公开(公告)号：US20220173285A1

公开(公告)日：2022-06-02

申请号：US17456556

申请日：2021-11-24

Applicant: NICHIA CORPORATION

Inventor： Shimpei SASAOKA ,  Toshiyuki HASHIMOTO ,  Toshinobu KATSUMATA ,  Naoya KASHIWAGI

IPC: H01L33/54 ,  H01L33/00 ,  H01L33/56 ,  H01L33/48

Abstract: A method for manufacturing a light emitting device according to the present invention includes: providing an intermediate member including: a support member including: housing portions, the housing portions having first recessed portion(s) each having a lateral wall and a bottom surface, and a coupling portion located between adjacent ones of the housing portions and having a height lower than a height of the lateral wall with reference to the bottom surface of the first recessed portion, a light source mounted on the bottom surface of the first recessed portion, and an encapsulant disposed in the first recessed portion; and forming a first light-transmissive member continuously covering the housing portions and the coupling portion. An inclined surface of the first light-transmissive member has a height above the coupling portion is lower than a height above the housing portions with reference to the bottom surface of the first recessed portion.

公开(公告)号：US20180351062A1

公开(公告)日：2018-12-06

申请号：US16053804

申请日：2018-08-03

Applicant: NICHIA CORPORATION

Inventor： Ryohei YAMASHITA ,  Shimpei SASAOKA

IPC: H01L33/62 ,  H01L33/38 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L33/38 ,  H01L33/54 ,  H01L2224/16245 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A light emitting device includes a light emitting element and a resin package including a molded body, a first lead, and a second lead. Each of the first lead and the second lead has a groove overlapped with a front surface of the molded body in a height direction along a height of the light emitting device. The groove includes a first groove portion extending along a first lateral surface of the molded body and having a first groove length along the first lateral surface, and a second groove portion extending along a second lateral surface of the molded body and having a second groove length along the second lateral surface. The second lateral surface is opposite to the first lateral surface in a first lateral direction perpendicular to the height direction. The second groove length is shorter than the first groove length.

公开(公告)号：US20180301600A1

公开(公告)日：2018-10-18

申请号：US16007954

申请日：2018-06-13

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/56 ,  H01L33/50 ,  B29C45/00 ,  B29C45/14 ,  H01L33/60 ,  H01L33/62

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US20180040791A1

公开(公告)日：2018-02-08

申请号：US15726383

申请日：2017-10-06

Applicant: NICHIA CORPORATION

Inventor： Ryohei YAMASHITA ,  Shimpei SASAOKA

IPC: H01L33/62 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L33/38 ,  H01L33/54 ,  H01L2224/16245 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A light emitting device includes a resin package and a light emitting element. The resin package includes a first lead, a second lead, and a molded body molded integrally with the first lead and the second lead. The light emitting element is provided on the resin package.

公开(公告)号：US20160247979A1

公开(公告)日：2016-08-25

申请号：US15143700

申请日：2016-05-02

Applicant: NICHIA CORPORATION

Inventor： Shimpei SASAOKA ,  Takuya NAKABAYASHI

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/54 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L33/38 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/18301 ,  H05K1/0313 ,  H01L2924/00014

Abstract: A molded package includes a recess, leads, and a molded resin part. The leads include a first lead and a second lead. A part of the recess is defined by a side wall formed from the molded resin part. At least one of the leads includes an upper-surface portion exposed from a bottom surface of the recess. The at least one of the leads includes a groove formed on an upper surface thereof partially below the side wall. The first lead includes an additional groove provided on an upper surface thereof along a side of the first lead positioned opposite a side of the second lead.

Abstract translation: 模制包装包括凹部，引线和模制树脂部件。 引线包括第一引线和第二引线。 凹部的一部分由由模制树脂部分形成的侧壁限定。 引线中的至少一个包括从凹部的底表面露出的上表面部分。 所述引线中的至少一个包括形成在所述侧壁部分下方的上表面上的凹槽。 第一引线包括设置在其上表面上的沿着与第二引线的侧面相对定位的第一引线的一侧的附加槽。

公开(公告)号：US20160086927A1

公开(公告)日：2016-03-24

申请号：US14857944

申请日：2015-09-18

Applicant: NICHIA CORPORATION

Inventor： Shimpei SASAOKA ,  Kazuto OKAMOTO

IPC: H01L25/075 ,  H01L33/52 ,  H01L33/48 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/508 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a base, a first light emitting element, a second light emitting element, and a sealing member. The first light emitting element has an active layer of a nitride semiconductor and has a first emission peak wavelength in a blue region. The second light emitting element has an active layer of a nitride semiconductor and has a second emission peak wavelength longer than the first emission peak wavelength of the first light emitting element. The sealing member includes a first region and a second region. The first region contains a phosphor to be excited by light from the first light emitting element. The first region is provided on an element mounting surface. A first upper surface of the first light emitting element is located in the first region. The second region does not substantially contain the phosphor and is provided on the first region.

Abstract translation: 发光器件包括基底，第一发光元件，第二发光元件和密封元件。 第一发光元件具有氮化物半导体的有源层，并且在蓝色区域中具有第一发光峰值波长。 第二发光元件具有氮化物半导体的有源层，并且具有比第一发光元件的第一发光峰值波长长的第二发光峰值波长。 密封构件包括第一区域和第二区域。 第一区域包含要被来自第一发光元件的光激发的荧光体。 第一区域设置在元件安装表面上。 第一发光元件的第一上表面位于第一区域中。 第二区域基本上不含荧光体，并且设置在第一区域上。

公开(公告)号：US20240118572A1

公开(公告)日：2024-04-11

申请号：US18536090

申请日：2023-12-11

Applicant: NICHIA CORPORATION

Inventor： Koki SHIBAI ,  Yoshihiro SHO ,  Motokazu YAMADA ,  Naoya KASHIWAGI ,  Shimpei SASAOKA

IPC: G02F1/13357

CPC classification number: G02F1/133605 ,  G02F1/133603 ,  F21V7/0083

Abstract: A planar light source includes a substrate, light sources, and at least one partitioning member. The partitioning member includes first wall parts, second wall parts, and partitioned regions. The first wall parts define first ridges extending in a first direction. The second wall parts define second ridges extending in a second direction. The partitioned regions each is surrounded by the first ridges and the second ridges in a plan view. the partitioned regions are arranged in the first and second directions. At least one first cut is defined on at least one of the first ridges. At least one second cut is defined on at least one of the second ridges. The at least one first cut and the at least one second cut are spaced apart from each other. At least one of the light sources is arranged in a corresponding one of the partitioned regions.

公开(公告)号：US20200161516A1

公开(公告)日：2020-05-21

申请号：US16689484

申请日：2019-11-20

Applicant: NICHIA CORPORATION

Inventor： Shimpei SASAOKA ,  Toshiyuki HASHIMOTO ,  Toshinobu KATSUMATA ,  Yoshihiro SHO

IPC: H01L33/58 ,  G02B5/18 ,  H01L33/50 ,  H01L25/075

Abstract: A light emitting device includes a substrate, a demarcating member and a light-diffusing plate. The substrate has a plurality of light sources. The demarcating member includes a plurality of wall parts defining a plurality of compartments respectively corresponding to the light sources with each of the light sources being surrounded by corresponding ones of the wall parts defining a single compartment. Each of the wall parts include a ridge part and an inclined surface part. The light-diffusing plate is disposed above the light sources and having a plurality of first protrusions disposed on a first surface of the light-diffusing plate facing the substrate. Each of the first protrusions overlaps the inclined surface part of each of corresponding ones of the wall parts in a plan view. Each of the first protrusions surrounds a corresponding one of the light sources in the plan view.

公开(公告)号：US20190088825A1

公开(公告)日：2019-03-21

申请号：US16150255

申请日：2018-10-02

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/56 ,  H01L33/50 ,  B29C45/00 ,  B29C45/14 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L23/00

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US20190035981A1

公开(公告)日：2019-01-31

申请号：US16150259

申请日：2018-10-02

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/48 ,  H01L33/60 ,  H01L33/56 ,  B29C45/00 ,  H01L33/50 ,  H01L23/00 ,  B29C45/14 ,  H01L33/62 ,  H01L33/64

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.