公开(公告)号：US20060099892A1

公开(公告)日：2006-05-11

申请号：US11312571

申请日：2005-12-21

申请人： Tetsuji Togawa ,  Osamu Nabeya ,  Makoto Fukushima ,  Kunihiko Sakurai ,  Hiroshi Yoshida ,  Teruhiko Ichimura

发明人： Tetsuji Togawa ,  Osamu Nabeya ,  Makoto Fukushima ,  Kunihiko Sakurai ,  Hiroshi Yoshida ,  Teruhiko Ichimura

IPC分类号： B24B47/00 ,  B24B29/00

CPC分类号： B24B37/30 ,  B24B41/061 ,  B24B49/105

摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.

公开(公告)号：US20060084369A1

公开(公告)日：2006-04-20

申请号：US11294365

申请日：2005-12-06

申请人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

发明人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

IPC分类号： B24B1/00

CPC分类号： B24B37/345 ,  B08B1/04 ,  B08B15/02 ,  B24B27/0023 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67219

摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

摘要翻译： 用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台 安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。 抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

公开(公告)号：US06953390B2

公开(公告)日：2005-10-11

申请号：US10342253

申请日：2003-01-15

申请人： Kunihiko Sakurai ,  Hiroshi Yoshida ,  Tetsuji Togawa

发明人： Kunihiko Sakurai ,  Hiroshi Yoshida ,  Tetsuji Togawa

IPC分类号： B08B3/10 ,  B08B3/12 ,  B24B53/007 ,  B24B53/013 ,  B24B53/017 ,  B24B53/02 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B53/017 ,  B08B1/007 ,  B08B3/102 ,  B08B3/12 ,  B24B53/013 ,  B24B53/02

摘要： A polishing surface is conditioned by pressing a diamond dresser against the polishing surface to thinly shave a surface of the polishing surface. Foreign matter clogging concavities formed in the polishing surface is scraped by pressing a brush dresser against the polishing surface in a state such that a polishing liquid is not supplied to the polishing table. A liquid composed of a mixture of a liquid or inert gas with pure water or a chemical liquid is ejected onto the polishing surface to clean the polishing surface.

摘要翻译： 通过将金刚石修整器压靠在抛光表面上以对剃磨表面的表面进行稀薄剃刮来调节抛光表面。 在不将研磨液供给到研磨台的状态下，通过将刷式修整器压靠在研磨面上来刮去在研磨面上形成的异物堵塞凹部。 将由液体或惰性气体与纯水或化学液体的混合物组成的液体喷射到抛光表面上以清洁抛光表面。

公开(公告)号：US06828225B2

公开(公告)日：2004-12-07

申请号：US10787218

申请日：2004-02-27

申请人： Fumio Kondo ,  Koji Mishima ,  Akira Tanaka ,  Yoko Suzuki ,  Tetsuji Togawa ,  Hiroaki Inoue

发明人： Fumio Kondo ,  Koji Mishima ,  Akira Tanaka ,  Yoko Suzuki ,  Tetsuji Togawa ,  Hiroaki Inoue

IPC分类号： H01L214763

CPC分类号： H01L21/67161 ,  B24B37/005 ,  B24B37/042 ,  B24B37/245 ,  B24B37/345 ,  B24B41/061 ,  B24B49/16 ,  C23C18/1632 ,  C23C18/1653 ,  C25D7/123 ,  H01L21/02074 ,  H01L21/02087 ,  H01L21/0209 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67219 ,  H01L21/6723 ,  H01L21/67393 ,  H01L21/67396 ,  H01L21/67772 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76849 ,  H01L21/76864 ,  H01L21/76873 ,  H01L21/76874 ,  H01L21/76877

摘要： A substrate procesing method comprising steps for forming a copper film on a surface of a substrate. These steps includes the step of filling a first metal in the trenches so as to form a plated film of the first metal on an entire surface of the substrate by electroplating, wherein the electromagnetic field is adjusted by the virtual anode so that differences of thickness of the plated film between the central portion and the peripheral portion of the substrate being minimized, and polishing and removing the plated film by pressing the substrate to the polishing surface, wherein the pressures pressing the substrate to the polishing surface at a central portion and a peripheral portion are adjusted.

摘要翻译： 一种基板处理方法，包括在基板的表面上形成铜膜的步骤。 这些步骤包括在沟槽中填充第一金属以便通过电镀在基板的整个表面上形成第一金属的镀膜的步骤，其中电磁场由虚拟阳极调节，使得厚度差异 基板的中心部分和周边部分之间的镀膜最小化，并且通过将基板压在研磨表面上来研磨和去除镀膜，其中将基板压在抛光表面的压力在中心部分和周边 部分进行调整。

公开(公告)号：US06790763B2

公开(公告)日：2004-09-14

申请号：US10182835

申请日：2002-10-11

申请人： Fumio Kondo ,  Koji Mishima ,  Akira Tanaka ,  Yoko Suzuki ,  Tetsuji Togawa ,  Hiroaki Inoue

发明人： Fumio Kondo ,  Koji Mishima ,  Akira Tanaka ,  Yoko Suzuki ,  Tetsuji Togawa ,  Hiroaki Inoue

IPC分类号： H01L214763

CPC分类号： H01L21/67161 ,  B24B37/005 ,  B24B37/042 ,  B24B37/245 ,  B24B37/345 ,  B24B41/061 ,  B24B49/16 ,  C23C18/1632 ,  C23C18/1653 ,  C25D7/123 ,  H01L21/02074 ,  H01L21/02087 ,  H01L21/0209 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67219 ,  H01L21/6723 ,  H01L21/67393 ,  H01L21/67396 ,  H01L21/67772 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76849 ,  H01L21/76864 ,  H01L21/76873 ,  H01L21/76874 ,  H01L21/76877

摘要： A substrate processing method comprising steps for forming a copper film on a surface of a substrate. These steps includes the step of filling a first metal in the trenches so as to form a plated film of the first metal on an entire surface of the substrate by electroplating, wherein the electromagnetic field is adjusted by the virtual anode so that differences of thickness of the plated film between the central portion and the peripheral portion of the substrate being minimized, and polishing and removing the plated film by pressing the substrate to the polishing surface, wherein the pressures pressing the substrate to the polishing surface at a central portion and a peripheral portion are adjusted.

公开(公告)号：US06447385B1

公开(公告)日：2002-09-10

申请号：US09605989

申请日：2000-06-29

申请人： Tetsuji Togawa ,  Nobuyuki Takada

发明人： Tetsuji Togawa ,  Nobuyuki Takada

IPC分类号： B24B500

CPC分类号： B24B37/345

摘要： A polishing apparatus applicable to a dry-in/dry-out polishing system is capable of increasing the capacity of processing substrates to be polished, e.g. semiconductor wafers, per unit of time and per unit area of installation. A polishing unit includes a turntable having a polishing surface, and at least two wafer carriers each adapted to hold a wafer and to press the wafer against the polishing surface. Each wafer carrier is supported by a pivot shaft and movable between a polishing position where the wafer is polished on the turntable and a transfer position for transferring the wafer. The at least two wafer carriers can be situated at the polishing position simultaneously and also alternately.

摘要翻译： 适用于干式/干式抛光系统的抛光装置能够增加处理待抛光衬底的能力，例如， 半导体晶片，每单位时间和每单位安装面积。 抛光单元包括具有抛光表面的转盘和至少两个晶片载体，每个晶片载体适于保持晶片并将晶片压靠在抛光表面上。 每个晶片载体由枢转轴支撑，并且可在转盘上抛光晶片的抛光位置和用于转移晶片的转移位置之间移动。 至少两个晶片载体可以同时并且交替地位于抛光位置。

公开(公告)号：US06409582B1

公开(公告)日：2002-06-25

申请号：US09531589

申请日：2000-03-20

申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Shunichiro Kojima ,  Toyomi Nishi

发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Shunichiro Kojima ,  Toyomi Nishi

IPC分类号： B24B722

CPC分类号： B24B37/345 ,  B08B3/02 ,  B24B41/005 ,  H01L21/67051

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus, includes a turntable having a polishing surface thereon, and a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable. A pusher is disposed in a position for transferring the workpiece to and from the top ring, and has a workpiece support which can be lifted to a position close to the top ring for transferring the workpiece to and from the top ring. When the workpiece support receives a polished workpiece and is lowered, a cleaning liquid is ejected substantially simultaneously from three cleaning nozzle units that are disposed in respective three positions to clean the upper and lower surfaces of the workpiece and the lower surface of the top ring.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括其上具有抛光表面的转台和用于保持要抛光的工件的顶环，并将工件压靠在转盘上的抛光表面上。 推动器设置在用于将工件传递到顶环的位置并且具有可以被提升到靠近顶环的位置的工件支撑件，用于将工件传送到顶环和从顶环移出。 当工件支撑件接收到抛光的工件并且被降低时，基本上同时从设置在三个位置的清洁喷嘴单元喷射清洁液体，以清洁工件的上表面和下表面以及顶环的下表面。

公开(公告)号：US06338669B1

公开(公告)日：2002-01-15

申请号：US09509997

申请日：2000-06-15

申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi

发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi

IPC分类号： B24B100

CPC分类号： B24B57/02 ,  B24B37/04

摘要： This invention relates to a polishing machine for polishing an article such as a semiconductor wafer. A movable arm is located at a liquid supply position for supplying a liquid such as a polishing liquid onto a polishing surface of a turntable. The arm is also adapted to be moved to and held at a retracted position radially outside the polishing surface. At the liquid supply position, liquid supply nozzles supported on the arm are brought into a condition such that the nozzles are close to a position on the polishing surface where the liquid is to be supplied, whereby the liquid is accurately supplied onto the position. Holding the arm at the retracted position makes it easy to conduct a maintenance work for the polishing surface and so on.

摘要翻译： 本发明涉及一种用于抛光诸如半导体晶片的物品的抛光机。 可移动臂位于用于将诸如抛光液体的液体供应到转台的抛光表面上的液体供应位置。 臂也适于被移动并保持在抛光表面的径向外侧的缩回位置。 在液体供给位置，支撑在臂上的液体供给喷嘴处于这样的状态，使得喷嘴靠近要供应液体的抛光表面上的位置，从而将液体精确地供应到该位置。 将臂保持在缩回位置使得易于进行抛光表面的维护工作等。

公开(公告)号：US06319105B1

公开(公告)日：2001-11-20

申请号：US09327650

申请日：1999-06-08

申请人： Tetsuji Togawa ,  Takeshi Sakurai ,  Nobuyuki Takada

发明人： Tetsuji Togawa ,  Takeshi Sakurai ,  Nobuyuki Takada

IPC分类号： B24B2900

CPC分类号： B24B53/017 ,  H01L21/67051

摘要： A polishing apparatus includes a cleaning device for critical cleaning of a top ring or a dressing tool to obtain high quality polishing by minimizing surface damage caused by contaminants originating from the top ring and/or dressing tool. The polishing apparatus includes a polishing table; a workpiece holding member for pressing a workpiece onto the polishing table; a dressing tool for conditioning a work surface provided on the polishing table. A cleaning device is provided for cleaning the dressing tool and/or the workpiece holding member. The cleaning device is provided with a spray nozzle for directing a cleaning solution toward at least an upper surface of the workpiece holding member or the dressing tool.

摘要翻译： 抛光装置包括清洁装置，用于通过最小化由顶环和/或修整工具产生的污染物引起的表面损伤来对顶环或修整工具进行临界清洁以获得高质量的抛光。 抛光装置包括：抛光台; 工件保持构件，用于将工件压在抛光台上; 用于调节设置在抛光台上的工作表面的修整工具。 提供了用于清洁修整工具和/或工件保持构件的清洁装置。 清洁装置设置有用于将清洁溶液引导至至少工件保持构件或修整工具的上表面的喷嘴。

公开(公告)号：US06312312B1

公开(公告)日：2001-11-06

申请号：US09175561

申请日：1998-10-20

申请人： Tetsuji Togawa ,  Nobuyuki Takada ,  Seiji Katsuoka ,  Hiroyuki Osawa

发明人： Tetsuji Togawa ,  Nobuyuki Takada ,  Seiji Katsuoka ,  Hiroyuki Osawa

IPC分类号： B24B722

CPC分类号： B24B37/345 ,  B23Q7/06 ,  B24B37/04

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface, a top ring for supporting the workpiece to be polished and pressing the workpiece against the polishing surface, and a transferring device for transferring the workpiece between the top ring and the transferring device. The transferring device includes a stage having a support surface for supporting the workpiece, an actuating unit for moving the stage in a vertical direction, and a guide member disposed radially outwardly of the stage and having a guide surface of an inverted conical shape. The centering of the workpiece is conducted by bringing a periphery of the workpiece into contact with the guide surface, and then the workpiece is transferred from the transferring device to the top ring by raising the stage.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括具有研磨面的转台，用于支撑待研磨的工件的顶环，将工件压靠在研磨面上，以及用于在顶环和转印装置之间传递工件的转印装置。 转印装置包括具有用于支撑工件的支撑表面的台，用于沿垂直方向移动台的致动单元和设置在该台的径向外侧并具有倒圆锥形形状的引导表面的引导构件。 通过使工件的周边与引导面接触来进行工件的定心，然后通过升高工作台将工件从传送装置传送到顶环。