公开(公告)号：US09704234B2

公开(公告)日：2017-07-11

申请号：US14450170

申请日：2014-08-01

Applicant: KLA-Tencor Corporation

Inventor： Junqing Huang ,  Hucheng Lee ,  Kenong Wu ,  Lisheng Gao

IPC: G06T7/00 ,  G06T7/90

CPC classification number: G06T7/0008 ,  G06T7/0006 ,  G06T7/90 ,  G06T2207/10024 ,  G06T2207/20024 ,  G06T2207/20076 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing the outliers to the pixels surrounding the outliers to identify the outliers that do not belong to a cluster of outliers as defect candidates. The method also includes determining a value for a difference in color between the pixels of the defect candidates and the pixels surrounding the defect candidates. The method further includes identifying the defect candidates that have a value for the difference in color greater than or equal to a predetermined value as nuisance defects and the defect candidates that have a value for the difference in color less than the predetermined value as real defects.

公开(公告)号：US20170191948A1

公开(公告)日：2017-07-06

申请号：US15391753

申请日：2016-12-27

Applicant: KLA-Tencor Corporation

Inventor： Lisheng Gao ,  Tao Luo ,  Keith Wells ,  Xiaochun Li

IPC: G01N21/956 ,  G06T7/00 ,  G01N21/95

CPC classification number: G01N21/95607 ,  G01N21/9501 ,  G01N2201/12 ,  G06T7/001 ,  G06T2207/20084 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by an optical inspection subsystem for the design printed on the wafer. Generating the rendered image includes one or more steps, and the computer subsystem(s) are configured for performing at least one of the one or more steps by executing a generative model. The computer subsystem(s)) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.

公开(公告)号：US20160275672A1

公开(公告)日：2016-09-22

申请号：US15073617

申请日：2016-03-17

Applicant: KLA-Tencor Corporation

Inventor： Santosh Bhattacharyya ,  Pavan Kumar ,  Lisheng Gao ,  Thirupurasundari Jayaraman ,  Raghav Babulnath ,  Srikanth Kandukuri ,  Gangadharan Sivaraman ,  Karthikeyan Subramanian ,  Raghavan Konuru ,  Rahul Lakhawat

IPC: G06T7/00

CPC classification number: G06T7/33 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. In general, some embodiments described herein are configured for substantially accurately aligning inspection subsystem output generated for a specimen to a design for the specimen despite deformation of the design in the inspection subsystem output. In addition, some embodiments are configured for generating and/or using alignment targets that can be shared across multiple specimens of the same layer and design rule for alignment of inspection subsystem output generated for a specimen to a design for the specimen.

Abstract translation: 提供了用于确定由检查子系统在设计数据空间中产生的输出位置的方法和系统。 通常，这里描述的一些实施例被配置成用于将检测子系统产生的样品基本上精确地对准于试样的设计，尽管检查子系统输出中的设计变形。 此外，一些实施例被配置用于生成和/或使用可以在同一层的多个样本上共享的对准目标和用于将为样本生成的检查子系统输出对准样本的设计规则的设计规则。

公开(公告)号：US09442077B2

公开(公告)日：2016-09-13

申请号：US14468237

申请日：2014-08-25

Applicant: KLA-Tencor Corporation

Inventor： Junqing Huang ,  Huan Jin ,  Grace Hsiu-Ling Chen ,  Lisheng Gao

IPC: G06K9/62 ,  G01N21/95 ,  G06T5/00

CPC classification number: G01N21/9501 ,  G06T5/002 ,  G06T2207/20061 ,  G06T2207/30148

Abstract: Methods and systems for filtering scratches from wafer inspection results are provided. One method includes generating a defect candidate map that includes image data for potential defect candidates as a function of position on the wafer and removing noise from the defect candidate map to generate a filtered defect candidate map. The method also includes determining one or more characteristics of the potential defect candidates based on portions of the filtered defect candidate map corresponding to the potential defect candidates. In addition, the method includes determining if each of the potential defect candidates are scratches based on the one or more characteristics determined for each of the potential defect candidates and separating the potential defect candidates determined to be the scratches from other defects in inspection results for the wafer.

Abstract translation: 提供了从晶片检查结果过滤划痕的方法和系统。 一种方法包括生成缺陷候选图，其包括作为晶片上的位置的函数的潜在缺陷候选的图像数据，并且从缺陷候选图中去除噪声以生成滤波的缺陷候选图。 该方法还包括基于与潜在缺陷候选对应的经滤波的缺陷候选映射的部分来确定潜在缺陷候选的一个或多个特性。 此外，该方法包括基于为每个潜在缺陷候选确定的一个或多个特性确定每个潜在的缺陷候选是否划伤，并且将确定为划痕的潜在缺陷候选与检查结果中的其他缺陷分离为 晶圆。

公开(公告)号：US20160225138A1

公开(公告)日：2016-08-04

申请号：US15092510

申请日：2016-04-06

Applicant: KLA-Tencor Corporation

Inventor： Satya Kurada ,  Raghav Babulnath ,  Kwok Ng ,  Lisheng Gao

IPC: G06T7/00 ,  G01N21/956 ,  G01N21/95

CPC classification number: G06T7/0006 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/95676 ,  G01N2201/06113 ,  G01N2201/068 ,  G01N2201/10 ,  G01N2201/12 ,  G06K9/00 ,  G06K9/66 ,  G06T7/0008 ,  G06T7/001 ,  G06T2207/20081 ,  G06T2207/30148

Abstract: Methods and systems for design based sampling and binning for yield critical defects are provided. One method includes aligning each image patch in each inspection image frame generated for a wafer by an optical subsystem of an inspection system to design information for the wafer. The method also includes deriving multiple layer design attributes at locations of defects detected in the image patches. In addition, the method includes building a decision tree with the multiple layer design attributes. The decision tree is used to separate the defects into bins with different yield impacts on a device being formed on the wafer. The method also includes binning the defects with the decision tree.

Abstract translation: 提供了用于产量关键缺陷的基于设计的抽样和装箱的方法和系统。 一种方法包括通过检查系统的光学子系统对于为晶片生成的每个检查图像帧中的每个图像补片进行对准以设计晶片的信息。 该方法还包括在图像斑块中检测到的缺陷位置导出多层设计属性。 另外，该方法包括使用多层设计属性构建决策树。 决策树用于将缺陷分离成对晶片上形成的器件产生不同产量的影响。 该方法还包括使用决策树将缺陷合并。

公开(公告)号：US20160188784A1

公开(公告)日：2016-06-30

申请号：US14983452

申请日：2015-12-29

Applicant: KLA-Tencor Corporation

Inventor： Santosh Bhattacharyya ,  Bjoern Braeuer ,  Lisheng Gao

IPC: G06F17/50

CPC classification number: G06F17/5081 ,  G03F7/70616

Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. One method includes selecting one or more alignment targets from a design for a specimen. At least a portion of the one or more alignment targets include built in targets included in the design for a purpose other than alignment of inspection results to design data space. At least the portion of the one or more alignment targets does not include one or more individual device features. One or more images for the alignment target(s) and output generated by the inspection subsystem at the position(s) of the alignment target(s) may then be used to determine design data space positions of other output generated by the inspection subsystem in a variety of ways described herein.

Abstract translation: 提供了用于确定由检查子系统在设计数据空间中产生的输出位置的方法和系统。 一种方法包括从样本的设计中选择一个或多个对准目标。 一个或多个对准目标的至少一部分包括设计中包括的内置目标，用于除了检查结果对齐以设计数据空间之外的目的。 至少一个或多个对准目标的部分不包括一个或多个单独的装置特征。 然后可以使用用于对准目标的一个或多个图像和由检查子系统在对准目标的位置产生的输出来确定由检查子系统生成的其他输出的设计数据空间位置 本文描述的各种方式。

公开(公告)号：US20160104600A1

公开(公告)日：2016-04-14

申请号：US14880187

申请日：2015-10-09

Applicant: KLA-Tencor Corporation

Inventor： Qing Luo ,  Kenong Wu ,  Hucheng Lee ,  Lisheng Gao ,  Eugene Shifrin ,  Yan Xiong ,  Shuo Sun

IPC: H01J37/28

CPC classification number: G05B19/401 ,  G05B2219/37365 ,  G05B2219/37571 ,  H01J2237/221 ,  H01J2237/2817 ,  H01L22/12 ,  H01L22/20

Abstract: Systems and methods for detecting defects on a specimen based on structural information are provided. One system includes one or more computer subsystems configured for separating the output generated by a detector of an inspection subsystem in an array area on a specimen into at least first and second segments of the output based on characteristic(s) of structure(s) in the array area such that the output in different segments has been generated in different locations in the array area in which the structure(s) having different values of the characteristic(s) are formed. The computer subsystem(s) are also configured for detecting defects on the specimen by applying one or more defect detection methods to the output based on whether the output is in the first segment or the second segment.

Abstract translation: 提供了基于结构信息检测样本上的缺陷的系统和方法。 一个系统包括一个或多个计算机子系统，其被配置为基于检测子系统的检测器产生的输出，以将样本上的阵列区域中的输出的至少第一和第二段基于 阵列区域使得不同段中的输出已经在其中形成具有不同特征值的结构的阵列区域中的不同位置中生成。 计算机子系统还被配置为基于输出是在第一段还是第二段中，通过向输出应用一个或多个缺陷检测方法来检测样本上的缺陷。

公开(公告)号：US09189844B2

公开(公告)日：2015-11-17

申请号：US13652377

申请日：2012-10-15

Applicant: KLA-Tencor Corporation

Inventor： Kenong Wu ,  Meng-Che Wu ,  Lisheng Gao

IPC: G06K9/00 ,  G06T7/00 ,  G01N21/95

CPC classification number: G06T7/001 ,  G01N21/9501 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer using defect-specific information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest formed on the wafer and a known DOI occurring proximate to or in the pattern of interest. The information includes an image of the target on the wafer. The method also includes searching for target candidates on the wafer or another wafer. The target candidates include the pattern of interest. The target and target candidate locations are provided to defect detection. In addition, the method includes detecting the known DOI in the target candidates by identifying potential DOI locations in images of the target candidates and applying one or more detection parameters to images of the potential DOI locations.

Abstract translation: 提供了使用缺陷特定信息检测晶片上的缺陷的方法和系统。 一种方法包括获取晶片上目标的信息。 目标包括在晶片上形成的感兴趣图案，以及在感兴趣的图案附近或其中出现的已知DOI。 信息包括晶片上的目标图像。 该方法还包括在晶片或另一晶片上搜索目标候选。 目标候选人包括兴趣模式。 将目标候选位置和目标候选位置提供给缺陷检测。 此外，该方法包括通过识别目标候选图像中的潜在DOI位置并将一个或多个检测参数应用于潜在DOI位置的图像来检测目标候选中的已知DOI。

公开(公告)号：US09092846B2

公开(公告)日：2015-07-28

申请号：US14169161

申请日：2014-01-31

Applicant: KLA-Tencor Corporation

Inventor： Kenong Wu ,  Lisheng Gao ,  Grace Hsiu-Ling Chen ,  David W. Shortt

IPC: G06K9/00 ,  G06T7/00 ,  G01N21/95 ,  H01L21/66

CPC classification number: G06T7/0008 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/8822 ,  G01N2021/8848 ,  G06T7/001 ,  G06T2207/30148 ,  H01L22/12 ,  H01L22/34

Abstract: Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different.

Abstract translation: 提供了使用缺陷特定和多信道信息检测晶片上的缺陷的方法和系统。 一种方法包括获取晶片上目标的信息。 目标包括形成在晶片上的感兴趣模式（POI）和在POI附近或在POI中出现的已知感兴趣缺陷（DOI）。 该方法还包括通过基于由检查系统的第一通道获取的目标候选者的图像来识别潜在的DOI位置来检测目标候选中的已知DOI，并将一个或多个检测参数应用于由第二个所获取的潜在DOI位置的图像 检查系统通道。 因此，用于定位潜在DOI位置的图像和用于检测缺陷的图像可以不同。

公开(公告)号：US20150015874A1

公开(公告)日：2015-01-15

申请号：US14381315

申请日：2013-03-01

Applicant: KLA-Tencor Corporation

Inventor： Grace H. Chen ,  Rudolf Brunner ,  Lisheng Gao ,  Robert M. Danen ,  Lu Chen

IPC: G01N21/88

CPC classification number: G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95623 ,  G01N2021/8822 ,  G01N2021/95676 ,  G01N2201/061 ,  G01N2201/0638 ,  G01N2201/068 ,  G01N2201/12

Abstract: In an optical inspection tool, an illumination aperture is opened at each of a plurality of aperture positions of an illumination pupil area one at a time across the illumination pupil area. For each aperture opening position, an incident beam is directed towards the illumination pupil area so as to selectively pass a corresponding ray bundle of the illumination beam at a corresponding set of one or more incident angles towards the sample and an output beam, which is emitted from the sample in response to the corresponding ray bundle of the incident beam impinging on the sample at the corresponding set of one or more incident angles, is detected. A defect detection characteristic for each aperture position is determined based on the output beam detected for each aperture position. An optimum aperture configuration is determined based on the determined defect detection characteristic for each aperture position.

Abstract translation: 在光学检查工具中，照明光圈在照明光瞳区域的多个孔径位置中的每一个处打开，一次一个地穿过照明瞳孔区域。 对于每个光圈打开位置，入射光束被引向照明光瞳区域，以便选择性地将照射光束的相应光束束以对应于一个或多个入射角的一组对应于样品的输出光束和输出光束 检测来自样品的响应于在相应的一个或多个入射角度的入射光束入射到样品上的相应射线束。 基于针对每个孔径位置检测的输出光束来确定每个光圈位置的缺陷检测特性。 基于针对每个孔位置确定的缺陷检测特性来确定最佳孔径配置。