摘要:
In certain embodiments, a structure for electronic components includes a baseplate having a substantially planar shape. The baseplate defines one or more openings allowing air flow. The structure includes a frame coupled to the baseplate. The frame includes a planar support with a substantially planar shape that is substantially parallel to the baseplate. Then planar support and baseplate at least partially defines one or more plenums. The planar support is also configured to support one or more transmit/receive integrated microwave modules. The frame also includes a plurality of frame supports that define one or more channels for air flow. Each channel corresponds to one of the plenums. Additionally, the frame includes a ventilated panel with a surface defining a plurality of air inlets. The air inlets allow air into one of the one or more plenums. Also, the frame includes one or more thermal interfaces configured to dissipate heat.
摘要:
A structure and method for power distribution to a network for an integrated circuit chip complex are provided. The chip complex has at least two sectors, each having at least one power providing connection with at least one of said connections beings individually addressable by, and isolatable from, a given power source. At least one MEMS is positioned to selectively connect and disconnect said at least one connection to and from said given power source.
摘要:
According to one embodiment of the present invention, a microwave or millimeter wave module includes a dielectric layer having a pocket formed substantially through the dielectric layer. The dielectric is attached to a metal substrate. The pocket has substantially vertical sidewalls. An integrated circuit is disposed in the pocket. Opposing sides of the integrated circuit are substantially parallel to the sidewalls of the pocket. An interconnect electrically couples the integrated circuit to a bond pad disposed on the outer surface of the dielectric layer. The interconnect has a length that is minimized to result in reduced inductance of the semiconductor device.
摘要:
A data receiver is provided which is operable to receive a signal controllably pre-distorted and transmitted by a transmitter, to generate information for adjusting the pre-distortion applied to the signal transmitted by the transmitter, and to transmit the information to the transmitter. The receiver is further operable to perform adaptive equalization to receive the signal transmitted by the transmitter.
摘要:
A structure and method for power distribution to a network for an integrated circuit chip complex are provided. The chip complex has at least two sectors, each having at least one power providing connection with at least one of said connections beings individually addressable by, and isolatable from, a given power source. At least one MEMS is positioned to selectively connect and disconnect said at least one connection to and from said given power source.
摘要:
An apparatus includes a plurality of Transmit/Receive (T/R) modules (20) coupled with a slat assembly (34). The slat assembly includes a fluid passageway (54). A plurality of turbulence inducing structures (62, 162, 262, 104, 204, 304, 462) are disposed within the fluid passageway. In one embodiment, the turbulence inducing structures includes constrictions (62) extending from a surface (55) of the fluid passageway. The location and configuration of the structures is selected to achieve a predetermined temperature profile along the passageway, in response to fluid flow through the fluid passageway.
摘要:
An apparatus and method is provided for detecting loss of differential signal carried by a pair of differential signal lines. According to the method, a common mode level is detected from voltages on the pair of differential signal lines. A threshold level is generated, referenced to the detected common mode level. A signal level is generated from the voltages on the pair of differential signal lines, the signal level being averaged over a first period of time. From the threshold level and the detected common mode level a reference level is generated, the reference level being averaged over a second period of time longer than then the first period of time. The signal level is compared to the reference level to determine if a signal is present on the pair of differential signal lines.
摘要:
A fluid servo actuator control/damping mechanism and method which utilize and combine the functions of an electro-mechanically driven servo valve to achieve ram or actuator fluid flow and load control even after loss of fluid power as well as the main ram position control function under normal operating conditions. The mechanism comprises a main control servo valve including a positionable valve element for selective application of fluid power to a ram, a sensor connectable to the ram for providing ram load feedback information, and an electro-mechanical drive operable independently of fluid power for selectively positioning the valve element under normal operating conditions for controlled actuation of the same and, upon loss of fluid power, for providing variable orifices to controllably meter bypass fluid flow across the ram by utilizing the existing return flow metering pattern of the servo valve and modulating the valve element thereof in response to feedback information received from the sensor, for actively controlled damping of the ram.
摘要:
An apparatus and method for providing standby power to a node of a distributed system of devices. The apparatus includes: a current manager operable to manage supply of current to a device at the node; a normal current supplier operable to supply normal operating current to the device; and a super capacitor at the node operable to supply standby operating current to the device under control of the current manager when the normal current supplier fails to supply the normal operating current to the device. The apparatus preferably further comprises a switching regulator, operable in electrical communication with the super capacitor and the device, to regulate the standby operating current to the device.
摘要:
A method and tamper resistant circuit for resisting tampering including reverse engineering in a semiconductor chip, and a design structure on which the subject circuit resides are provided. A sensing device for detecting a chip tampering state is formed with the semiconductor chip including the circuitry to be protected. A tamper resistant control signal generator is coupled to the sensing unit for generating a tamper resistant control signal responsive to a detected chip tampering state. A functional operation inhibit circuit is coupled to the tamper resistant control signal generator for inhibiting functional operation of the circuitry to be protected responsive to the tamper resistant control signal.