公开(公告)号：US20220359420A1

公开(公告)日：2022-11-10

申请号：US17314916

申请日：2021-05-07

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  SeongHwan Park ,  JinHee Jung

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/66 ,  H01Q1/22 ,  H01L21/56 ,  H01L21/48

Abstract: A semiconductor device has a first package layer. A first shielding layer is formed over the first package layer. The first shielding layer is patterned to form a redistribution layer. An electrical component is disposed over the redistribution layer. An encapsulant is deposited over the electrical component. A second shielding layer is formed over the encapsulant. The second shielding layer is patterned. The patterning of the first shielding layer and second shielding layer can be done with a laser. The second shielding layer can be patterned to form an antenna.

公开(公告)号：US20220270983A1

公开(公告)日：2022-08-25

申请号：US17662977

申请日：2022-05-11

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Dong Won Son ,  Byeonghoon Kim ,  Sung Ho Choi ,  Sung Jae Lim ,  Jong Ho Shin ,  SungWon Cho ,  ChangOh Kim ,  KyoungHee Park

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L23/367

Abstract: A semiconductor device has a substrate and a semiconductor die disposed over the substrate. An encapsulant is deposited over the semiconductor die and substrate with a surface of the semiconductor die exposed from the encapsulant. A first shielding layer is formed over the semiconductor die. In some embodiments, the first shielding layer includes a stainless steel layer in contact with the surface of the semiconductor die and a copper layer formed over the stainless steel layer. The first shielding layer may further include a protective layer formed over the copper layer. One embodiment has a heatsink bonded to the semiconductor die through a solder layer. A second shielding layer can be formed over a side surface of the semiconductor die.

公开(公告)号：US20220199545A1

公开(公告)日：2022-06-23

申请号：US17126621

申请日：2020-12-18

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/033

Abstract: A semiconductor device has a semiconductor package including a substrate comprising a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A fanged metal mask is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The fanged metal mask is removed after forming the shielding layer.

公开(公告)号：US11342278B2

公开(公告)日：2022-05-24

申请号：US17008997

申请日：2020-09-01

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： SungWon Cho ,  ChangOh Kim ,  Il Kwon Shim ,  InSang Yoon ,  KyoungHee Park

IPC: H01L23/34 ,  H01L23/28 ,  H01L21/00 ,  H05K7/20 ,  H01L23/552 ,  H01L23/00 ,  H01L23/36 ,  H01L23/522 ,  H01L23/50 ,  H01L23/60 ,  H01L23/498 ,  H01L27/02 ,  H01L23/31 ,  H01L23/367

Abstract: A semiconductor device has a substrate and a semiconductor die disposed over the substrate. An encapsulant is deposited over the semiconductor die and substrate with a surface of the semiconductor die exposed from the encapsulant. A first shielding layer is formed over the semiconductor die. In some embodiments, the first shielding layer includes a stainless steel layer in contact with the surface of the semiconductor die and a copper layer formed over the stainless steel layer. The first shielding layer may further include a protective layer formed over the copper layer. One embodiment has a heatsink bonded to the semiconductor die through a solder layer. A second shielding layer can be formed over a side surface of the semiconductor die.

公开(公告)号：US20210335724A1

公开(公告)日：2021-10-28

申请号：US17369654

申请日：2021-07-07

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  KyoWang Koo ,  SungWon Cho

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/04 ,  H01L25/065 ,  H01L21/78 ,  H01L25/00 ,  H01L21/56

Abstract: A semiconductor device has a substrate. A lid is disposed over the substrate. An encapsulant is deposited over the substrate. A film mask is disposed over the encapsulant with the lid exposed from the film mask and encapsulant. A conductive layer is formed over the film mask, encapsulant, and lid. The film mask is removed after forming the conductive layer.

公开(公告)号：US20200075502A1

公开(公告)日：2020-03-05

申请号：US16116485

申请日：2018-08-29

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  KyoWang Koo ,  SungWon Cho

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/04 ,  H01L21/56 ,  H01L21/78 ,  H01L25/00 ,  H01L25/065

Abstract: A semiconductor device has a substrate. A lid is disposed over the substrate. An encapsulant is deposited over the substrate. A film mask is disposed over the encapsulant with the lid exposed from the film mask and encapsulant. A conductive layer is formed over the film mask, encapsulant, and lid. The film mask is removed after forming the conductive layer.

公开(公告)号：US20170162495A1

公开(公告)日：2017-06-08

申请号：US15433866

申请日：2017-02-15

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： MinKyung Kang ,  YoungDal Roh ,  Dong Ju Jeon ,  KyoungHee Park

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/3841

Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a dielectric core having an embedded pad; a top solder resist layer on the dielectric core, a pad top surface of the embedded pad below the top solder resist layer; a device interconnect attached to the embedded pad; and an integrated circuit device having an interconnect pillar, the interconnect pillar attached to the device interconnect for mounting the integrated circuit device to the dielectric core.

公开(公告)号：US12136759B2

公开(公告)日：2024-11-05

申请号：US17452855

申请日：2021-10-29

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  KyoungHee Park ,  KyungHwan Kim ,  SeungHyun Lee ,  SangJun Park

IPC: H05K1/18 ,  H01L21/56 ,  H01L23/31 ,  H01L23/36 ,  H01L23/552 ,  H01Q1/22 ,  H05K3/34 ,  H01L23/498 ,  H01L25/16 ,  H01R12/71

Abstract: A semiconductor device has a PCB with an antenna and a semiconductor package mounted onto the PCB. An epoxy molding compound bump is formed or disposed over the PCB opposite the semiconductor package. A first shielding layer is formed over the PCB. A second shielding layer is formed over the semiconductor package. A board-to-board (B2B) connector is disposed on the PCB or as part of the semiconductor package. A conductive bump is disposed between the semiconductor package and PCB.

公开(公告)号：US20240113038A1

公开(公告)日：2024-04-04

申请号：US18511428

申请日：2023-11-16

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  SeongHwan Park ,  JinHee Jung

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/66 ,  H01Q1/22

CPC classification number: H01L23/552 ,  H01L21/486 ,  H01L21/56 ,  H01L23/31 ,  H01L23/66 ,  H01Q1/2283

Abstract: A semiconductor device has a first package layer. A first shielding layer is formed over the first package layer. The first shielding layer is patterned to form a redistribution layer. An electrical component is disposed over the redistribution layer. An encapsulant is deposited over the electrical component. A second shielding layer is formed over the encapsulant. The second shielding layer is patterned. The patterning of the first shielding layer and second shielding layer can be done with a laser. The second shielding layer can be patterned to form an antenna.

公开(公告)号：US20230207485A1

公开(公告)日：2023-06-29

申请号：US18174790

申请日：2023-02-27

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L23/00 ,  H01L21/56 ,  H01L21/033 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L24/13 ,  H01L21/565 ,  H01L21/0334 ,  H01L23/3107 ,  H01L2924/15313

Abstract: A semiconductor device has a semiconductor package including a substrate comprising a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A fanged metal mask is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The fanged metal mask is removed after forming the shielding layer.