Abstract:
The internal voltage generating apparatus includes a first charge pumping circuit, an external voltage level detector, and a second charge pumping circuit. The first charge pumping circuit outputs an internal voltage and selectively performs first charge pumping for the internal voltage depending on a result detecting a level of the internal voltage feed-backed. The external voltage level detector detects a level of an external voltage and outputs the result detecting the level of the internal voltage and outputs a result detecting the level of the external voltage as a detection signal. The second charge pumping circuit performs second charge pumping for the internal voltage together with the first charge pumping against a case in which the level of the external voltage is lower than a predetermined level by the detection signal of the external voltage level detector.
Abstract:
An apparatus for supplying an overdriving signal in a memory apparatus. The apparatus includes: a voltage detecting block that outputs a plurality of detection signals according to the level of an external voltage, and a pulse generator that outputs the overdriving signals having different pulse widths according to the plurality of detection signals.
Abstract:
A semiconductor memory device having a driver configured to sequentially perform over-driving and normal driving operations is presented. The semiconductor memory device includes a driver that outputs a drive signal, that over-drives the drive signal with an over-drive voltage having a voltage level higher than a normal drive voltage, and then subsequently normally drives the drive signal with the normal drive voltage. The semiconductor memory device also includes a drive voltage adjuster that detects a level of the over-drive voltage and compensates for a change in the voltage level of the normal drive voltage in response to the detected level of the over-drive voltage.
Abstract:
A semiconductor apparatus has a plurality of chips stacked therein. Read control signals for controlling read operations of the plurality of chips are synchronized with a reference clock such that the time taken from the application of a read command to the output of data for each of the plurality of chips is maintained substantially the same.
Abstract:
A semiconductor apparatus includes an individual-chip-designating-code setting block configured to generate a plurality of sets of individual-chip-designating-codes which have different code values or in which at least two sets of individual-chip-designating-codes have the same code value, in response to a plurality of chip fuse signals; a control block configured to generate a plurality of enable control signals in response to the plurality of chip fuse signals and most significant bits of the plurality of sets of individual-chip-designating-codes; and an individual chip activation block configured to compare individual-chip-designating-codes of the plurality of sets of individual-chip-designating-codes excluding the most significant bits, with chip selection addresses in response to the plurality of enable control signals, and enable one of a plurality of individual-chip-activation-signals depending upon a comparison result.
Abstract:
A semiconductor memory apparatus includes a clock control unit configured to receive a first clock when an enable signal is activated and generate a second clock which has a cycle closer in length to a target clock cycle than the first clock; a DLL input clock generation unit configured to output one of the first clock and the second clock as a DLL input clock according to a DLL select signal; and an address/command input clock generation unit configured to output one of the first clock and the second clock as an AC input clock according to the enable signal.
Abstract:
A semiconductor apparatus comprises a power-up signal generation section configured to generate a power-up signal, a driver configured to drive and output the power-up signal, and a main circuit block configured to perform predetermined functions in response to an output from the driver, wherein the power-up signal generation section and an input terminal of the driver are connected by a disconnectable element.
Abstract:
A semiconductor apparatus may include a master chip, first to nth slave chips, first to nth slave chip ID generating units, and a master chip ID generating unit. The first to nth slave chip ID generating units are disposed respectively in the first to nth slave chips and connected in series to each other. Each of the first to nth slave chip ID generating units is configured to add a predetermined code value to an mth operation code to generate an (m+1)th operation code. The master chip ID generating unit is disposed in the master chip to generate a variable first operation code in response to a select signal. Here, ‘n’ is an integer that is equal to or greater than 2, and ‘m’ is an integer that is equal to or greater than 1 and equal to or smaller than ‘n’.
Abstract:
A semiconductor apparatus is provided. The apparatus includes a transmission control unit configured to generate, in response to a received pulse signal having a first pulse width, transmission control signals with a second pulse width larger than the first pulse width and synchronization control signals with a third pulse width larger than the second pulse width. The apparatus also includes a reception control unit configured to generate reception control signals in response to the synchronization control signals.
Abstract:
A semiconductor apparatus includes: a slave chip including a signal transfer unit configured to determine whether or not to transfer an input signal in response to a chip select signal; a master chip including a replica circuit unit having the same configuration as the signal transfer unit and a signal output unit configured to receive an output signal of the signal transfer unit and an output signal of the replica circuit unit and generate an output signal in response to the control signal; a first through-chip via vertically formed through the slave chip, and having one end connected to the master chip to receive the input signal and the other end connected to the signal transfer unit; and a second through-chip via vertically formed through the slave chip, and having one end connected to the signal transfer unit and the other end connected to the signal output unit.