公开(公告)号：US20130153418A1

公开(公告)日：2013-06-20

申请号：US13443902

申请日：2012-04-11

申请人： Lung-Tai Chen ,  Chin-Sheng Chang ,  Jing-Yuan Lin ,  Chun-Hsun Chu

发明人： Lung-Tai Chen ,  Chin-Sheng Chang ,  Jing-Yuan Lin ,  Chun-Hsun Chu

IPC分类号： G01N27/30 ,  B32B37/14 ,  B32B37/02

CPC分类号： B81C1/00293 ,  B81C2203/0145 ,  B81C2203/019 ,  G01D11/26

摘要： A sensing device is provided. A suction port of a chamber is sealed by using a gas sealing layer with a gas sealing filter. The gas sealing filter has a plurality of one-way passes. The one-way passes have a width in a range of several nanometers to several hundred nanometers. A gas molecular exhausts to the outside of the chamber through the one-way passes. Owing to preventing the material of gas sealing layer from flowing into the chamber by the gas sealing filter, superior sealing performance is achieved as compared to those adopting solder or sealing material, thereby facilitating control of the condition in the chamber.

摘要翻译： 提供感测装置。 通过使用具有气体密封过滤器的气体密封层来密封腔室的吸入口。 气体密封过滤器具有多个单程通道。 单向通道的宽度在几纳米到几百纳米的范围内。 气体分子通过单程通过排气到室外。 由于通过气体密封过滤器防止气体密封层的材料流入室，与使用焊料或密封材料的密封性相比，实现了优异的密封性能，从而有助于控制室内的状态。

公开(公告)号：US07791181B2

公开(公告)日：2010-09-07

申请号：US12014636

申请日：2008-01-15

申请人： Lung-Tai Chen ,  Chun-Hsun Chu

发明人： Lung-Tai Chen ,  Chun-Hsun Chu

IPC分类号： H01L23/495

CPC分类号： G01L19/141 ,  B81B7/0061 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C2203/0154 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

摘要： A device structure with preformed ring includes a sensor chip and a ring disposed and surrounded on periphery of sensitive area of an active surface thereof. The device structure with preformed ring may batchly bind and electrically connect to a carrier by a way of two-dimension array, and then a packaging process is performed. During the packaging process, the top portion of the ring can be used to against the inner side of a packaging mold, so as to stop the packaging material covering the device at outside of the ring and stick with the ring. Therefore, an opening is formed on the sensitive area surface of the device. Depending on the ring, the extra process for eliminating the packaging material on the sensitive area surface can be avoided in the conventional process.

摘要翻译： 具有预成型环的装置结构包括传感器芯片和设置并围绕其活性表面的敏感区域的周围的环。 具有预制环的装置结构可以通过二维阵列的方式分批地结合和电连接到载体，然后进行包装处理。 在包装过程中，环的顶部可以用于抵靠包装模具的内侧，以便在环的外侧停止包裹该装置的包装材料并且与环一起粘着。 因此，在装置的敏感区域表面上形成开口。 根据环，在常规方法中可以避免用于消除敏感区域表面上的包装材料的额外处理。

公开(公告)号：US5903052A

公开(公告)日：1999-05-11

申请号：US75879

申请日：1998-05-12

申请人： Lung-Tai Chen ,  Ping-Huang Chiang ,  Yu-Kon Chou ,  Chien-Chi Chao

发明人： Lung-Tai Chen ,  Ping-Huang Chiang ,  Yu-Kon Chou ,  Chien-Chi Chao

IPC分类号： H01L23/24 ,  H01L23/367 ,  H01L23/498 ,  H05K3/34 ,  H01L23/495 ,  H01L23/12

CPC分类号： H05K3/341 ,  H01L23/24 ,  H01L23/367 ,  H01L23/49816 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/0373 ,  H05K2201/10734 ,  H05K2201/10969 ,  H05K2203/1178 ,  Y02P70/613

摘要： The present invention includes a substrate having a first opening. A heat spreader is attached on the bottom surface of the substrate. The bottom side surface of the heat spreader has trench pattern. The trench pattern includes a plurality of connecting cavities and a plurality of trenches. The chip is mounted on the top side surface of the heat spreader. A supporting member is formed on the top side surface of the substrate. The space among the substrate, the chip, the heat spreader and the supporting member is encapsulated by encapsulating material. The preformed solder balls are mounted on the bottom side surface of the substrate.

摘要翻译： 本发明包括具有第一开口的基板。 散热器附着在基板的底面上。 散热器的底面具有沟槽图案。 沟槽图案包括多个连接腔和多个沟槽。 芯片安装在散热器的顶面。 支撑构件形成在基板的顶侧表面上。 衬底，芯片，散热器和支撑构件之间的空间被封装材料封装。 预制的焊球安装在基板的底侧表面上。

公开(公告)号：US5695109A

公开(公告)日：1997-12-09

申请号：US562007

申请日：1995-11-22

申请人： Ping-Huang Chiang ,  Lung-Tai Chen ,  Yu-Kon Chou

发明人： Ping-Huang Chiang ,  Lung-Tai Chen ,  Yu-Kon Chou

IPC分类号： B23K35/02 ,  B23K35/14 ,  H05K3/34 ,  H05K3/40

CPC分类号： H05K3/3436 ,  B23K35/0222 ,  B23K35/025 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K3/3484 ,  H05K3/4069 ,  Y02P70/613

摘要： An integrated circuit (IC) package includes solder paste inter-layer and alignment apparatus 100 for applying and aligning solder paste 150 with corresponding solder pads 160 on the IC package carrier 200. The apparatus 100 includes a thin layer 100 which is composed of high-temperature-resistant, non-solder-wetting, and electrical-insulating materials. The apparatus further has a plurality of apertures 110, each disposed on and penetrating through the thin layer 100 for applying solder paste 150 therein and for aligning with the corresponding solder pads 160 on the IC package carrier 200. The apparatus 100 further includes a removable thin film tape 120 disposed on a bottom surface of the thin layer 100 for temporarily maintaining the solder paste 150 in the plurality of apertures 110.

摘要翻译： 集成电路（IC）封装包括焊膏层间和对准装置100，用于将焊膏150与IC封装载体200上的相应的焊盘160进行对准和对准。装置100包括薄层100， 耐温，非焊接润湿和电绝缘材料。 该设备还具有多个孔110，每个孔110设置在薄层100上并穿透薄层100，用于在其中施加焊膏150并与IC封装载体200上的对应焊盘160对准。装置100还包括可移除薄膜 薄膜带120设置在薄层100的底表面上，用于在多个孔110中暂时保持焊膏150。