公开(公告)号：US10720446B2

公开(公告)日：2020-07-21

申请号：US16158039

申请日：2018-10-11

Applicant: Micron Technology, Inc.

Inventor： Justin B. Dorhout ,  Fei Wang ,  Chet E. Carter ,  Ian Laboriante ,  John D. Hopkins ,  Kunal Shrotri ,  Ryan Meyer ,  Vinayak Shamanna ,  Kunal R. Parekh ,  Martin C. Roberts ,  Matthew Park

IPC: H01L27/11582 ,  H01L27/1157 ,  H01L23/528 ,  H01L23/532

Abstract: Some embodiments include an integrated structure having vertically-stacked conductive levels alternating with dielectric levels. A layer over the conductive levels includes silicon, nitrogen, and one or more of carbon, oxygen, boron and phosphorus. In some embodiments the vertically-stacked conductive levels are wordline levels within a NAND memory array. Some embodiments include an integrated structure having vertically-stacked conductive levels alternating with dielectric levels. Vertically-stacked NAND memory cells are along the conductive levels within a memory array region. A staircase region is proximate the memory array region. The staircase region has electrical contacts in one-to-one correspondence with the conductive levels. A layer is over the memory array region and over the staircase region. The layer includes silicon, nitrogen, and one or more of carbon, oxygen, boron and phosphorus.

公开(公告)号：US20190326445A1

公开(公告)日：2019-10-24

申请号：US15957594

申请日：2018-04-19

Applicant: Micron Technology, Inc.

Inventor： Fei Wang ,  Kunal Shrotri ,  Jeffery B. Hull ,  Anish A. Khandekar ,  Duo Mao ,  Zhixin Xu ,  Ee Ee Eng ,  Jie Li ,  Dong Liang

IPC: H01L29/792 ,  H01L29/66 ,  H01L27/1157 ,  G11C16/04 ,  G11C16/08 ,  H01L21/28

Abstract: A method of forming Si3Nx, where “x” is less than 4 and at least 3, comprises decomposing a Si-comprising precursor molecule into at least two decomposition species that are different from one another, at least one of the at least two different decomposition species comprising Si. An outer substrate surface is contacted with the at least two decomposition species. At least one of the decomposition species that comprises Si attaches to the outer substrate surface to comprise an attached species. The attached species is contacted with a N-comprising precursor that reacts with the attached species to form a reaction product comprising Si3Nx, where “x” is less than 4 and at least 3. Other embodiments are disclosed, including constructions made in accordance with method embodiments of the invention and constructions independent of method of manufacture.

公开(公告)号：US10381377B2

公开(公告)日：2019-08-13

申请号：US16041388

申请日：2018-07-20

Applicant: Micron Technology, Inc.

Inventor： Fei Wang ,  Tom J. John ,  Kunal Shrotri ,  Anish A. Khandekar ,  Aaron R. Wilson ,  John D. Hopkins ,  Derek F. Lundberg

IPC: H01L27/11582 ,  H01L21/033 ,  H01L29/788 ,  H01L21/311 ,  H01L27/11556

Abstract: A method comprises forming material to be etched over a substrate. An etch mask comprising a silicon nitride-comprising region is formed elevationally over the material. The etch mask comprises an elevationally-extending mask opening in the silicon nitride-comprising region that has a minimum horizontal open dimension that is greater in an elevationally-innermost portion of the region than in an elevationally-outermost portion of the region. The elevationally-outermost portion has a greater etch rate in at least one of HF and H3PO4 than does the elevationally-innermost portion. The etch mask is used as a mask while etching an elevationally-extending mask opening into the material. The silicon nitride-comprising region is exposed to at least one of HF and H3PO4 to increase the minimum horizontal open dimension in the elevationally-outermost portion to a greater degree than increase, if any, in the minimum horizontal open dimension in the elevationally-innermost portion. Other aspects and embodiments, including structure independent of method of manufacture, are disclosed.

公开(公告)号：US20180331120A1

公开(公告)日：2018-11-15

申请号：US16041388

申请日：2018-07-20

Applicant: Micron Technology, Inc.

Inventor： Fei Wang ,  Tom J. John ,  Kunal Shrotri ,  Anish A. Khandekar ,  Aaron R. Wilson ,  John D. Hopkins ,  Derek F. Lundberg

IPC: H01L27/11582 ,  H01L21/033 ,  H01L29/788 ,  H01L21/311 ,  H01L27/11556

CPC classification number: H01L27/11582 ,  H01L21/0332 ,  H01L21/0337 ,  H01L21/31116 ,  H01L21/31144 ,  H01L27/11556 ,  H01L29/7883

Abstract: A method comprises forming material to be etched over a substrate. An etch mask comprising a silicon nitride-comprising region is formed elevationally over the material. The etch mask comprises an elevationally-extending mask opening in the silicon nitride-comprising region that has a minimum horizontal open dimension that is greater in an elevationally-innermost portion of the region than in an elevationally-outermost portion of the region. The elevationally-outermost portion has a greater etch rate in at least one of HF and H3PO4 than does the elevationally-innermost portion. The etch mask is used as a mask while etching an elevationally-extending mask opening into the material. The silicon nitride-comprising region is exposed to at least one of HF and H3PO4 to increase the minimum horizontal open dimension in the elevationally-outermost portion to a greater degree than increase, if any, in the minimum horizontal open dimension in the elevationally-innermost portion. Other aspects and embodiments, including structure independent of method of manufacture, are disclosed.

公开(公告)号：US09893083B1

公开(公告)日：2018-02-13

申请号：US15293133

申请日：2016-10-13

Applicant: Micron Technology, Inc.

Inventor： Fei Wang ,  Tom J. John ,  Kunal Shrotri ,  Anish A. Khandekar ,  Aaron R. Wilson ,  John D. Hopkins ,  Derek F. Lundberg

IPC: H01L27/06 ,  H01L21/311 ,  H01L27/11582 ,  H01L27/11556 ,  H01L21/033 ,  H01L29/788

CPC classification number: H01L27/11582 ,  H01L21/0332 ,  H01L21/0337 ,  H01L21/31116 ,  H01L21/31144 ,  H01L27/11556 ,  H01L29/7883

Abstract: A method comprises forming material to be etched over a substrate. An etch mask comprising a silicon nitride-comprising region is formed elevationally over the material. The etch mask comprises an elevationally-extending mask opening in the silicon nitride-comprising region that has a minimum horizontal open dimension that is greater in an elevationally-innermost portion of the region than in an elevationally-outermost portion of the region. The elevationally-outermost portion has a greater etch rate in at least one of HF and H3PO4 than does the elevationally-innermost portion. The etch mask is used as a mask while etching an elevationally-extending mask opening into the material. The silicon nitride-comprising region is exposed to at least one of HF and H3PO4 to increase the minimum horizontal open dimension in the elevationally-outermost portion to a greater degree than increase, if any, in the minimum horizontal open dimension in the elevationally-innermost portion. Other aspects and embodiments, including structure independent of method of manufacture, are disclosed.

公开(公告)号：US20170301685A1

公开(公告)日：2017-10-19

申请号：US15133119

申请日：2016-04-19

Applicant: Micron Technology, Inc.

Inventor： Justin B. Dorhout ,  Fei Wang ,  Chet E. Carter ,  Ian Laboriante ,  John D. Hopkins ,  Kunal Shrotri ,  Ryan Meyer ,  Vinayak Shamanna ,  Kunal R. Parekh ,  Martin C. Roberts ,  Matthew Park

IPC: H01L27/115 ,  H01L23/532 ,  H01L23/528

CPC classification number: H01L27/11582 ,  H01L23/528 ,  H01L23/53257 ,  H01L27/1157

Abstract: Some embodiments include an integrated structure having vertically-stacked conductive levels alternating with dielectric levels. A layer over the conductive levels includes silicon, nitrogen, and one or more of carbon, oxygen, boron and phosphorus. In some embodiments the vertically-stacked conductive levels are wordline levels within a NAND memory array. Some embodiments include an integrated structure having vertically-stacked conductive levels alternating with dielectric levels. Vertically-stacked NAND memory cells are along the conductive levels within a memory array region. A staircase region is proximate the memory array region. The staircase region has electrical contacts in one-to-one correspondence with the conductive levels. A layer is over the memory array region and over the staircase region. The layer includes silicon, nitrogen, and one or more of carbon, oxygen, boron and phosphorus.

公开(公告)号：US20150017575A1

公开(公告)日：2015-01-15

申请号：US14480754

申请日：2014-09-09

Applicant: Micron Technology, Inc.

Inventor： Fei Wang ,  Ezequiel Vidal Russell ,  Chung-Yi Lee

IPC: G03F1/32 ,  G03F1/26

CPC classification number: G03F1/32 ,  G03F1/00 ,  G03F1/26 ,  G03F1/30 ,  G03F1/36 ,  G03F1/38 ,  G03F1/68

Abstract: A photomask includes a substrate having a device region and an adjacent edge region over transparent material. The device region includes spaced primary features of constant pitch at least adjacent the edge region. The edge region includes spaced sub-resolution assist features of the constant pitch of the spaced primary features at least adjacent the device region and which are off-phase by from about 30° to about 150° from +/−180°. Additional embodiments, including methods, are disclosed.

Abstract translation: 光掩模包括具有在透明材料上的器件区域和相邻边缘区域的衬底。 器件区域包括至少邻近边缘区域的恒定间距的间隔的主要特征。 边缘区域包括间隔开的主要特征的至少相邻于器件区域的恒定间距的间隔的次分辨率辅助特征，并且与+/- 180°相差约30°至约150°。 公开了包括方法的其它实施例。

公开(公告)号：US10749041B2

公开(公告)日：2020-08-18

申请号：US16659478

申请日：2019-10-21

Applicant: Micron Technology, Inc.

Inventor： Fei Wang ,  Kunal Shrotri ,  Jeffery B. Hull ,  Anish A. Khandekar ,  Duo Mao ,  Zhixin Xu ,  Ee Ee Eng ,  Jie Li ,  Dong Liang

IPC: H01L29/792 ,  H01L27/1157 ,  H01L29/66 ,  H01L21/28 ,  G11C16/04 ,  G11C16/08

Abstract: A method of forming Si3Nx, where “x” is less than 4 and at least 3, comprises decomposing a Si-comprising precursor molecule into at least two decomposition species that are different from one another, at least one of the at least two different decomposition species comprising Si. An outer substrate surface is contacted with the at least two decomposition species. At least one of the decomposition species that comprises Si attaches to the outer substrate surface to comprise an attached species. The attached species is contacted with a N-comprising precursor that reacts with the attached species to form a reaction product comprising Si3Nx, where “x” is less than 4 and at least 3. Other embodiments are disclosed, including constructions made in accordance with method embodiments of the invention and constructions independent of method of manufacture.

公开(公告)号：US10483407B2

公开(公告)日：2019-11-19

申请号：US15957594

申请日：2018-04-19

Applicant: Micron Technology, Inc.

Inventor： Fei Wang ,  Kunal Shrotri ,  Jeffery B. Hull ,  Anish A. Khandekar ,  Duo Mao ,  Zhixin Xu ,  Ee Ee Eng ,  Jie Li ,  Dong Liang

IPC: H01L21/28 ,  H01L27/1157 ,  H01L29/66 ,  G11C16/04 ,  G11C16/08 ,  H01L29/792

Abstract: A method of forming Si3Nx, where “x” is less than 4 and at least 3, comprises decomposing a Si-comprising precursor molecule into at least two decomposition species that are different from one another, at least one of the at least two different decomposition species comprising Si. An outer substrate surface is contacted with the at least two decomposition species. At least one of the decomposition species that comprises Si attaches to the outer substrate surface to comprise an attached species. The attached species is contacted with a N-comprising precursor that reacts with the attached species to form a reaction product comprising Si3Nx, where “x” is less than 4 and at least 3. Other embodiments are disclosed, including constructions made in accordance with method embodiments of the invention and constructions independent of method of manufacture.

公开(公告)号：US20140248554A1

公开(公告)日：2014-09-04

申请号：US14274455

申请日：2014-05-09

Applicant: Micron Technology, Inc.

Inventor： Anton P. Eppich ,  Fei Wang

IPC: G03F1/38 ,  G03F7/20

CPC classification number: G03F1/38 ,  G03B27/42 ,  G03F7/70058 ,  G03F7/70283 ,  G03F7/70433

Abstract: Photolithographic apparatus, systems, and methods that make use of sub-resolution assist devices are disclosed. In the various embodiments, an imaging mask includes an optically transmissive substrate having a sub-resolution assist device that further includes a first optical attenuation region and a spaced-apart second optical attenuation region, and an optically transmissive phase adjustment region interposed between the first optical attenuation region and the second optical attenuation region, the phase adjustment region being configured to change a phase of incident illumination radiation by altering an optical property of the substrate.

Abstract translation: 公开了利用次分解辅助装置的光刻设备，系统和方法。 在各种实施例中，成像掩模包括具有副分辨率辅助装置的光学透射基板，其还包括第一光学衰减区域和间隔开的第二光学衰减区域，以及光学透射相位调整区域，介于第一光学 衰减区域和第二光衰减区域，所述相位调整区域被配置为通过改变所述衬底的光学特性来改变入射照射辐射的相位。