ELECTRONIC DEVICE HAVING HEAT COLLECTION/DIFFUSION STRUCTURE

    公开(公告)号:US20190364695A1

    公开(公告)日:2019-11-28

    申请号:US16515275

    申请日:2019-07-18

    Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

    Electronic Device and Method of Controlling Power of Electronic Device
    27.
    发明申请
    Electronic Device and Method of Controlling Power of Electronic Device 有权
    电子设备控制电源的电子设备及方法

    公开(公告)号:US20160124495A1

    公开(公告)日:2016-05-05

    申请号:US14884524

    申请日:2015-10-15

    Abstract: An electronic device is disclosed. The electronic device may include a data provider that stores at least one piece of data for calculating a current consumption value according to each application type; and a processor that changes a data collection period according to a power state of the electronic device, collect data from the data provider, calculates the current consumption value according to each application type based on the power state of the electronic device based on the collected data, and displays the calculated current consumption value according to each application type on a display.

    Abstract translation: 公开了一种电子设备。 电子设备可以包括:数据提供器,其存储用于根据每种应用类型计算当前消费值的至少一个数据; 以及处理器,其根据所述电子设备的电力状态改变数据收集期间,从所述数据提供者收集数据,基于所收集的数据,基于所述电子设备的功率状态,根据每种应用类型计算所述电流消耗值 ,并根据每种应用类型在显示器上显示计算出的电流消耗值。

    ELECTRONIC DEVICE HAVING HEAT COLLECTION/DIFFUSION STRUCTURE

    公开(公告)号:US20210055059A1

    公开(公告)日:2021-02-25

    申请号:US17094293

    申请日:2020-11-10

    Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

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