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公开(公告)号：US20180068794A1
公开(公告)日：2018-03-08
申请号：US15487997
申请日：2017-04-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Taek Jung LEE , Jin Kyung JOO , Hyo Youn LEE , Won Young LEE , Sung Kwon AN , Jae Yeol CHOI , Jin Man JUNG
Abstract: A capacitor component includes a plurality of unit laminates, each comprising a body with a stacked structure including a plurality of internal electrodes and connection electrodes that extend in a stacking direction of the body and electrically connect to the plurality of internal electrodes, and pad portions between adjacent unit laminates to electrically connect the respective connection electrodes of the unit laminates above and below the pad portions to each other.
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公开(公告)号：US20180027656A1
公开(公告)日：2018-01-25
申请号：US15449147
申请日：2017-03-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Man JUNG , Jin Kyung JOO , Ik Hwan CHANG , Taek Jung LEE , Won Young LEE , Yong Won SEO , Jin Woo CHUN
CPC classification number: H05K1/181 , H01G4/012 , H01G4/12 , H01G4/1227 , H01G4/232 , H01G4/30 , H05K1/111 , H05K3/3431 , H05K2201/10015 , Y02P70/611 , Y02P70/613
Abstract: A capacitor includes a body including a plurality of dielectric layers, first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, and first and second insulating regions. The first insulating region is disposed in each of the first internal electrodes and includes a first connection electrode disposed therein. The second insulating region is disposed in each of the second internal electrodes and includes a second connection electrode disposed therein. The products D1×Td and D2×Td are greater than 20 μm2, where Td is a thickness of the dielectric layer, and D1 and D2 are widths of the first and second insulating regions, respectively.
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公开(公告)号：US20170202090A1
公开(公告)日：2017-07-13
申请号：US15471235
申请日：2017-03-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Woo LEE , Jin Man JUNG
CPC classification number: H05K1/185 , H01G4/12 , H01G4/232 , H01G4/30 , H05K1/0231 , H05K1/09 , H05K1/115 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
Abstract: There is provided a multilayer ceramic electronic component embedded in a board including: a ceramic body including dielectric layers; first and second internal electrodes; and first and second external electrodes formed on first and second side surfaces of the ceramic body, respectively, wherein the first external electrode includes a first electrode layer and a first metal layer formed on the first electrode layer, the second external electrode includes a second electrode layer and a second metal layer formed on the second electrode layer, the first and second external electrodes are formed to be extended to first main surface of the ceramic body, and when a maximum width and a minimum width of at least one of the first and second external electrodes formed on the first main surface are defined as BWmax and BWmin, respectively, 0≦BWmax−BWmin≦100 μm is satisfied.
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24.发明申请MULTILAYER CERAMIC CAPACITOR, METHOD OF MANUFACTURING THE SAME, AND PRESSING PLATE FOR MULTILAYER CERAMIC CAPACITOR 审中-公开多层陶瓷电容器及其制造方法以及多层陶瓷电容器的压制板公开(公告)号：US20150049412A1
公开(公告)日：2015-02-19
申请号：US14135273
申请日：2013-12-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hyeok KIM , Byoung Hwa LEE , Jin Man JUNG
Abstract: There is provided a multilayer ceramic capacitor, including: a ceramic body including a plurality of dielectric layers stacked therein; first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having each of the dielectric layers disposed therebetween; and first and second external electrodes formed on the end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively, wherein a difference in rigidity between upper and lower portions of the ceramic body is 4% or less.
Abstract translation: 提供了一种多层陶瓷电容器，包括：陶瓷体，其包括堆叠在其中的多个电介质层; 第一和第二内部电极交替地暴露于陶瓷体的两个端面，其中每个电介质层位于它们之间; 以及第一和第二外部电极，其分别形成在陶瓷体的端面上并电连接到第一和第二内部电极，其中陶瓷体的上部和下部之间的刚性差为4％以下。
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25.发明申请EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT THEREIN 审中-公开嵌入式多层陶瓷电子元件及其制造方法以及具有嵌入式多层陶瓷电子元件的印刷电路板公开(公告)号：US20140151101A1
公开(公告)日：2014-06-05
申请号：US13770971
申请日：2013-02-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hai Joon LEE , Byoung Hwa LEE , Jin Man JUNG
CPC classification number: H01G4/12 , H05K1/185 , H05K2201/10636 , Y02P70/611
Abstract: There is provided an embedded multilayer ceramic electronic component, including: a ceramic body including dielectric layers; first and second internal electrodes facing each other with the dielectric layers interposed therebetween; a first external electrode and a second external electrode formed on external surfaces of the ceramic body, the first external electrode being electrically connected to the first internal electrodes and the second external electrode being electrically connected to the second internal electrodes; and a plating layer formed on the first external electrode and the second external electrode, wherein a surface roughness of the ceramic body is 500 nm or greater and not greater than a thickness of a ceramic cover sheet and a surface roughness of the plating layer is 300 nm or greater and not greater than a thickness of the plating layer.
Abstract translation: 提供了一种嵌入式多层陶瓷电子部件，包括：包括电介质层的陶瓷体; 第一和第二内部电极彼此面对，介电层插入其间; 形成在所述陶瓷体的外表面上的第一外部电极和第二外部电极，所述第一外部电极与所述第一内部电极电连接，所述第二外部电极与所述第二内部电极电连接; 以及形成在所述第一外部电极和所述第二外部电极上的镀层，其中，所述陶瓷体的表面粗糙度为500nm以上且不大于陶瓷覆盖片的厚度，并且所述镀层的表面粗糙度为300 nm以上且不大于镀层的厚度。
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Patent Agency Ranking
公开(公告)号：US20220351909A1
公开(公告)日：2022-11-03
申请号：US17858370
申请日：2022-07-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Min Gon LEE , Seung Woo SONG , Jae Yeol CHOI , Jin Kyung JOO , Taek Jung LEE , Jin Man JUNG
Abstract: A multilayer ceramic electronic component includes: a ceramic body and first and second external electrodes on external surfaces of the ceramic body. The ceramic body includes first and second internal electrodes facing each other with dielectric layers interposed therebetween. The ceramic body includes an active portion in which capacitance is formed and cover portions on upper and lower surfaces of the active portion, respectively. The ratio of the thickness of the first and second external electrodes to the thickness of the cover portion is proportional to the inverse of the cube root of the ratio of the Young's Modulus of each of the first and second external electrodes to the Young's modulus of the cover portion.
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公开(公告)号：US20210005392A1
公开(公告)日：2021-01-07
申请号：US16855272
申请日：2020-04-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Taek Jung LEE , Min Gon LEE , Jea Yeol CHOI , Jin Man JUNG , Jin Kyung JOO
Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween and disposed in point-symmetry with each other; first and second connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the first internal electrode; third and fourth connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the second internal electrode; first and second external electrodes disposed on both surfaces of the body and connected to the first and second connection electrodes; and third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the third and fourth connection electrodes, and the first and second internal electrodes include a region in which an electrode is not disposed.
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公开(公告)号：US20200105472A1
公开(公告)日：2020-04-02
申请号：US16198473
申请日：2018-11-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Woo SONG , Min Gon LEE , Sang Soo PARK , Jin Man JUNG , Woo Chul SHIN , Jin Kyung JOO
Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, disposed in an outer portion of the ceramic body, the first and second external electrodes comprise a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn), and a ratio (t1/t2) is within a range from 1.0 to 9.0, where t1 is a thickness of the first plating layer including nickel (Ni), and t2 is a thickness of the second plating layer including tin (Sn).
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公开(公告)号：US20180211776A1
公开(公告)日：2018-07-26
申请号：US15937008
申请日：2018-03-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byoung Hwa LEE , Doo Young KIM , Hai Joon LEE , Jin Man JUNG
CPC classification number: H01G2/06 , H01G4/012 , H01G4/232 , H01G4/30 , H05K1/185 , H05K3/0035 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
Abstract: There is provided a multilayer ceramic electronic component to be embedded in a board, including a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body with the dielectric layers interposed therebetween, to form capacitance therein, upper and lower cover layers formed on upper and lower portions of the active layer, and first and second external electrodes formed on both end surfaces of the ceramic body, wherein when a thickness of the upper or lower cover layer is defined as tc, 4 μm≤tc≤20 μm may be satisfied.
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公开(公告)号：US20180068796A1
公开(公告)日：2018-03-08
申请号：US15495121
申请日：2017-04-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Won SEO , Jin Kyung JOO , Ik Hwan CHANG , Jin Woo CHUN , Jin Man JUNG
CPC classification number: H01G4/30 , H01G4/005 , H01G4/008 , H01G4/12 , H01G4/228 , H01G4/232 , H05K1/111 , H05K1/181 , H05K2201/10015
Abstract: A multilayer capacitor includes a capacitor body including a plurality of first and second internal electrodes alternately stacked with dielectric layers interposed therebetween. A first via electrode penetrates through the plurality of first internal electrodes and is exposed at the first surface of the capacitor body. A second via electrode penetrates through the plurality of second internal electrodes, is exposed at the first surface of the capacitor body, and is spaced apart from the first via electrode. First and second external electrodes are on a first surface of the capacitor body, spaced apart from each other, and respectively connected to end portions of the first and second via electrodes. The first and second external electrodes each include a nickel (Ni) layer on the first surface of the capacitor body and a gold (Au) plating layer on the nickel layer.
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