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21.发明授权公开(公告)号：US10101756B2
公开(公告)日：2018-10-16
申请号：US14446258
申请日：2014-07-29
Applicant: QUALCOMM INCORPORATED
Inventor： Rajat Mittal , Hee Jun Park , Young Hoon Kang
Abstract: Systems, methods, and computer programs are disclosed for reducing leakage power of a system on chip (SoC). One such method comprises monitoring a plurality of temperature differentials across a respective plurality of thermoelectric coolers on a system on chip (SoC). Each of the thermoelectric coolers is dedicated to a corresponding one of a plurality of chip sections on the SoC. The thermoelectric coolers are controlled based on the plurality of temperature differentials to minimize a sum of a combined power consumption of the plurality of chip sections and the plurality of corresponding dedicated thermoelectric coolers.
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公开(公告)号：US10061331B2
公开(公告)日：2018-08-28
申请号：US14603058
申请日：2015-01-22
Applicant: QUALCOMM Incorporated
Inventor： Mehdi Saeidi , Rajat Mittal , Arpit Mittal , Ryan Michael Coutts
CPC classification number: G05D23/1917 , G01K3/08 , G01K3/10 , G05B15/02 , G06F1/206 , G06F1/3206 , G06F1/3243 , G06F1/3296
Abstract: In one embodiment, a method of temperature control comprises receiving temperature readings from a temperature sensor on a chip, calculating one or more second derivatives of temperature with respect to time based on the temperature readings, and determining whether to perform temperature mitigation on the chip based on the one or more calculated second derivatives of temperature.
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公开(公告)号：US09943008B2
公开(公告)日：2018-04-10
申请号：US15087864
申请日：2016-03-31
Applicant: QUALCOMM Incorporated
Inventor： Rajat Mittal , Mehdi Saeidi , Vivek Sahu , Ryan Coutts
CPC classification number: H05K7/2039 , H01L41/042 , H01L41/0926 , H01L41/0973 , H05K7/20445 , H05K7/20472
Abstract: An electronic device includes an integrated circuit, a flexible heat spreader, an actuator, and a controller. The actuator is coupled to the flexible heat spreader and the controller is configured to control the actuator between a first actuation mode and a second actuation mode. When in the first actuation mode, the actuator positions the flexible heat spreader with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit. When in the second actuation mode, the actuator positions the flexible heat spreader in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit.
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24.发明申请公开(公告)号：US20180011520A1
公开(公告)日：2018-01-11
申请号：US15205678
申请日：2016-07-08
Applicant: QUALCOMM Incorporated
Inventor： Mehdi Saeidi , Melika Roshandell , Rajat Mittal
CPC classification number: G06F1/206 , G01R31/00 , G06F1/203 , G06F1/3287 , G06F1/3296
Abstract: A method includes generating temperature information from a plurality of temperature sensors within a computing device; and processing the temperature information to generate voltage reduction steps based on an observed rate of change of the temperature information.
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25.发明授权公开(公告)号：US09829941B1
公开(公告)日：2017-11-28
申请号：US15242483
申请日：2016-08-19
Applicant: QUALCOMM Incorporated
Inventor： Mehdi Saeidi , Melika Roshandell , Rajat Mittal , Ryan Coutts
CPC classification number: G06F1/206 , H04M1/0202 , H04M2250/12
Abstract: A mobile device includes an exterior housing, a display, a capacitive sensor, a temperature sensor, and a controller. The capacitive sensor is coupled to the exterior housing at a backside of the mobile device and the temperature sensor is coupled to one or more components of the mobile device. The controller is coupled to the capacitive sensor and to the temperature sensor. The controller is configured to adjust a temperature threshold of the mobile device in response to detecting the presence of a case installed on the exterior housing. The controller is also configured to adjust one or more operating parameters of the mobile device to control a temperature of the exterior housing to below the temperature threshold based on the output of the capacitive sensor and one or more readings of the temperature sensor.
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Patent Agency Ranking
公开(公告)号：US20170281010A1
公开(公告)日：2017-10-05
申请号：US15456779
申请日：2017-03-13
Applicant: QUALCOMM INCORPORATED
Inventor： Mehdi Saeidi , Rajat Mittal , Melika Roshandell
CPC classification number: A61B5/01 , G06F1/203 , G06F1/206 , G06F1/3203 , G06F1/3287 , G06F1/3296 , Y02D10/16
Abstract: A method includes: acquiring temperature values from a plurality of temperature sensors spatially distributed within a device; using the temperature values, calculating skin temperature values corresponding to each of the temperature sensors; comparing the skin temperature values to a first temperature threshold; in response to determining that at least one of the skin temperature values exceeds the first temperature threshold, measuring temperature over time; comparing the temperature over time to a second temperature threshold; and in response to determining that the temperature over time exceeds the second temperature threshold, reducing power consumption of the device.
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公开(公告)号：US20170168514A1
公开(公告)日：2017-06-15
申请号：US14963790
申请日：2015-12-09
Applicant: QUALCOMM Incorporated
Inventor： Rajat Mittal , Mehdi Saeidi , Arpit Mittal , Emil Rahim
CPC classification number: G05F1/463 , G01K13/00 , G06F1/206 , G06F1/3206
Abstract: In one embodiment, a temperature management system comprises a plurality of temperature sensors on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the temperature sensors, to determine a plurality of power values based on the temperature readings, to determine a plurality of temperature values based on the determined power values, the determined temperature values corresponding to a plurality of different locations on the chip, and to estimate a temperature of a hotspot on the chip based on the determined temperature values.
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公开(公告)号：US09652005B2
公开(公告)日：2017-05-16
申请号：US14849842
申请日：2015-09-10
Applicant: QUALCOMM Incorporated
Inventor： Mehdi Saeidi , Emil Rahim , Rajat Mittal , Arpit Mittal
Abstract: A heat transfer component of a smart watch captures at least a portion of heat emitted by one or more electronic components located within an enclosure of the smart watch. The heat transfer component transfers at least a portion of the captured heat to a wrist band outside the enclosure of the smart watch. The wrist band allows for dissipation of at least a portion of the transferred heat through at least one surface of the wrist band.
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公开(公告)号：US20170060177A1
公开(公告)日：2017-03-02
申请号：US14843973
申请日：2015-09-02
Applicant: QUALCOMM Incorporated
Inventor： Emil RAHIM , Mehdi Saeidi , Arpit Mittal , Rajat Mittal
CPC classification number: G06F1/163 , G02B27/0176 , G06F1/203 , G06F3/011 , H05K7/20127 , H05K7/20509
Abstract: Systems and methods relate to thermal management of electronic headsets, such as virtual reality headsets. An electronic headset includes a body which can hold a processing system. A heat spreader is attached to the body, wherein the heat spreader includes a chimney. The chimney is designed to dissipate heat generated by the processing system. The heat spreader can be controlled to extend the chimney based on the heat perceived on external surfaces of the electronic headset which can come in contact with a user's skin. The chimney includes an air gap and provides a passive cooling system.
Abstract translation: 系统和方法涉及电子耳机的热管理，例如虚拟现实耳机。 电子耳机包括可容纳处理系统的主体。 散热器附接到身体，其中散热器包括烟囱。 烟囱旨在消散处理系统产生的热量。 可以根据能够与用户皮肤接触的电子耳机的外表面感觉到的热量来控制散热器来扩展烟囱。 烟囱包括气隙，并提供被动冷却系统。
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30.发明授权Algorithm for preferred core sequencing to maximize performance and reduce chip temperature and power 有权优化核心测序的算法可最大限度地提高性能并降低芯片的温度和功率公开(公告)号：US09557797B2
公开(公告)日：2017-01-31
申请号：US14319393
申请日：2014-06-30
Applicant: QUALCOMM Incorporated
Inventor： Rajat Mittal , Mehdi Saeidi , Tao Xue , Ronald Frank Alton , Rajit Chandra , Sachin Dasnurkar
CPC classification number: G06F1/3234 , G06F1/28 , G06F1/3203 , G06F1/3206 , G06F1/329 , G06F1/3293 , G06F9/5094 , Y02D10/122 , Y02D10/22 , Y02D10/24
Abstract: Aspects include computing devices, systems, and methods for selecting preferred processor core combinations for a state of a computing device. In an aspect, a state of a computing device containing the multi-core processor may be determined. A number of current leakage ratios may be determined by comparing current leakages of the processor cores to current leakages of the other processor cores. The ratios may be compared to boundaries for the state of the computing device in respective inequalities. A processor core associated with a number of boundaries may be selected in response to determining that the respective inequalities are true. The boundaries may be associated with a set of processor cores deemed preferred for an associated state of the computing device. The processor core present in the set of processor cores for each boundary of a true inequality may be the selected processor core.
Abstract translation: 方面包括用于为计算设备的状态选择优选处理器核心组合的计算设备，系统和方法。 在一方面，可以确定包含多核处理器的计算设备的状态。 可以通过将处理器核心的当前泄漏与其他处理器核心的当前泄漏进行比较来确定多个电流泄漏比。 可以将这些比率与各个不等式中的计算装置的状态的边界进行比较。 响应于确定相应的不等式是真实的，可以选择与多个边界相关联的处理器核心。 边界可以与被认为对于计算设备的相关状态优选的一组处理器核心相关联。 存在于真正不等式的每个边界的处理器核心集合中的处理器核心可以是所选择的处理器核心。
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