公开(公告)号：US08381966B2

公开(公告)日：2013-02-26

申请号：US13036086

申请日：2011-02-28

Applicant: Rajneesh Kumar ,  Jae-Woong Nah ,  Eric D. Perfecto

Inventor： Rajneesh Kumar ,  Jae-Woong Nah ,  Eric D. Perfecto

IPC: B23K31/02 ,  H01L21/44

CPC classification number: B23K1/0016

Abstract: A first substrate mounted to a bonder head and a second substrate mounted to a base plate are held at different elevated temperatures at the time of bonding that provide a substantially matched thermal expansion between the second substrate and the first substrate relative to room temperature. Further, the temperature of the solder material portions and the second substrate is raised at least up to the melting temperature after contact. The distance between the first substrate and the second substrate can be modulated to enhance the integrity of solder joints. Once the distance is at an optimum, the bonder head is detached, and the bonded structure is allowed to cool to form a bonded flip chip structure. Alternately, the bonder head can control the cooling rate of solder joints by being attached to the chip during cooling step.

Abstract translation: 安装到接合头的第一衬底和安装到基板的第二衬底在接合时被保持在不同的升高的温度，从而相对于室温在第二衬底和第一衬底之间提供基本匹配的热膨胀。 此外，焊接材料部分和第二基板的温度至少升高到接触后的熔融温度。 第一基板和第二基板之间的距离可被调制以增强焊点的完整性。 一旦该距离处于最佳状态，就将分离头拆下，并使粘结结构冷却以形成结合的倒装芯片结构。 或者，焊接头可以在冷却步骤期间通过附接到芯片来控制焊点的冷却速度。

公开(公告)号：US08165021B2

公开(公告)日：2012-04-24

申请号：US11899935

申请日：2007-09-05

Applicant: Prasad Prabhakar Jogalekar ,  Arnold Mark Bilstad ,  Rajneesh Kumar

Inventor： Prasad Prabhakar Jogalekar ,  Arnold Mark Bilstad ,  Rajneesh Kumar

IPC: G01R31/08 ,  G06F11/00 ,  G08C15/00 ,  H04J1/16 ,  H04J3/14 ,  H04L1/00 ,  H04L12/26 ,  H04L12/28 ,  H04L12/56

CPC classification number: H04L47/824 ,  H04L47/10 ,  H04L47/70 ,  H04L47/805 ,  H04L47/822

Abstract: In one embodiment, a network device receives a request from a client in association with a connection, where the request indicates an amount of one or more resources that is requested to support the connection. The network device determines whether the amount of the resources is available. The network device may then allocate a level of the resources to the connection according to whether the amount of the resources is available.

Abstract translation: 在一个实施例中，网络设备从连接中接收来自客户端的请求，其中请求指示被请求支持连接的一个或多个资源的量。 网络设备确定资源的数量是否可用。 然后，网络设备可以根据资源的数量是否可用来向该连接分配一个资源级别。

公开(公告)号：US08129230B2

公开(公告)日：2012-03-06

申请号：US12538965

申请日：2009-08-11

Applicant: Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

Inventor： Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

IPC: H01L21/00

CPC classification number: H01L21/563 ,  H01L23/562 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.

Abstract translation: 提供一种制造芯片封装的方法。 芯片封装包括层叠体，芯片和介于芯片和层压体之间的导电元件，信号在芯片和层压体之间传输。 该方法包括将第一底部填充物分配到在芯片的相对面和层压体之间限定的空间中，并且至少在芯片边缘的一部分处分配第二底部填充物，第二底部填充物包括高纵横比材料。

公开(公告)号：US20110037181A1

公开(公告)日：2011-02-17

申请号：US12538965

申请日：2009-08-11

Applicant: Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

Inventor： Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

IPC: H01L23/28 ,  H01L21/56

CPC classification number: H01L21/563 ,  H01L23/562 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.

Abstract translation: 提供一种制造芯片封装的方法。 芯片封装包括层叠体，芯片和介于芯片和层压体之间的导电元件，信号在芯片和层压体之间传输。 该方法包括将第一底部填充物分配到在芯片的相对面和层压体之间限定的空间中，并且至少在芯片边缘的一部分处分配第二底部填充物，第二底部填充物包括高纵横比材料。

公开(公告)号：US07816785B2

公开(公告)日：2010-10-19

申请号：US12357744

申请日：2009-01-22

Applicant: Sushumna Iruvanti ,  Randall G. Kemink ,  Rajneesh Kumar ,  Steven P. Ostrander ,  Prabjit Singh

Inventor： Sushumna Iruvanti ,  Randall G. Kemink ,  Rajneesh Kumar ,  Steven P. Ostrander ,  Prabjit Singh

IPC: H01L23/10

CPC classification number: H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a composition of non-silicone organics exhibiting thermal conductivity of approximately 5.5 W/mK or greater and a compressed bond-line thickness of approximately 100 microns or less using a compressive force of approximately 100 psi or less.

Abstract translation: 提供了一种用于半导体器件的改进的热界面材料。 更具体地，提供了用于热界面材料的低压缩力，非硅氧烷，高导热性配方。 热界面材料包括使用约100psi或更小的压缩力显示约5.5W / mK或更高的导热率和约100微米或更小的压缩粘合线厚度的非硅氧烷有机物的组合物。

公开(公告)号：US07486658B2

公开(公告)日：2009-02-03

申请号：US11192706

申请日：2005-07-29

Applicant: Rajneesh Kumar

Inventor： Rajneesh Kumar

IPC: H04J3/06

CPC classification number: H04N21/6437 ,  H04J3/0638 ,  H04L47/10 ,  H04L47/14 ,  H04L47/2416 ,  H04L47/286 ,  H04N21/4305 ,  H04N21/64322 ,  H04W28/10 ,  H04W56/00 ,  H04W84/12

Abstract: A method and system directed to negotiating and triggering media stream synchronization at the link layer in a QoS-enabled 802.11 WLAN, or other wireless, network. In one implementation, the present invention allows for improved performance of streaming network applications, such as video conferencing, over wireless links. In one implementation, the present invention also provides an optional mechanism whereby a mobile station can signal a need for on-the-fly throttling, if an application on the mobile detects that there is a need for better synchronization of two streams, such as a lower priority stream to a higher priority stream.

Abstract translation: 一种用于在启用QoS的802.11 WLAN或其他无线网络中的链路层协商和触发媒体流同步的方法和系统。 在一个实现中，本发明允许通过无线链路改进诸如视频会议之类的流媒体网络应用的性能。 在一个实施方式中，本发明还提供了一种可选的机构，其中移动台可以发出对即时节流的需要，如果移动台上的应用检测到需要两个流的更好的同步，诸如 较低优先级流到较高优先级流。

公开(公告)号：US20070242649A1

公开(公告)日：2007-10-18

申请号：US11405319

申请日：2006-04-17

Applicant: Rajneesh Kumar ,  Ashish Chotai ,  Aseem Asthana ,  Sravan Vadlakonda ,  Girish Variyath ,  Vikram Jayaraman ,  Pradeep Bheda

Inventor： Rajneesh Kumar ,  Ashish Chotai ,  Aseem Asthana ,  Sravan Vadlakonda ,  Girish Variyath ,  Vikram Jayaraman ,  Pradeep Bheda

IPC: H04Q7/28

CPC classification number: H04W72/0406 ,  H04W4/16 ,  H04W84/16

Abstract: In one embodiment, a method for requesting wireless network resources includes transmitting a network resource request to a wireless network in response to a session initiation message from a session signaling node and, responsive to an indication that the wireless network lacks sufficient resources, conditionally transmitting a camp-on information message to the session signaling node.

Abstract translation: 在一个实施例中，用于请求无线网络资源的方法包括响应于来自会话信令节点的会话发起消息向无线网络发送网络资源请求，并且响应于无线网络缺少足够资源的指示，有条件地发送 驻留信息消息发送到会话信令节点。

公开(公告)号：US08686749B2

公开(公告)日：2014-04-01

申请号：US12770948

申请日：2010-04-30

Applicant: Brian M. Erwin ,  David L. Gardell ,  James N. Humenik ,  Rajneesh Kumar ,  John Lawson

Inventor： Brian M. Erwin ,  David L. Gardell ,  James N. Humenik ,  Rajneesh Kumar ,  John Lawson

IPC: G01R31/02

CPC classification number: G01R31/2884 ,  G01R31/2874

Abstract: Non-corrosive thermal interface materials for use in a test structure and method of use. The test structure includes a heat sink for dissipating heat away from a device under test. The test structure further includes a non-corrosive thermal interface material disposed between the heat sink and the device under test. The non-corrosive thermal interface material is capable of withstanding test conditions for at least 60 minutes for at least 115° C. without staining or leaving residue on the device under test after baking.

Abstract translation: 用于测试结构和使用方法的非腐蚀性热界面材料。 测试结构包括散热器，用于从被测设备中散热。 测试结构还包括设置在散热器和被测器件之间的非腐蚀性热界面材料。 非腐蚀性热界面材料能够耐受至少60分钟的测试条件至少115℃，而不会在烘烤后在被测设备上污染或留下残留物。

公开(公告)号：US08341663B2

公开(公告)日：2012-12-25

申请号：US11870406

申请日：2007-10-10

Applicant: Shmuel Shaffer ,  Mukul Jain ,  Labhesh Patel ,  Sanjeev Kumar ,  Sravan Vadlakonda ,  Arthur Gerald Howarth ,  Ashish P. Chotai ,  Aseem Asthana ,  Rajneesh Kumar ,  Shantanu Sarkar

Inventor： Shmuel Shaffer ,  Mukul Jain ,  Labhesh Patel ,  Sanjeev Kumar ,  Sravan Vadlakonda ,  Arthur Gerald Howarth ,  Ashish P. Chotai ,  Aseem Asthana ,  Rajneesh Kumar ,  Shantanu Sarkar

IPC: H04N7/10 ,  H04N7/025

CPC classification number: H04N7/163 ,  H04N21/4147 ,  H04N21/4333 ,  H04N21/4334 ,  H04N21/44004 ,  H04N21/44008 ,  H04N21/458 ,  H04N21/8456

Abstract: In one embodiment, a Media Analysis and Delivery System obtains a set of media delivery rules, wherein the set of media delivery rules includes one or more triggers, each of the triggers identifying a topic of interest. The Media Analysis and Delivery System examines a media stream for at least one of the one or more triggers in accordance with the set of media delivery rules. The Media Analysis and Delivery System provides at least a portion of the media stream in response to at least one of the triggers in accordance with at least one of the set of media delivery rules.

Abstract translation: 在一个实施例中，媒体分析和传送系统获得一组媒体递送规则，其中该组媒体递送规则包括一个或多个触发，每个触发器识别感兴趣的主题。 媒体分析和传送系统根据媒体传送规则集来检查一个或多个触发器中的至少一个的媒体流。 媒体分析和传送系统根据所述一组媒体传送规则中的至少一个响应于至少一个触发器提供媒体流的至少一部分。

公开(公告)号：US08269814B2

公开(公告)日：2012-09-18

申请号：US12463519

申请日：2009-05-11

Applicant: Krutarth Shah ,  Randy K. Harrell ,  Kenneth W. Erion ,  Rajneesh Kumar

Inventor： Krutarth Shah ,  Randy K. Harrell ,  Kenneth W. Erion ,  Rajneesh Kumar

IPC: H04N7/14

CPC classification number: H04N7/147 ,  H04L12/1818 ,  H04N7/148 ,  H04N7/15 ,  H04N7/152

Abstract: A method is provided for configuring a video conference endpoint. The method comprises receiving session data that comprises endpoint connection data for remote endpoints associated with scheduled conferences, and receiving a signal from a user interface indicating a user has activated a control associated with a selected conference, identifying the endpoint connection data for the remote endpoint associated with the selected conference, and establishing a media session with the associated remote endpoint. A video conference endpoint system also is provided. The system comprises a controller coupled to a memory, and a user interface coupled to the controller. The user interface includes a command button associated with a conference. The controller periodically receives session data associated with the scheduled conferences, stores the session data in the memory, and establishes the selected conference in response to a user activating the command button.

Abstract translation: 提供了一种用于配置视频会议端点的方法。 该方法包括接收会话数据，该会话数据包括与调度会议相关联的远程端点的端点连接数据，以及从用户界面接收指示用户已经激活了与所选择的会议相关联的控制的信号，识别所述远程端点相关联的端点连接数据 与所选择的会议，以及与相关联的远程端点建立媒体会话。 还提供了视频会议端点系统。 该系统包括耦合到存储器的控制器和耦合到控制器的用户接口。 用户界面包括与会议相关联的命令按钮。 控制器周期性地接收与调度的会议相关联的会话数据，将会话数据存储在存储器中，并且响应于激活命令按钮的用户建立所选择的会议。