Abstract:
A method of designing conductive interconnects includes determining a residual spacing value based at least in part on an integer multiple of a interconnect trace pitch and a designated cell height. The method also includes allocating the residual spacing to at least one interconnect trace width or interconnect trace space within the interconnect trace pitch.
Abstract:
A CMOS device with a plurality of PMOS transistors each having a PMOS drain and a plurality of NMOS transistors each having an NMOS drain includes a first interconnect on an interconnect level extending in a length direction to connect the PMOS drains together. A second interconnect on the interconnect level extends in the length direction to connect the NMOS drains together. A set of interconnects on at least one additional interconnect level couple the first interconnect and the second interconnect together. A third interconnect on the interconnect level extends perpendicular to the length direction and is offset from the set of interconnects to connect the first interconnect and the second interconnect together.
Abstract:
A standard cell CMOS device includes metal oxide semiconductor transistors having gates formed from gate interconnects. The gate interconnects extend in a first direction. The device further includes power rails that provide power to the transistors. The power rails extend in a second direction orthogonal to the first direction. The device further includes M1 layer interconnects extending between the power rails. At least one of the M1 layer interconnects is coupled to at least one of the transistors. The M1 layer interconnects are parallel to the gate interconnects and extend in the first direction only.
Abstract:
A first interconnect on an interconnect level connects a first subset of PMOS drains together of a CMOS device. A second interconnect on the interconnect level connects a second subset of the PMOS drains together. The second subset of the PMOS drains is different than the first subset of the PMOS drains. The first interconnect and the second interconnect are disconnected on the interconnect level. A third interconnect on the interconnect level connects a first subset of NMOS drains together of the CMOS device. A fourth interconnect on the interconnect level connects a second subset of the NMOS drains together. The second subset of the NMOS drains is different than the first subset of the NMOS drains. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, and fourth interconnects are coupled together through at least one other interconnect level.
Abstract:
Systems and methods for powering up circuits are described herein. In one embodiment, a method for power up comprises comparing a voltage of a first supply rail with a voltage of a second supply rail, and determining whether the voltage of the first supply rail is within a predetermined amount of the voltage of the second supply rail for at least a predetermined period of time based on the comparison. The method also comprises initiating switching of a plurality of switches coupled between the first and second supply rails upon a determination that the voltage of the first supply rail is within the predetermined amount of the voltage of the second supply rail for at least the predetermined period of time.
Abstract:
A MOS device includes first, second, third, and fourth interconnects. The first interconnect extends on a first track in a first direction. The first interconnect is configured in a metal layer. The second interconnect extends on the first track in the first direction. The second interconnect is configured in the metal layer. The third interconnect extends on a second track in the first direction. The third interconnect is configured in the metal layer. The second track is parallel to the first track. The third interconnect is coupled to the second interconnect. The second and third interconnects are configured to provide a first signal. The fourth interconnect extends on the second track in the first direction. The fourth interconnect is configured in the metal layer. The fourth interconnect is coupled to the first interconnect. The first and fourth interconnects are configured to provide a second signal different than the first signal.
Abstract:
A CMOS device including a standard cell includes first and second transistors with a gate between the first and second transistors. One active region extends between the first and second transistors and under the gate. In a first configuration, when drains/sources of the first and second transistors on the sides of the gate carry the same signal, the drains/sources are connected together and to the gate. In a second configuration, when a source of the first transistor on a side of the gate is connected to a source voltage and a drain/source of the second transistor on the other side of the gate carries a signal, the source of the first transistor is connected to the gate. In a third configuration, when sources of the first and second transistors on the sides of the gate are connected to a source voltage, the gate floats.
Abstract:
A latch-based memory includes a plurality of slave latches arranged in rows and columns. Each column of slave latches receives a latched data signal from a corresponding master latch. Each row includes a clock gating circuit and a corresponding reset circuit. If a row is active for a write operation, the active row's clock gating circuit passes a write clock to the active row's slave latches. Conversely, the clock gating circuit for an inactive row gates the write clock to the inactive row's slave latches by passing a held version of the write clock in a first clock state to the inactive row's slave latches. While a reset signal is asserted, each reset circuit gates the write clock by passing the held version of the write clock in the first clock state to the slave latches in the reset circuit's row.