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    Software development apparatus and method
    24.
    发明申请
    Software development apparatus and method 有权
    软件开发设备及方法

    公开(公告)号：US20080010493A1

    公开(公告)日：2008-01-10

    申请号：US11822728

    申请日：2007-07-09

    申请人： Manabu Watanabe ,  Yutaka Nakano ,  Kenji Ueda ,  Mitsuharu Kurashige ,  Yasushi Hasegawa ,  Hiroyuki Morozumi ,  Sueki Itoyama

    发明人： Manabu Watanabe ,  Yutaka Nakano ,  Kenji Ueda ,  Mitsuharu Kurashige ,  Yasushi Hasegawa ,  Hiroyuki Morozumi ,  Sueki Itoyama

    IPC分类号： G06F11/00

    CPC分类号： G06F11/3664

    摘要： A software development apparatus capable of mitigating troublesomeness involved in the development of software to be executed by a multi-core processor. A processor core identifier identifies one of processor cores with which software development information (project information, program development support information, debugging information, etc.) for developing software is associated. In accordance with the identification result, a display processor displays the association between the software development information and the corresponding processor core in a visually distinguishable manner.

    摘要翻译： 一种软件开发装置，其能够减轻由多核处理器执行的软件开发涉及的麻烦。 处理器核心标识符识别用于开发软件的软件开发信息（项目信息，程序开发支持信息，调试信息等）相关联的处理器核心之一。 根据识别结果，显示处理器以视觉上可区别的方式显示软件开发信息和对应的处理器核心之间的关联。

    Magnetically coupled device and electronic equipment employing same
    25.
    发明申请
    Magnetically coupled device and electronic equipment employing same 失效
    磁耦合器件和采用其的电子设备

    公开(公告)号：US20050036265A1

    公开(公告)日：2005-02-17

    申请号：US10899088

    申请日：2004-07-27

    申请人： Yasushi Hasegawa ,  Taiji Maeda

    发明人： Yasushi Hasegawa ,  Taiji Maeda

    IPC分类号： H01F19/04 ,  H01L23/48 ,  H01H47/00

    CPC分类号： H01L23/48 ,  H01L2924/0002 ,  H01L2924/00

    摘要： If external magnetic field(s) (external noise) is/are present, equivalent noise component(s) might be produced at both receiving coil(s) and dummy coil(s), and respective noise components from receiving coil(s) and dummy coil(s) might be made to at least partially cancel out one another at differential amplifier(s), substantially only signal component(s) due to magnetic field(s) from transmitting coil(s) being applied by way of differential amplifier(s) to comparator(s), where same is/are binarized and is/are moreover output by way of output control circuitry and respective transistor(s).

    摘要翻译： 如果存在外部磁场（外部噪声），则可能在两个接收线圈和虚线圈产生等效的噪声分量，以及来自接收线圈和 虚拟线圈可以在差分放大器处至少部分地彼此抵消，基本上仅由于通过差分放大器施加的发射线圈的磁场引起的信号分量 （一个或多个）到比较器，其中相同的/被二进制化，并且另外通过输出控制电路和相应的晶体管输出。

    Method and apparatus for fabricating a photocoupler with reduced mount area
    26.
    发明授权
    Method and apparatus for fabricating a photocoupler with reduced mount area 失效
    用于制造具有减小的安装面积的光电耦合器的方法和装置

    公开(公告)号：US06737680B2

    公开(公告)日：2004-05-18

    申请号：US10144784

    申请日：2002-05-15

    申请人： Yasushi Hasegawa

    发明人： Yasushi Hasegawa

    IPC分类号： H01L2715

    CPC分类号： H01L21/4842 ,  H01L21/67144 ,  H01L25/167 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： The present invention provides a photocoupler capable of reducing the mount area required to mount the photocoupler on an object by eliminating a structurally unnecessary portion, and an apparatus and method for fabricating such a photocoupler. A light-receiving device and a light-emitting device placed on a pair of lead frames are embedded in a primary mold body made of a transparent resin, and the primary mold body is embedded in a secondary mold body made of a light-shading resin, to form the photocoupler. The lead frames are bent inside the secondary mold body, and the outer side of the terminal portion of each lead frame, ranging from the bent position to the top end, is exposed at the secondary mold body.

    摘要翻译： 本发明提供了一种能够通过消除结构上不需要的部分来减少将光耦合器安装在物体上所需的安装面积的光电耦合器，以及用于制造这种光电耦合器的装置和方法。 放置在一对引线框架上的光接收装置和发光装置嵌入由透明树脂制成的一次模体中，一次模体嵌入由遮光树脂制成的二次模体 ，形成光电耦合器。 引线框架在二次模具体内弯曲，并且从弯曲位置到顶端的每个引线框架的端子部分的外侧在二次模具体处露出。

    Fe-based alloy foil for liquid-phase diffusion bonding of Fe-based materials by enabling bonding in oxidizing atmospheres
    27.
    发明授权
    Fe-based alloy foil for liquid-phase diffusion bonding of Fe-based materials by enabling bonding in oxidizing atmospheres 失效
    Fe基合金箔，用于通过在氧化气氛中接合而使Fe基材料进行液相扩散接合

    公开(公告)号：US5919577A

    公开(公告)日：1999-07-06

    申请号：US11583

    申请日：1998-01-30

    申请人： Yasushi Hasegawa ,  Eiji Tsuru ,  Yuichi Sato ,  Shigekatsu Ozaki

    发明人： Yasushi Hasegawa ,  Eiji Tsuru ,  Yuichi Sato ,  Shigekatsu Ozaki

    IPC分类号： B23K20/02 ,  B23K20/227 ,  B23K35/02 ,  B23K35/30 ,  C22C38/02 ,  C22C38/32 ,  C22C38/54

    CPC分类号： C22C38/002 ,  B23K20/023 ,  B23K20/227 ,  B23K35/0233 ,  B23K35/308 ,  B23K35/3093 ,  C22C38/02 ,  C22C38/08 ,  C22C38/10 ,  C22C38/105 ,  C22C38/12 ,  C22C38/14 ,  C22C38/22 ,  C22C38/24 ,  C22C38/26 ,  C22C38/28 ,  C22C38/44 ,  C22C38/46 ,  C22C38/48 ,  C22C38/50 ,  B23K2201/06 ,  B23K2203/02 ,  Y10T428/12431

    摘要： The present invention provides an Fe-based alloy foil for liquid phase diffusion bonding of Fe-based material by enabling bonding in oxidizing atmospheres at relatively high bonding temperatures to minimize thermal influence on the base material (the material to be bonded) and, thereby, ensures production of a bonded joint having a uniform microstructure and a good bonded joint strength and enables reduction in the bonding time. The Fe-based alloy foil contains, as essential elements, one of 1.0 to 20.0% P and 1.0 to 20.0% B, 1.0 to 20.0% Si, and 0.1 to 20.0% V, in terms of atomic percentage, the balance substantially of Fe and unavoidable impurities, and has a thickness of 3.0 to 100 .mu.m. Alternatively, the Fe-based alloy foil contains, as essential elements, 1.0 to 20.0% P, 1.0 to 20.0% Si, and 0.1 to 20.0% V, and 1.0 to 20.0% B, in terms of atomic percentage, the balance substantially of Fe and unavoidable impurities, and has a thickness of 3.0 to 200 .mu.m. In accordance with need, one or more of Cr, Ni and Co and/or one or more of W, Nb and Ti are also contained in suitable amounts. The foil advantageously has a substantially amorphous crystallographic structure.

    摘要翻译： PCT No.PCT / JP97 / 01900 Sec。 371日期1998年1月30日 102（e）1998年1月30日PCT PCT 1997年6月4日PCT公布。 公开号WO97 / 46347 日期1997年12月11日本发明提供了一种Fe基合金箔，其用于通过在相对高的接合温度下在氧化气氛中进行接合而使Fe基材料的液相扩散接合，以最小化对基材（待结合的材料）的热影响 ），从而确保具有均匀的微结构和良好的接合接合强度的接合接头的制造，并且能够缩短接合时间。 Fe基合金箔作为必要元素含有以原子百分比计的1.0至20.0％的P和1.0至20.0％的B，1.0至20.0％的Si和0.1至20.0％的V中的一种，其余基本上为Fe 和不可避免的杂质，其厚度为3.0〜100μm。 或者，Fe基合金箔作为必要元素含有1.0〜20.0％的P，1.0〜20.0％的Si和0.1〜20.0％的V，以原子百分比计含有1.0〜20.0％的B，其余量基本上为 Fe和不可避免的杂质，其厚度为3.0〜200μm。 根据需要，还可以以合适的量含有Cr，Ni和Co中的一种或多种和/或W，Nb和Ti中的一种或多种。 箔有利地具有基本上非晶的晶体结构。

    High strength, ferritic heat-resistant steel having improved resistance to intermetallic compound precipitation-induced embrittlement
    28.
    发明授权
    High strength, ferritic heat-resistant steel having improved resistance to intermetallic compound precipitation-induced embrittlement 失效
    具有改善的耐金属间化合物沉淀诱导脆性的高强度铁素体耐热钢

    公开(公告)号：US5772956A

    公开(公告)日：1998-06-30

    申请号：US722057

    申请日：1996-10-11

    申请人： Yasushi Hasegawa ,  Masahiro Ohgami ,  Hisashi Naoi

    发明人： Yasushi Hasegawa ,  Masahiro Ohgami ,  Hisashi Naoi

    IPC分类号： C22C38/00 ,  C22C38/22 ,  C22C38/24 ,  C22C38/30 ,  C22C38/54

    CPC分类号： C22C38/22 ,  C22C38/001 ,  C22C38/24 ,  C22C38/30

    摘要： A martensitic heat resistant steel is provided which has improved high temperature creep strength, contains Co and, at a temperature of 600.degree. C. or above, does not form an intermetallic compound substantially having a composition of Cr.sub.40 Mo.sub.20 Co.sub.20 W.sub.10 C.sub.2 --Fe. In a heat-resistant steel, containing not less than 8% of Cr, with Co, Mo, and W being simultaneously added thereto, a combination of the addition of a very small of Mg, Ba, Ca, Y, Ce, La and the like, with the addition of a minor amount of Ti and Zr, inhibits the precipitation of an intermetallic compound substantially having a composition of Cr.sub.40 Mo.sub.20 Co.sub.20 W.sub.10 C.sub.2 --Fe, thereby ensuring high temperature creep strength.

    摘要翻译： PCT No.PCT / JP96 / 00319 Sec。 371日期：1996年10月11日 102（e）日期1996年10月11日PCT 1996年2月14日PCT PCT。 公开号WO96 / 25530 日期1996年8月22日提供具有提高的高温蠕变强度的马氏体型耐热钢，其含有Co，并且在600℃以上的温度下，不形成基本上具有Cr40Mo20Co20W10C2-Fe组成的金属间化合物。 在含有不少于8％的Cr的耐热钢中，同时加入Co，Mo和W，结合添加非常小的Mg，Ba，Ca，Y，Ce，La和 通过添加少量的Ti和Zr，抑制了基本上具有Cr40Mo20Co20W10C2-Fe组成的金属间化合物的沉淀，从而确保高温蠕变强度。

    Waterproof camera
    29.
    发明授权
    Waterproof camera 失效
    防水摄像头

    公开(公告)号：US5701518A

    公开(公告)日：1997-12-23

    申请号：US598023

    申请日：1996-02-07

    申请人： Tsutomu Honda ,  Hisanori Itoh ,  Takuya Ueno ,  Junji Mori ,  Hiroyuki Matsumoto ,  Yasushi Hasegawa ,  Hideo Kajita

    发明人： Tsutomu Honda ,  Hisanori Itoh ,  Takuya Ueno ,  Junji Mori ,  Hiroyuki Matsumoto ,  Yasushi Hasegawa ,  Hideo Kajita

    IPC分类号： G03B17/08 ,  G03B17/14 ,  G03B17/00

    CPC分类号： G03B17/08

    摘要： A waterproof camera to which an interchangeable lens unit having a waterproof construction is mounted. The waterproof camera has a lens mount provided in a camera body and to which the interchangeable lens unit is removably mounted, a ring-shaped flange provided in the lens mount and which positions the interchangeable lens unit relative to the camera camera body, an engaging member provided at an outer circumference of the ring-shaped flange and which engages with the outer circumference of one end of the interchangeable lens unit, and a waterproof member which is in pressing contact with an area of engagement between the engaging member and the outer circumference of one end of the interchangeable lens unit and prevents water from penetrating in the area of engagement.

    摘要翻译： 具有安装有防水结构的可互换镜头单元的防水相机。 防水照相机具有设置在照相机主体中并且可互换透镜单元可拆卸地安装在其上的透镜座，设置在透镜座中并且可互换透镜单元相对于相机照相机主体定位的环形凸缘，接合构件 设置在所述环形凸缘的外周并且与所述可互换透镜单元的一端的外周接合;以及防水构件，所述防水构件与所述接合构件与所述可互换透镜单元的外周之间的接合区域 可互换透镜单元的一端，并防止水在接合区域中渗透。

    Cephem compound having catechol group
    30.
    发明授权
    Cephem compound having catechol group 有权
    具有儿茶酚基的头孢烯化合物

    公开(公告)号：US09145425B2

    公开(公告)日：2015-09-29

    申请号：US13639412

    申请日：2011-04-04

    申请人： Shinya Hisakawa ,  Yasushi Hasegawa ,  Toshiaki Aoki ,  Hiroki Kusano ,  Masayuki Sano ,  Jun Sato ,  Kenji Yamawaki

    发明人： Shinya Hisakawa ,  Yasushi Hasegawa ,  Toshiaki Aoki ,  Hiroki Kusano ,  Masayuki Sano ,  Jun Sato ,  Kenji Yamawaki

    IPC分类号： C07D471/08 ,  C07D501/56 ,  C07D505/24 ,  C07D501/46 ,  C07D519/06

    CPC分类号： C07D505/24 ,  C07D471/08 ,  C07D501/46 ,  C07D501/56 ,  C07D519/06

    摘要： This invention provides Cephem compounds having the formula: or an ester, a protected compound at the amino on the ring in the 7-side chain, a pharmaceutically acceptable salt, or a solvate thereof, a pharmaceutical composition thereof, and a method for treating a bacterial infectious disease with the compound, the ester, the protected compound, the salt, or the solvate thereof, wherein the symbols in the formula are defined in the specification. The compounds exhibit potent antimicrobial spectrum against a variety of bacteria including Gram negative bacteria and/or Gram positive bacteria, preferably beta-lactamase producing Gram negative bacteria, more preferably, multi-drug resistant microbials, in particular, Class B type metallo-beta-lactamase producing Gram negative bacteria, and still preferably extended-spectrum beta-lactamase (ESBL) producing bacteria. The compounds most preferably do not exhibit cross-resistance against known Cephem drugs or Carbapenem drugs.

    摘要翻译： 本发明提供具有下式的Cephem化合物：或酯，7-侧链上的环上的氨基上的被保护的化合物，其药学上可接受的盐或溶剂合物，其药物组合物和 化合物，酯，受保护化合物，盐或其溶剂化物的细菌感染性疾病，其中式中的符号在说明书中定义。 该化合物对各种细菌（包括革兰氏阴性细菌和/或革兰氏阳性细菌，优选β-内酰胺酶产生革兰氏阴性细菌，更优选多药耐药性微生物，特别是B类金属β- 产生革兰氏阴性细菌的内酰胺酶，更优选延长的β-内酰胺酶（ESBL）产生细菌。 该化合物最优选不表现出对已知的Cephem药物或碳青霉烯类药物的抗药性。