公开(公告)号：US07408012B1

公开(公告)日：2008-08-05

申请号：US11107830

申请日：2005-04-18

申请人： Brendan J. Kneafsey ,  Edward P. Scott

发明人： Brendan J. Kneafsey ,  Edward P. Scott

IPC分类号： C08F30/08

CPC分类号： C08F30/08 ,  Y10T428/2852

摘要： This invention relates to (meth)acrylate-based polymerizable compositions and adhesive systems prepared therefrom, which include a alkylated borohydride or tetraalkyl borane metal or ammonium salt and a polymerizable siloxane. The inventive compositions and adhesive systems are particularly well suited for bonding applications which involve at least one low energy bonding surface, for example, the polyolefins, polyethylene, and polypropylene.

摘要翻译： 本发明涉及由（甲基）丙烯酸酯系聚合性组合物及其制备的粘合剂体系，其包括烷基化硼氢化物或四烷基硼烷金属或铵盐和可聚合的硅氧烷。 本发明的组合物和粘合剂体系特别适用于涉及至少一种低能粘合表面的粘结应用，例如聚烯烃，聚乙烯和聚丙烯。

公开(公告)号：US06936664B2

公开(公告)日：2005-08-30

申请号：US10344944

申请日：2001-10-04

申请人： John G. Woods ,  Susanne D. Morrill ,  Jianzhao Wang ,  Brendan J. Kneafsey

发明人： John G. Woods ,  Susanne D. Morrill ,  Jianzhao Wang ,  Brendan J. Kneafsey

IPC分类号： C07D303/22 ,  C07D303/24 ,  C07D303/44 ,  C08G59/12 ,  C08G59/18 ,  C08G59/34 ,  C08G59/42 ,  C08G59/50 ,  C09J163/00 ,  C09J163/02 ,  C07D303/12 ,  C08L63/02 ,  H01L21/56 ,  H01L23/29

CPC分类号： C07D303/22 ,  C07D303/24 ,  C07D303/44 ,  C08G59/027 ,  C08G59/12 ,  C08G59/18 ,  C08G59/42 ,  C08G59/5026 ,  C09J163/00

摘要： The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components comprising (a) a curable epoxy component which is the reaction product of an epoxidized 1-alkenyl ether or 1-cycloalkenyl ether and a polycarboxylic acid, the reaction product being substantially free of unreacted acid or acid impurities; and (b) a curing agent for the epoxy component, wherein the reaction products of the epoxy composition are reworkable. The cured epoxy compositions of this invention contain thermally labile weak α-alkoxy ester linkages which provide for the reworkable aspect of the invention.

摘要翻译： 本发明公开了适用于电子部件的包封和底部填充的可再加工的环氧组合物，其包含（a）作为环氧化的1-链烯基醚或1-环烯基醚与多元羧酸的反应产物的可固化环氧组分，反应产物为 基本上不含未反应的酸或酸性杂质; 和（b）环氧组分的固化剂，其中环氧组合物的反应产物是可再加工的。 本发明的固化环氧组合物含有热不稳定的弱α-烷氧基酯键，其提供本发明的可再加工方面。

公开(公告)号：US20100178520A1

公开(公告)日：2010-07-15

申请号：US12180761

申请日：2008-07-28

申请人： Brendan J. Kneafsey ,  Edward P. Scott

发明人： Brendan J. Kneafsey ,  Edward P. Scott

IPC分类号： B32B27/00 ,  C08F230/08

CPC分类号： C08F30/08 ,  Y10T428/2852

摘要： This invention relates to (meth)acrylate-based polymerizable compositions and adhesive systems prepared therefrom, which include a alkylated borohydride or tetraalkyl borane metal or ammonium salt and a polymerizable siloxane. The inventive compositions and adhesive systems are particularly well suited for bonding applications which involve at least one low energy bonding surface, for example, the polyolefins, polyethylene, and polypropylene.

摘要翻译： 本发明涉及由（甲基）丙烯酸酯系聚合性组合物及其制备的粘合剂体系，其包括烷基化硼氢化物或四烷基硼烷金属或铵盐和可聚合的硅氧烷。 本发明的组合物和粘合剂体系特别适用于涉及至少一种低能粘合表面的粘结应用，例如聚烯烃，聚乙烯和聚丙烯。

公开(公告)号：US06828291B2

公开(公告)日：2004-12-07

申请号：US10276419

申请日：2002-11-15

申请人： Brendan J. Kneafsey ,  John Guthrie ,  David P. Melody

发明人： Brendan J. Kneafsey ,  John Guthrie ,  David P. Melody

IPC分类号： C11D300

CPC分类号： C09D9/005

摘要： A composition including at least one solvent for cured product and at least one gelling or solidifying agent. The invention also provides a composition described above which is in the form of a soft solid, for example, in the form of a stick. A pack is also provided, comprising (i) a shaped mass of a composition, which includes at least one solvent for a cured product and at least one gelling or solidifying agent and a container (1) for the composition. The container (1) has a mechanism for expelling the shaped mass.

摘要翻译： 一种组合物，其包含至少一种用于固化产物的溶剂和至少一种胶凝或固化剂。 本发明还提供了一种以软固体形式的组合物，例如以棒的形式。 还提供了一种包装，其包括（i）组合物的成形块，其包括用于固化产物的至少一种溶剂和至少一种胶凝或固化剂和用于该组合物的容器（1）。 容器（1）具有排出成形体的机构。

公开(公告)号：US4867817A

公开(公告)日：1989-09-19

申请号：US930194

申请日：1987-02-04

申请人： Brendan J. Kneafsey ,  John M. Rooney ,  Conor F. MacAogain

发明人： Brendan J. Kneafsey ,  John M. Rooney ,  Conor F. MacAogain

IPC分类号： B01J19/10 ,  B29C67/24

CPC分类号： B29C67/247 ,  B01J19/10 ,  B29C2791/008 ,  Y10T156/1798

摘要： Chemical compositions such as adhesive, sealing or coating compositions containing one or more microencapsulated ingredients are activated by directly contacting an ultrasonic device (2) to the composition (8) and sonicating the composition to rupture the microcapsules. The method may be carried out in a sonication chamber (1) in which the ultrasonic device (2) is immersed in the composition (8) and from which the composition flows before it sets. Alternatively the ultrasonic energy may be applied to the composition in situ.

摘要翻译： 包含一种或多种微囊化成分的粘合剂，密封剂或涂料组合物的化学组合物通过将超声波装置（2）直接接触组合物（8）并超声处理组合物来破坏微胶囊来活化。 该方法可以在其中超声波装置（2）浸入组合物（8）中的超声处理室（1）中进行，并且组合物在其组合之前流动。 或者，超声能量可以原位施加到组合物上。

公开(公告)号：US07189463B2

公开(公告)日：2007-03-13

申请号：US10399230

申请日：2001-10-23

申请人： Brendan J. Kneafsey ,  Gerry Coughlan

发明人： Brendan J. Kneafsey ,  Gerry Coughlan

IPC分类号： C08F4/00

CPC分类号： C08F4/52 ,  C09J4/00 ,  Y10T428/31504 ,  Y10T428/31855 ,  Y10T428/31928 ,  Y10T428/31935 ,  C08F220/18

摘要： Quaternary boron salts are used as initiators of polymerisation in adhesive compositions for bonding low surface energy substrates such as polyolefins. The quaternary boron salts are of the formula I wherein R1 is C1–C10 alkyl, R2, R3 and R4, which may be the same or different, are, C1–C10 alkyl or C3–C10 cycloalkyl, phenyl, or phenyl-substituted C1–C10 alkyl or C3–C10 cycloalkyl, provided that any two of R1–R4 may optionally be part of a carbocyclic ring, and M+ is a metal ion or a quaternary ammonium ion. Particular examples of initiator compounds include sodium tetraethyl borate and lithium tetraethyl borate, lithium phenyl triethyl borate and tetramethylammonium phenyl triethyl borate.

摘要翻译： 在粘合剂组合物中用作键合低表面能基底如聚烯烃的季铵硼盐作为聚合引发剂。 季硼盐具有式I的化合物，其中R 1是C 1 -C 10烷基，R 2， R 3和R 4可以相同或不同，是C 1 -C 10烷基， 烷基或C 3 -C 10环烷基，苯基或苯基取代的C 1 -C 10烷基或 C 3 -C 10环烷基，条件是R 1〜R 4中的任意两个可以任选地为 碳环，M + +是金属离子或季铵离子。 引发剂化合物的具体实例包括硼酸四乙酯和硼酸四乙酯锂，苯基硼酸三乙酯和苯基三乙基硼酸四甲基铵。

公开(公告)号：US07108920B1

公开(公告)日：2006-09-19

申请号：US09885269

申请日：2000-09-15

申请人： Lawrence N. Crane ,  Mark M. Konarski ,  Brendan J. Kneafsey ,  Afranio Torres-Filho ,  Z. Andrew Szczepaniak

发明人： Lawrence N. Crane ,  Mark M. Konarski ,  Brendan J. Kneafsey ,  Afranio Torres-Filho ,  Z. Andrew Szczepaniak

IPC分类号： B32B27/38 ,  H01L21/56 ,  C08G75/00 ,  C08L63/00 ,  C08L81/00

CPC分类号： H01L24/98 ,  C08G75/08 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/28 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/11 ,  H01L2224/1132 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

摘要： This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate, as well as compounds useful in such compositions. The compositions include compounds having a thermally cleavable linkage, and include an episulfide group within the compound. The compositions of this invention are reworkable when subjected to appropriate conditions.

摘要翻译： 本发明涉及用于安装到诸如芯片尺寸或芯片尺寸封装（“CSP”），球栅阵列（“BGAs”），焊盘网格阵列（“LGAs”）等电路板半导体器件上的热固性树脂组合物，以及 其中每个在载体基板上具有诸如大规模集成（“LSI”）的半导体芯片，以及可用于这种组合物的化合物。 组合物包括具有可热切割键的化合物，并且在化合物内包括环硫基。 当经受适当条件时，本发明的组合物可重复使用。

公开(公告)号：US06939932B2

公开(公告)日：2005-09-06

申请号：US10419202

申请日：2003-04-21

申请人： Brendan J. Kneafsey ,  Gerry Coughlan

发明人： Brendan J. Kneafsey ,  Gerry Coughlan

IPC分类号： C07D203/08 ,  C07F5/02 ,  C07J41/00 ,  C08F4/00 ,  C08F4/52 ,  C08K3/38 ,  C08K5/3412 ,  C09J4/02

CPC分类号： C08F4/52 ,  C08F4/00 ,  C09J133/066 ,  Y10T428/31855 ,  C08F2220/1875 ,  C08F220/20

摘要： Use of an initiator system comprising: a combination of an organoborane and a polyaziridine, in a ratio of aziridine groups to boron atoms of greater than 1.3:1, as an initiator of polymerisation in an adhesive composition for bonding a low surface energy substrate; provided that the initiator system does not contain more than a trace amount of a complex of organoborane with a complexing agent selected from: an amine other than a polyaziridine; a complexing agent comprising at least one hydroxide; a complexing agent comprising at least one alkoxide; or amidine complexing agent. An initiator system as described is of the formula VI: wherein R1 is C1-C10 alkyl, R2 and R3, which may be the same or different, are, C1-C10 alkyl or C3-C10 cycloalkyl, phenyl, or phenyl-substituted C1-C10 alkyl or C3-C10 cycloalkyl, provided that any two of R1-R3 may optionally be part of a carbocyclic ring; R5 is a polyvalent radical, R6 and R7 which may be the same or different are H or C1-C10 alkyl, particularly C1-4 alkyl, especially methyl, and y is a number of at least 2, particularly 2-4, especially 3, and the value of x multiplied by y is greater than 1.3. Particular examples of initiator compounds include, trimethylol propane tris(3-(2-methyl aziridino))propionate and trimethylol propane tris-3-N-aziridinyl propionate.

摘要翻译： 1.一种引发剂体系的用途，包括：作为用于粘合低表面能底物的粘合剂组合物中的聚合引发剂的氮丙啶与硼原子的比例大于1.3:1的有机硼烷和聚氮丙啶的组合; 条件是引发剂体系不含有微量的有机硼烷与选自以下的络合剂的络合物：除了多氮丙啶之外的胺; 包含至少一种氢氧化物的络合剂; 包含至少一种醇盐的络合剂; 或脒络合剂。 所述的引发剂体系是式VI：其中R 1是C 1 -C 10烷基，R 2， 其可以相同或不同，为C 1 -C 10烷基或C 3 -C 10烷基， 苯基或苯基取代的C 1 -C 10烷基或C 3 -C 12亚烷基或C 3 -C 10 - > -C 10环烷基，条件是R 1 -R 3中的任何两个可以任选地是碳环的一部分; R 5是多价基团，R 6和R 7可以相同或不同，是H或C 1〜 特别是C 1-4烷基，特别是甲基，Y是至少2个，特别是2-4个，特别是3个，和 x乘以y的值大于1.3。 引发剂化合物的具体实例包括三羟甲基丙烷三（3-（2-甲基氮丙啶））丙酸酯和三羟甲基丙烷三-3-N-氮丙啶基丙酸酯。

公开(公告)号：US06867271B1

公开(公告)日：2005-03-15

申请号：US10437031

申请日：2003-05-14

申请人： Eerik Maandi ,  Brendan J. Kneafsey

发明人： Eerik Maandi ,  Brendan J. Kneafsey

IPC分类号： C08F4/12

CPC分类号： C08F4/52 ,  C09D4/00 ,  C09D133/08

摘要： This invention relates to (meth)acrylate based polymerizable compositions and multipart adhesive systems prepared therefrom, which include an aziridine-containing compound in a carrier material with which the aziridine-containing compound is unreactive. The inventive composition demonstrates a flash point above 140° F., desirably above 200° F., for each of the parts of the adhesive system. To achieve the physical properties of the inventive compositions and adhesive systems, it is desirable for the carrier material to have such flash points; however, provided that in their entirety the inventive compositions and adhesive systems have such flash points, it is not necessary for the carrier material itself to have such flash points. The inventive compositions and adhesive systems also include a package for controlling the rate of cure and indicating the extent of cure. The inventive compositions and adhesive systems are particularly well suited to bonding applications which involve at least one low energy bonding surface, for example, polyolefin, polyethylene, and polypropylene surfaces.

摘要翻译： 本发明涉及由（甲基）丙烯酸酯系聚合的组合物和由其制备的多部分粘合剂体系，其包括在含氮丙啶的化合物不反应的载体材料中的含氮丙啶的化合物。 本发明的组合物对于粘合剂体系的每个部分显示高于140°F的闪点，优选高于200°F。 为了达到本发明组合物和粘合剂体系的物理性能，载体材料最好具有这样的闪点; 然而，只要本发明的组合物和粘合剂体系全部具有这样的闪点，载体材料本身就不必具有这样的闪点。 本发明的组合物和粘合剂体系还包括用于控制固化速率并指示固化程度的包装。 本发明的组合物和粘合剂体系特别适用于涉及至少一个低能量结合表面的粘合应用，例如聚烯烃，聚乙烯和聚丙烯表面。

公开(公告)号：US06852193B2

公开(公告)日：2005-02-08

申请号：US10276416

申请日：2001-05-30

申请人： Brendan J. Kneafsey ,  John Guthrie ,  Gerard Coughlan

发明人： Brendan J. Kneafsey ,  John Guthrie ,  Gerard Coughlan

IPC分类号： C08F220/28 ,  C08F222/10 ,  C09J4/00 ,  C09J4/06 ,  C09J167/06

CPC分类号： C09J4/00 ,  C08F2220/281 ,  C08F2222/108 ,  C09J4/06 ,  C09J167/06 ,  Y10S206/813 ,  Y10T428/31663 ,  Y10T428/31855 ,  C08F220/06

摘要： A composition including at least one anaerobically polymerizable compound; and at least one condensation product of an aldehyde and or ketone/with a polyol. The invention also provides a composition as described above which is in the form of a soft solid, for example, in the form of a stick. A two-part composition is provided, comprising a first part containing at least one polymerizable compound; and a second part containing at least one curing component for polymerizing the composition, wherein at least one of the first or second parts additionally comprises at least one gelling or solidifying agent. A kit is provided comprising the composition according to the invention which includes at least one primer component and at least one carrier solvent for the primer component, and a second composition which includes at least one anaerobically polymerizable compound and at least one condensation product of an aldehyde and or ketone/with a polyol. A pack is also provided, comprising: a shaped mass of a composition which includes at least one anaerobically polymerizable compound and at least one condensation product of an aldehyde and or ketone/with a polyol, and a container (1) for the composition. The container (1) has a mechanism for expelling the shaped mass.

摘要翻译： 包含至少一种可厌氧聚合的化合物的组合物; 和至少一种醛和/或酮/与多元醇的缩合产物。 本发明还提供如上所述的组合物，其为软固体形式，例如以棒的形式。 提供两部分组合物，其包含含有至少一种可聚合化合物的第一部分; 以及第二部分，其包含至少一种用于使所述组合物聚合的固化组分，其中所述第一或第二部分中的至少一个还包含至少一种胶凝或固化剂。 提供了一种试剂盒，其包含根据本发明的组合物，其包含至少一种底漆组分和用于底漆组分的至少一种载体溶剂，以及第二组合物，其包含至少一种可空气聚合的化合物和至少一种醛的缩合产物 和/酮/与多元醇。 还提供了一种组合物，其包括：组合物的成型体，其包含至少一种可惰性可聚合的化合物和至少一种醛和/或酮/多元醇的缩合产物和用于该组合物的容器（1）。 容器（1）具有排出成形体的机构。