02

CPC分类号： H01L24/10 ,  H01L23/495 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00

摘要： A connecting element for electrically connecting a semiconductor chip and a superordinate circuit board includes an elastic metal strip that is bent forming two metal limbs with flattened limb ends, thus forming a base between the metal limbs which is suitable for contacting and providing electrical connectivity to a plurality of contact pads of a superordinate circuit board. At least one of the two limb ends is electrically connected to the contact areas of a semiconductor chip, while the other limb end is elastically supported on the top side of the semiconductor chip, thereby enabling the connecting element to be self supporting.

摘要翻译： 用于电连接半导体芯片和上级电路板的连接元件包括弹性金属条，其弯曲形成具有扁平的端部的两个金属片，从而在金属片之间形成底座，金属片适于接触并提供与 多个上位电路板的接触焊盘。 两个肢端中的至少一个电连接到半导体芯片的接触区域，而另一个肢端部弹性地支撑在半导体芯片的顶侧，从而使得连接元件能够自支撑。

公开(公告)号：US20060244120A1

公开(公告)日：2006-11-02

申请号：US11362507

申请日：2006-02-27

申请人： Minka Gospodinova-Daltcheva ,  Harry Huebert ,  Rajesh Subraya ,  Jochen Thomas ,  Ingo Wennemuth

发明人： Minka Gospodinova-Daltcheva ,  Harry Huebert ,  Rajesh Subraya ,  Jochen Thomas ,  Ingo Wennemuth

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A semiconductor device includes a plastic package, at least one semiconductor chip and a rewiring level. The rewiring level includes an insulating layer and a rewiring layer. The rewiring layer includes either signal conductor paths and ground or supply conductor paths arranged parallel to one another and alternately, or only signal conductor paths arranged parallel to one another. In the latter case, an electrically conducting layer of metal which can be connected to ground or supply potential is additionally provided as a termination of the rewiring level or in the form of a covering layer.

摘要翻译： 半导体器件包括塑料封装，至少一个半导体芯片和重新布线层。 重新布线层包括绝缘层和重新布线层。 重新布线层包括彼此平行布置的信号导体路径和接地或供电导体路径，并且交替地或者仅包括彼此平行布置的信号导体路径。 在后一种情况下，另外提供可连接到接地或供电电位的导电金属层作为重新布线层的终端或覆盖层的形式。

公开(公告)号：US06872594B2

公开(公告)日：2005-03-29

申请号：US10663200

申请日：2003-09-16

申请人： Uta Gebauer ,  Ingo Wennemuth

发明人： Uta Gebauer ,  Ingo Wennemuth

IPC分类号： H01L21/768 ,  H01L23/48 ,  H01L25/065 ,  H01L21/44

CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/0002 ,  H01L2924/00

摘要： The electronic component has semiconductor chips that are stacked on one another. On their active top sides, the chips having interconnects for rewiring to contact areas through contacts formed on the sawn edges of the semiconductor chip. The electronic components of overlying and underlying semiconductor chips are thus connected to one another via the through contacts.

摘要翻译： 电子部件具有彼此堆叠的半导体芯片。 在其有源顶侧上，芯片具有互连件，用于通过形成在半导体芯片的锯切边缘上的触点重新布线到接触区域。 覆盖和下层半导体芯片的电子元件因此通过通孔相互连接。

公开(公告)号：US06703651B2

公开(公告)日：2004-03-09

申请号：US09948261

申请日：2001-09-06

申请人： Andreas Wörz ,  Ingo Wennemuth

发明人： Andreas Wörz ,  Ingo Wennemuth

IPC分类号： H01L23538

CPC分类号： H01L25/0657 ,  H01L2224/48091 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2924/00014

摘要： An electronic device having stacked modules and method for producing it are described. Each module has a chip. Each chip is mounted on a stack intermediate plane. The stack intermediate planes of a stack have identical layouts, while chip select circuits which can be set irreversibly via contact areas are disposed on the chips, which chip select circuits enable an irreversible assignment of the contact areas to the stack intermediate planes.

摘要翻译： 描述具有堆叠模块的电子设备及其制造方法。 每个模块都有一个芯片。 每个芯片安装在堆叠中间平面上。 堆叠的堆叠中间平面具有相同的布局，而可以通过接触区域不可逆地设置的片选电路设置在芯片上，该芯片选择电路使接触区域不可逆地分配给堆叠中间平面。