公开(公告)号：US20190035981A1

公开(公告)日：2019-01-31

申请号：US16150259

申请日：2018-10-02

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/48 ,  H01L33/60 ,  H01L33/56 ,  B29C45/00 ,  H01L33/50 ,  H01L23/00 ,  B29C45/14 ,  H01L33/62 ,  H01L33/64

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US20160225961A1

公开(公告)日：2016-08-04

申请号：US15098975

申请日：2016-04-14

Applicant: NICHIA CORPORATION

Inventor： Masaki HAYASHI ,  Yuki SHIOTA

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/62 ,  H01L33/56 ,  H01L33/58

CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A light emitting device includes a first lead, a second lead, an insulating member, a diffusing agent-containing portion, a wavelength conversion portion and a lens portion. The insulating member is configured to fix the first lead and the second lead. A thickness of the insulating member is equal to the thickness of the first and second leads. A groove or a recessed portion is provided to retain the wavelength conversion portion in a specific region is formed in the first lead. A second groove portion or recessed portion is formed in the first lead inner side of the groove portion or the recessed portion, which is filled with the diffusing agent-containing portion.

Abstract translation: 发光装置包括第一引线，第二引线，绝缘构件，扩散剂容纳部，波长转换部和透镜部。 绝缘构件被构造成固定第一引线和第二引线。 绝缘构件的厚度等于第一和第二引线的厚度。 提供凹槽或凹陷部分以将特定区域中的波长转换部分保持在第一引线中。 第二槽部或凹部形成在槽部或凹部的第一引线内侧，填充有扩散剂容纳部。

公开(公告)号：US20160056357A1

公开(公告)日：2016-02-25

申请号：US14928550

申请日：2015-10-30

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/486 ,  B29C45/0055 ,  B29C45/14655 ,  B29C2793/009 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/504 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.