摘要:
A semiconductor device includes: a first insulating film formed on a substrate; a pad embedded in the first insulating film; and a second insulating film that is formed on the first insulating film and has an opening exposing at least part of the pad. The pad includes a plurality of pad interconnects, and an interconnect link is provided to electrically connect adjacent interconnects among the plurality of pad interconnects. The width of the pad interconnects is smaller than the height of the pad interconnects and larger than the width of the interconnect link.
摘要:
A semiconductor device includes a first interconnect layer and a second interconnect layer provided above or under the first interconnect layer. The first interconnect layer includes a plurality of first interconnect blocks, and in each of the first interconnect blocks, a first interconnect has a first potential, and extends in at least two or more directions, and a second interconnect has a second potential, and extends in at least two or more directions. The second interconnect layer includes a third interconnect which electrically connects the first interconnect of one of a pair of adjacent first interconnect blocks and the first interconnect of the other of the pair of adjacent first interconnect blocks, and a fourth interconnect which electrically connects the second interconnect of one of the pair of adjacent first interconnect blocks and the second interconnect of the other of the pair of adjacent first interconnect blocks.
摘要:
Provided is a semiconductor memory device compatible with a SRAM and capable of a high-speed data transfer operation while maintaining data reliability. An access to a memory core 6 starts when an external chip enable signal XCE performs a falling transition. Simultaneously, an external write enable signal XWE and an external address signal ADD are received, and a memory cell 1, in the memory core 6, corresponding to the received external address signal ADD is selected. When a data read-out from the memory cell 1 or a data write-in to the memory cell 1 is complete, a rewrite timer 7 is activated in accordance with a rising transition of an external chip enable signal XCE or a rising transition of the external write enable signal XWE for performing a data rewrite for the memory cell 1.
摘要:
In order to omit a reset transistor between a storage node and a cell plate line of a memory cell, a cell plate line is fixed to a potential substantially equal to a ground potential and a bit line is driven with positive and negative voltages.
摘要:
To provide a semiconductor storage device which can adapt to assembly processes involving different treatment temperatures, can become unrewritable when rewriting of data by the user is prohibited, negates the necessity for developing different semiconductor storage devices, and lowers development cost.A semiconductor storage device is provided with, as areas for storing faulty address information indicating a faulty area and operation mode setting information about the semiconductor storage device, a first setting function storage area 103 formed from electrically-rewritable nonvolatile memory and a second setting function storage area 102 formed from once-rewritable nonvolatile memory. Transfer of faulty address information to a faulty address register 111 and transfer of operation mode setting information to an operation mode register 110 are selectively performed.
摘要:
A voltage level conversion circuit 101 is provided with a level converter 101a for converting a VDD1 system input signal into a VDD2 system signal, and a NOT circuit 30 for inverting the level-converted input signal and outputting the inverted signal, and the outputs of VDD1 system NOT circuits 21a and 21b constituting the level converter 101a are input to only high breakdown voltage transistors Qhn1 and Qhn2 in the level converter 101a while a signal having a logical voltage level corresponding to the low power supply voltage VDD2 is input to low breakdown voltage transistors Qlp1 and Qlp2, and further, only the input signal level-converted by the level converter 101a is input to the NOT circuit 30.
摘要:
The ferroelectric memory device includes a plurality of memory cells arranged in a matrix at crossings of a plurality of word lines and a plurality of bit lines. Each memory cell includes at least one ferroelectric capacitor composed of a ferroelectric film and first and second electrodes sandwiching the ferroelectric film, a memory cell transistor interposed between the bit line and the first electrode of the ferroelectric capacitor, a cell plate line connected to the second electrode of the ferroelectric capacitor, a reset voltage supply line for supplying a voltage of a potential substantially identical to the potential at the cell plate line, a reset transistor interposed between the reset voltage supply line and the first electrode of the ferroelectric capacitor, and a reset control signal line for controlling ON/OFF of the reset transistor.
摘要:
The present invention comprises a first MOS transistor whose gate and drain are connected with a first node, a second MOS transistor whose gate and drain are connected with the first node and a third node, respectively, a first resistive element which is connected between the first node and a second node, a second resistive element which is connected between the second node and a ground voltage terminal, a first NOT circuit whose input terminal is connected with the second node, whose output terminal is a fourth node, and which is connected between the third node and the ground voltage terminal, and a second NOT circuit whose input terminal is connected with the fourth node and whose output terminal is a fifth node. Consequently, the present invention can detect voltage in a stable condition with low power consumption.
摘要:
A reference potential generator is constituted of two signal lines 21 and 22; a charge supplying circuit to supply charge to signal lines 21 and 22; a first connection circiut 24a and 24b connecting the charge supplying circuit 23 and two signal lines 21 and 22 in order to supply charge to the two signal lines; and a second connection circuit 25 connecting two signal lines 21 and 22 together by the second control signal, and two signal lines are disconnected after the potentials of the two signal lines determined by the supplied charge and each of load capacitances of signal lines are averaged. A semiconductor memory device of the invention incorporating the above reference potential generator generating an exact reference potential, is able to amplify and output the potential difference between the reference potential and the potential of data readout in the bit line, and by this, "1" or "0" of readout data can be precisely determined.
摘要:
By setting full group reversal control gates to a logical voltage "H", memory cells on all bit lines of a memory cell array block are connected to a reversal voltage supply circuit so that a group reversal operation is performed. When one of the group reversal control gates is set to the logical voltage "H", the memory cells on the bit lines having either even or odd numbers of the memory cell array block are connected to the reversal voltage supply circuit so that a partial group reversal operation is performed. When one of column selection gates is set to the logical voltage "H", the selected bit line is connected to the reversal voltage supply circuit. Consequently, a line reversal operation for the memory cell connected to the selected bit line is performed. Thus, the high-speed reversal operation which fully controls the offleak current of the memory cell can be implemented and the low-voltage operation can be realized by changing the operation unit for performing the reversal operation.