Nonvolatile semiconductor memory devices with charge injection corner
    21.
    发明授权
    Nonvolatile semiconductor memory devices with charge injection corner 有权
    具有电荷注入角的非易失性半导体存储器件

    公开(公告)号:US07915666B2

    公开(公告)日:2011-03-29

    申请号:US12124143

    申请日:2008-05-20

    IPC分类号: H01L29/792

    摘要: An erase method where a corner portion on which an electric field concentrates locally is provided on the memory gate electrode, and charges in the memory gate electrode are injected into a charge trap film in a gate dielectric with Fowler-Nordheim tunneling operation is used. Since current consumption at the time of erase can be reduced by the Fowler-Nordheim tunneling, a power supply circuit area of a memory module can be reduced. Since write disturb resistance can be improved, a memory array area can be reduced by adopting a simpler memory array configuration. Owing to both the effects, an area of the memory module can be largely reduced, so that manufacturing cost can be reduced. Further, since charge injection centers of write and erase coincide with each other, so that (program and erase) endurance is improved.

    摘要翻译: 在存储栅电极上设置有局部集中电场的角部的擦除方法,并且使用Fowler-Nordheim隧道操作将存储栅电极中的电荷注入栅极电介质中的电荷陷阱膜。 由于通过Fowler-Nordheim隧道可以减少擦除时的电流消耗,因此可以减少存储器模块的电源电路区域。 由于可以提高写入干扰电阻,所以可以通过采用更简单的存储器阵列配置来减少存储器阵列区域。 由于这两个效果,可以大大减少存储器模块的面积,从而可以降低制造成本。 此外,由于写入和擦除的电荷注入中心彼此一致,所以(编程和擦除)耐久性得到改善。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
    22.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20110039385A1

    公开(公告)日:2011-02-17

    申请号:US12912609

    申请日:2010-10-26

    IPC分类号: H01L21/336

    摘要: Performance and reliability of a semiconductor device including a non-volatile memory are improved. A memory cell of the non-volatile memory includes, over an upper portion of a semiconductor substrate, a select gate electrode formed via a first dielectric film and a memory gate electrode formed via a second dielectric film formed of an ONO multilayered film having a charge storing function. The first dielectric film functions as a gate dielectric film, and includes a third dielectric film made of silicon oxide or silicon oxynitride and a metal-element-containing layer made of a metal oxide or a metal silicate formed between the select gate electrode and the third dielectric film. A semiconductor region positioned under the memory gate electrode and the second dielectric film has a charge density of impurities lower than that of a semiconductor region positioned under the select gate electrode and the first dielectric film.

    摘要翻译: 提高了包括非易失性存储器的半导体器件的性能和可靠性。 非易失性存储器的存储单元包括在半导体衬底的上部上的经由第一电介质膜形成的选择栅电极和通过由具有电荷的ONO多层膜形成的第二电介质膜形成的存储栅电极 存储功能。 第一介质膜用作栅极电介质膜,并且包括由氧化硅或氮氧化硅制成的第三电介质膜和由选择栅电极和第三电极之间形成的金属氧化物或金属硅酸盐构成的含金属元素层 电介质膜。 位于存储栅电极下方的半导体区域和第二电介质膜的电荷密度低于位于选择栅电极和第一电介质膜下方的半导体区域的电荷密度。

    NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD OF THE SAME
    23.
    发明申请
    NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD OF THE SAME 有权
    非线性半导体存储器件及其制造方法

    公开(公告)号:US20080142876A1

    公开(公告)日:2008-06-19

    申请号:US11943909

    申请日:2007-11-21

    IPC分类号: H01L29/792 H01L21/336

    摘要: A charge trapping layer in an element isolation region and that in an isolation region between a memory transistor and a selection transistor are removed so that the charges are not injected or trapped in the regions. Also, in an element isolation region, gate electrodes of each memory transistor are united at a position higher than a gate electrode of the selection transistor from a surface of a silicon substrate in an element isolation region, thereby reducing the capacitance between the memory transistor and the selection transistor.

    摘要翻译: 去除元件隔离区域中的电荷捕获层,以及在存储晶体管和选择晶体管之间的隔离区域中的电荷捕获层,使得电荷不被注入或被捕获在该区域中。 此外,在元件隔离区域中,每个存储晶体管的栅极电极从元件隔离区域中的硅衬底的表面在选择晶体管的栅电极的高位置处结合,从而减小存储晶体管和 选择晶体管。

    Semiconductor LED, opto-electronic integrated circuits (OEIC), and method of fabricating OEIC
    24.
    发明授权
    Semiconductor LED, opto-electronic integrated circuits (OEIC), and method of fabricating OEIC 有权
    半导体LED,光电集成电路(OEIC)以及制造OEIC的方法

    公开(公告)号:US08030668B2

    公开(公告)日:2011-10-04

    申请号:US11935904

    申请日:2007-11-06

    IPC分类号: H01L27/15

    摘要: A light emitting diode demonstrating high luminescence efficiency and comprising a Group IV semiconductor such as silicon or germanium equivalent thereto as a basic component formed on a silicon substrate by a prior art silicon process, and a fabricating method of waveguide thereof are provided. The light emitting diode of the invention comprises a first electrode for implanting electrons, a second electrode for implanting holes, and a light emitting section electrically connected to the first and the second electrode, wherein the light emitting section is made out of single crystalline silicon and has a first surface and a second surface facing the first surface, wherein with respect to plane orientation (100) of the first and second surfaces, the light emitting section crossing at right angles to the first and second surfaces is made thinner, and wherein a material having a high refractive index is arranged around the thin film section.

    摘要翻译: 提供了高发光效率的发光二极管,并且包括通过现有技术的硅工艺在硅衬底上形成的等价于其的硅或锗等IV族半导体作为基底部件,以及其波导管的制造方法。 本发明的发光二极管包括用于注入电子的第一电极,用于注入孔的第二电极和与第一和第二电极电连接的发光部分,其中发光部分由单晶硅制成, 具有面向第一表面的第一表面和第二表面,其中相对于第一表面和第二表面的平面取向(100),使与第一表面和第二表面成直角交叉的发光部分变薄,并且其中 具有高折射率的材料设置在薄膜部分周围。

    NON-VOLATILE SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING EMBEDDED NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE WITH SIDEWALL GATE
    25.
    发明申请
    NON-VOLATILE SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING EMBEDDED NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE WITH SIDEWALL GATE 有权
    非挥发性半导体器件及其制造嵌入式非易失性半导体存储器件的方法

    公开(公告)号:US20100105199A1

    公开(公告)日:2010-04-29

    申请号:US12652517

    申请日:2010-01-05

    IPC分类号: H01L21/28

    摘要: A method of manufacturing a non-volatile semiconductor memory device is provided which overcomes a problem of penetration of implanted ions due to the difference of optimal gate height in simultaneous formation of a self-align split gate type memory cell utilizing a side wall structure and a scaled MOS transistor. A select gate electrode to form a side wall in a memory area is formed to be higher than that of the gate electrode in a logic area so that the height of the side wall gate electrode of the self-align split gate memory cell is greater than that of the gate electrode in the logic area. Height reduction for the gate electrode is performed in the logic area before gate electrode formation.

    摘要翻译: 提供一种制造非挥发性半导体存储器件的方法,其克服了由于最佳栅极高度的不同而引入的注入离子的问题,同时形成利用侧壁结构的自对准分裂栅型存储单元和 缩放MOS晶体管。 形成在存储区域中形成侧壁的选择栅电极比逻辑区域中的栅电极高,使得自对准分离栅极存储单元的侧壁栅电极的高度大于 在逻辑区域的栅电极。 栅极电极的高度降低在栅电极形成之前的逻辑区域中进行。

    Nonvolatile memory device and semiconductor device
    26.
    发明授权
    Nonvolatile memory device and semiconductor device 有权
    非易失性存储器件和半导体器件

    公开(公告)号:US07529126B2

    公开(公告)日:2009-05-05

    申请号:US11472993

    申请日:2006-06-23

    IPC分类号: G11C11/34 G11C16/04

    CPC分类号: G11C16/10 G11C16/0433

    摘要: Disclosed here is a method for speeding up data writing and reducing power consumption by reducing the variation of the threshold voltage of each of non-volatile memory cells at data writing. When writing data in a memory cell, a voltage of about 8V is applied to the memory gate line, a voltage of about 5V is applied to the source line, a voltage of about 1.5V is applied to the selected gate line respectively. At that time, in the writing circuit, the writing pulse is 0, the writing latch output a High signal, and a NAND-circuit outputs a Low signal. And, a constant current of about 1iA flows in a constant current source transistor and the bit line is discharged by a constant current of about 1iA to flow a current in the memory cell.

    摘要翻译: 这里公开了一种通过在数据写入时减小每个非易失性存储单元的阈值电压的变化来加速数据写入并降低功耗的方法。 当在存储单元中写入数据时,约8V的电压被施加到存储器栅极线,大约5V的电压被施加到源极线,大约1.5V的电压分别施加到所选择的栅极线。 此时,在写入电路中,写入脉冲为0,写入锁存器输出高电平信号,NAND电路输出低电平信号。 并且,在恒定电流源晶体管中流动约1iA的恒定电流,并且通过约1iA的恒定电流放电位线以使存储单元中的电流流动。

    SEMICONDUCTOR NONVOLATILE MEMORY DEVICE
    27.
    发明申请
    SEMICONDUCTOR NONVOLATILE MEMORY DEVICE 有权
    半导体非易失性存储器件

    公开(公告)号:US20090014775A1

    公开(公告)日:2009-01-15

    申请号:US12233670

    申请日:2008-09-19

    IPC分类号: H01L29/00

    摘要: An operation scheme for operating stably a semiconductor nonvolatile memory device is provided.When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes.Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

    摘要翻译: 提供一种稳定运行半导体非易失性存储器件的操作方案。 当在分裂栅极结构的半导体非易失性存储器件中进行热空穴注入时,使用不随时间变化的交叉点来验证热孔注入。 因此,可以验证擦除状态,而不知道任何时变变化。 此外,通过将多次脉冲电压或多级电压施加到栅极部分进行编程或编程/擦除。

    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND ITS FABRICATION METHOD
    28.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND ITS FABRICATION METHOD 有权
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US20070210371A1

    公开(公告)日:2007-09-13

    申请号:US11653832

    申请日:2007-01-17

    IPC分类号: H01L29/788

    摘要: A memory cell includes a selective gate and a memory gate arranged on one side surface of the selective gate. The memory gate includes one part formed on one side surface of the selective gate and the other part electrically isolated from the selective gate and a p-well through an ONO layer formed below the memory gate. A sidewall-shaped silicon oxide is formed on side surfaces of the selective gate, and a sidewall-shaped silicon dioxide layer and a silicon dioxide layer are formed on side surfaces of the memory gate. The ONO layer formed below the memory gate is terminated below the silicon oxide, and prevents generation of a low breakdown voltage region in the silicon oxide near an end of the memory gate during deposition of the silicon dioxide layer.

    摘要翻译: 存储单元包括布置在选择栅极的一个侧表面上的选择栅极和存储栅极。 存储器栅极包括形成在选择栅极的一个侧表面上的一个部分和与选择栅极电隔离的另一部分,以及通过形成在存储栅极下方的ONO层的p阱。 在选择栅极的侧面上形成侧壁状的氧化硅,在存储栅的侧面形成侧壁状的二氧化硅层和二氧化硅层。 形成在存储器栅下方的ONO层终止在氧化硅的下方,并且防止在沉积二氧化硅层期间在存储栅的端部附近的硅氧化物中产生低的击穿电压区域。

    Semiconductor nonvolatile memory device
    29.
    发明申请
    Semiconductor nonvolatile memory device 失效
    半导体非易失性存储器件

    公开(公告)号:US20070183206A1

    公开(公告)日:2007-08-09

    申请号:US11727592

    申请日:2007-03-27

    IPC分类号: G11C11/34 G11C16/04

    摘要: An operation scheme for operating stably a semiconductor nonvolatile memory device is provided. When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes. Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

    摘要翻译: 提供一种稳定运行半导体非易失性存储器件的操作方案。 当在分裂栅极结构的半导体非易失性存储器件中进行热空穴注入时,使用不随时间变化的交叉点来验证热孔注入。 因此,可以验证擦除状态,而不知道任何时变变化。 此外,通过将多次脉冲电压或多级电压施加到栅极部分进行编程或编程/擦除。

    Nonvolatile memory device and semiconductor device
    30.
    发明授权
    Nonvolatile memory device and semiconductor device 有权
    非易失性存储器件和半导体器件

    公开(公告)号:US07085157B2

    公开(公告)日:2006-08-01

    申请号:US10805365

    申请日:2004-03-22

    IPC分类号: G11C11/34 G11C16/04

    CPC分类号: G11C16/10 G11C16/0433

    摘要: A method for speeding up data writing and reducing power consumption by reducing the variation of the threshold voltage of each of non-volatile memory cells at data writing. When writing data in a memory cell, a voltage of about 8V is applied to the memory gate line, a voltage of about 5V is applied to the source line, a voltage of about 1.5V is applied to the selected gate line respectively. At that time, in the writing circuit, the writing pulse is 0, the writing latch output a High signal, and a NAND-circuit outputs a Low signal. And, a constant current of about 1 ìA flows in a constant current source transistor and the bit line is discharged by a constant current of about 1 ìA to flow a current in the memory cell.

    摘要翻译: 一种用于通过在数据写入时减小每个非易失性存储单元的阈值电压的变化来加速数据写入和降低功耗的方法。 当在存储单元中写入数据时,约8V的电压被施加到存储器栅极线,大约5V的电压被施加到源极线,大约1.5V的电压分别施加到所选择的栅极线。 此时,在写入电路中,写入脉冲为0,写入锁存器输出高电平信号,NAND电路输出低电平信号。 并且,在恒定电流源晶体管中流动约1AA的恒定电流,并且通过约1μA的恒定电流放电位线以使存储器单元中的电流流动。