公开(公告)号：US07855458B2

公开(公告)日：2010-12-21

申请号：US11585877

申请日：2006-10-25

申请人： Tsuyoshi Matsumoto ,  Yoshihiro Mizuno ,  Xiaoyu Mi ,  Hisao Okuda ,  Satoshi Ueda

发明人： Tsuyoshi Matsumoto ,  Yoshihiro Mizuno ,  Xiaoyu Mi ,  Hisao Okuda ,  Satoshi Ueda

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01G4/008 ,  H01G4/232 ,  H01G4/33 ,  H01L24/18 ,  H01L28/10 ,  H01L28/75

摘要： An electronic component includes a substrate, and a capacitor unit on the substrate. The capacitor unit has a laminate structure including a first electrode layer provided on the substrate, a second electrode layer opposed to the first electrode layer, and a dielectric layer disposed between the first and the second electrode layers. The first electrode layer has a multilayer structure including an adhesion metal layer joined to the dielectric layer. The adhesion metal layer is provided with an oxide coating on a side of the dielectric layer.

摘要翻译： 电子部件包括基板和基板上的电容器单元。 电容器单元具有包括设置在基板上的第一电极层，与第一电极层相对的第二电极层和设置在第一和第二电极层之间的电介质层的层压结构。 第一电极层具有包含与电介质层接合的粘附金属层的多层结构。 附着金属层在电介质层一侧设置有氧化物涂层。

公开(公告)号：US07473981B2

公开(公告)日：2009-01-06

申请号：US11582506

申请日：2006-10-18

申请人： Tsuyoshi Matsumoto ,  Yoshihiro Mizuno ,  Xiaoyu Mi ,  Hisao Okuda ,  Satoshi Ueda

发明人： Tsuyoshi Matsumoto ,  Yoshihiro Mizuno ,  Xiaoyu Mi ,  Hisao Okuda ,  Satoshi Ueda

IPC分类号： H01L21/00

CPC分类号： H01G4/252 ,  H01G4/33 ,  H01L28/60 ,  H03H1/0007

摘要： An electronic component includes a substrate, a capacitor, and a wiring. The capacitor has a multilayer structure including a first electrode film provided on the substrate, a second electrode film of 2 to 4 μm in thickness disposed to face the first electrode film, and a dielectric film interposed between the first and the second electrode film. The wiring includes a joint portion connected to the second electrode film, on the opposite side of the dielectric film.

摘要翻译： 电子部件包括基板，电容器和布线。 电容器具有多层结构，其包括设置在基板上的第一电极膜，设置为面对第一电极膜的厚度为2至4μm的第二电极膜，以及介于第一和第二电极膜之间的电介质膜。 所述布线包括在所述电介质膜的相对侧上与所述第二电极膜连接的接合部。

公开(公告)号：US08345438B2

公开(公告)日：2013-01-01

申请号：US11896036

申请日：2007-08-29

申请人： Xiaoyu Mi ,  Tsuyoshi Matsuomoto ,  Satoshi Ueda ,  Takeo Takahashi

发明人： Xiaoyu Mi ,  Tsuyoshi Matsuomoto ,  Satoshi Ueda ,  Takeo Takahashi

IPC分类号： H05K7/00

CPC分类号： H05K1/165 ,  H01L23/5389 ,  H01L23/642 ,  H01L23/645 ,  H01L25/16 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/19015 ,  H05K1/162 ,  H05K3/0052 ,  H05K3/4685 ,  H05K2201/0394 ,  H05K2201/10674 ,  H05K2203/0574 ,  H05K2203/308 ,  Y10T29/49124 ,  H01L2224/0401

摘要： An electronic part module includes a wiring substrate, a passive device group of passive devices formed on the wiring substrate, and device chips mounted on the wiring substrate. Such an electronic part module is made in the following manner. First, a wiring substrate wafer is made, to include a plurality of electronic part module formation areas. Then, a plurality of passive devices are formed in each of the electronic part module formation areas on the wiring substrate wafer. Then, the device chips are formed on each of the electronic part module formation areas on the wiring substrate wafer. Finally, the wiring substrate wafer is divided.

摘要翻译： 电子部件模块包括布线基板，形成在布线基板上的无源器件的无源器件组以及安装在布线基板上的器件芯片。 这样的电子部件模块以如下方式制成。 首先，制造布线基板晶片，以包括多个电子部件模块形成区域。 然后，在布线基板晶片上的每个电子部件模块形成区域中形成多个无源器件。 然后，在布线基板晶片上的每个电子部件模块形成区域上形成器件芯片。 最后，分配布线基板晶片。

公开(公告)号：US20090219670A1

公开(公告)日：2009-09-03

申请号：US12394995

申请日：2009-02-27

申请人： Takeo TAKAHASHI ,  Xiaoyu Mi ,  Satoshi Ueda

发明人： Takeo TAKAHASHI ,  Xiaoyu Mi ,  Satoshi Ueda

IPC分类号： H01G4/06 ,  B05D5/12

CPC分类号： H01G4/06 ,  H01G13/00 ,  H01L27/016 ,  H01L28/10 ,  H01L28/40 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/4007 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4644 ,  H05K2201/09763 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126

摘要： A method of fabricating an electronic device includes selectively forming a glass layer on a ceramic substrate by printing, baking the glass layer, and forming a capacitor on the glass layer, the capacitor including metal electrodes and a dielectric layer interposed between the metal electrodes.

摘要翻译： 一种制造电子器件的方法包括通过印刷，烘烤玻璃层和在玻璃层上形成电容器，在陶瓷基片上选择性地形成玻璃层，电容器包括金属电极和置于金属电极之间的电介质层。

公开(公告)号：US07746210B2

公开(公告)日：2010-06-29

申请号：US12237826

申请日：2008-09-25

申请人： Xiaoyu Ml ,  Takeo Takahashi ,  Tsuyoshi Matsumoto ,  Satoshi Ueda

发明人： Xiaoyu Ml ,  Takeo Takahashi ,  Tsuyoshi Matsumoto ,  Satoshi Ueda

IPC分类号： H01F5/00

CPC分类号： H01F17/0013 ,  H01F27/29 ,  H01F2017/002 ,  H01F2017/0073

摘要： An electronic device includes a substrate, a first coil that has a spiral shape and is provided on the substrate, a second coil that has a spiral shape, is provided above the first coil, and is spaced from the first coil, a first connection portion that electrically couples the first coil and the second coil, a wire that is provided on the substrate and connects one of the first coil and the second coil to outside, and a second connection portion that is mechanically connected to an outer side face of outermost circumference of the second coil and is mechanically connected on the substrate where one of the wire and the first coil is not provided.

摘要翻译： 一种电子设备包括基板，具有螺旋形状并设置在基板上的第一线圈，具有螺旋形状的第二线圈，设置在第一线圈上方，并与第一线圈间隔开，第一连接部分 使第一线圈和第二线圈电耦合，设置在基板上并将第一线圈和第二线圈中的一个连接到外部的线，以及机械地连接到最外周的外侧面的第二连接部 并且机械连接在不设置线和第一线圈中的一个的基板上。

公开(公告)号：US20120229231A1

公开(公告)日：2012-09-13

申请号：US13415938

申请日：2012-03-09

申请人： Xiaoyu Mi ,  Osamu Toyoda ,  Satoshi Ueda

发明人： Xiaoyu Mi ,  Osamu Toyoda ,  Satoshi Ueda

IPC分类号： H01P1/203

CPC分类号： H01P1/20327 ,  H01P7/088

摘要： A variable filter includes, on a dielectric substrate including ground conductor, first resonator including a transmission line connected to input terminal, second resonator including a transmission line connected to output terminal, and coupling portion including a transmission line having one end connected to the first and second resonators and another end being an open end, or structure having one end connected to the first and second resonators, including a serial connection of a transmission line and a variable capacitor, another end of the variable capacitor connected to the ground conductor, and adjusting means capable of changing electric length, in the first and second resonators and the coupling portion, wherein pass band width can be changed by changing ratio of electric transmission length of the coupling portion to electric transmission lengths of transmission line including the coupling portion, and the first and second resonators.

摘要翻译： 可变滤波器包括在包括接地导体的电介质基板上，包括连接到输入端子的传输线的第一谐振器，包括连接到输出端子的传输线的第二谐振器和包括一端连接到第一和/ 第二谐振器，另一端是开口端，或具有连接到第一和第二谐振器的一端的结构，包括传输线和可变电容器的串联连接，连接到接地导体的可变电容器的另一端，以及调整 在第一和第二谐振器和耦合部分中能够改变电长度的装置，其中可以通过改变耦合部分的电传输长度与包括耦合部分的传输线的电传输长度的比率来改变通带宽度， 第一和第二谐振器。

公开(公告)号：US08031459B2

公开(公告)日：2011-10-04

申请号：US12071746

申请日：2008-02-26

申请人： Xiaoyu Mi ,  Takeaki Shimanouchi ,  Masahiko Imai ,  Satoshi Ueda

发明人： Xiaoyu Mi ,  Takeaki Shimanouchi ,  Masahiko Imai ,  Satoshi Ueda

IPC分类号： H01G5/01 ,  H01G5/04 ,  H01G7/00

CPC分类号： H01G5/16 ,  H01G5/011 ,  H01G5/06 ,  H03J3/20

摘要： A micro-device includes a movable part, a frame and a connecting part. The movable part has a main portion, a first capacitor electrode and a first driver electrode. The capacitor electrode and the driver electrode have electrode teeth extending from the main portion. The frame includes second capacitor and driver electrodes, where the second capacitor electrode has electrode teeth extending toward the first capacitor electrode, and the second driver electrode has electrode teeth extending toward the first driver electrode. The connecting part connects the movable part to the frame. The first and second capacitor electrodes have their electrode teeth overlapped in their initial position. The movable part is rotatable for varying the extent of the overlapping between the first and second driver electrodes.

摘要翻译： 微型装置包括可移动部件，框架和连接部件。 可动部具有主要部分，第一电容电极和第一驱动电极。 电容电极和驱动电极具有从主要部分延伸的电极齿。 该框架包括第二电容器和驱动电极，其中第二电容器电极具有朝着第一电容器电极延伸的电极齿，并且第二驱动电极具有朝向第一驱动电极延伸的电极齿。 连接部将可动部连接到框架。 第一和第二电容器电极的电极齿在其初始位置重叠。 可移动部分可旋转以改变第一和第二驱动器电极之间的重叠程度。

公开(公告)号：US07986507B2

公开(公告)日：2011-07-26

申请号：US12010367

申请日：2008-01-24

申请人： Takeaki Shimanouchi ,  Masahiko Imai ,  Yu Yonezawa ,  Xiaoyu Mi ,  Satoshi Ueda

发明人： Takeaki Shimanouchi ,  Masahiko Imai ,  Yu Yonezawa ,  Xiaoyu Mi ,  Satoshi Ueda

IPC分类号： H01G5/00

CPC分类号： H01G5/16 ,  H01G5/01 ,  H01G5/04 ,  H01G5/18

摘要： A variable capacitor is provided which is appropriate for suppressing fluctuation in driving voltage characteristic and for achieving a larger variation ratio of static capacitance. The variable capacitor includes a fixed electrode and a movable electrode. The fixed electrode includes a first opposing face, while the movable electrode includes a second opposing face that faces the first opposing face. The movable electrode further includes a curved portion that protrudes toward the fixed electrode. The variable capacitor also includes a dielectric pattern provided on the first opposing face.

摘要翻译： 提供一种可变电容器，其适于抑制驱动电压特性的波动并且实现较大的静态电容的变化率。 可变电容器包括固定电极和可动电极。 固定电极包括第一相对面，而可动电极包括面对第一相对面的第二相对面。 可动电极还包括向固定电极突出的弯曲部分。 可变电容器还包括设置在第一相对面上的电介质图案。

公开(公告)号：US07536068B2

公开(公告)日：2009-05-19

申请号：US11385657

申请日：2006-03-22

申请人： Hiromitsu Soneda ,  Xiaoyu Mi ,  Hisao Okuda ,  Osamu Tsuboi ,  Norinao Kouma ,  Satoshi Ueda

发明人： Hiromitsu Soneda ,  Xiaoyu Mi ,  Hisao Okuda ,  Osamu Tsuboi ,  Norinao Kouma ,  Satoshi Ueda

IPC分类号： G02B6/26

CPC分类号： G02B6/357 ,  G02B6/3518 ,  G02B6/3556 ,  G02B6/3584 ,  Y10S359/90

摘要： A micro movable element includes a micro movable substrate, a package base and an electroconductive connector. The micro movable substrate is provided with a micro movable unit that includes a frame, a pivotally movable portion, a torsion connector connecting the frame and the movable portion, and an actuator to generate driving force for the pivotal motion of the movable portion. The package base includes an internal interconnect structure. The electroconductive connector is provided between the micro movable substrate and the package base for electrically connecting the actuator and the internal interconnect structure to each other.

摘要翻译： 微型可移动元件包括微型可移动基板，封装基座和导电连接器。 微型可移动基板设置有微型可动单元，其包括框架，可枢转运动部分，连接框架和可移动部分的扭转连接器以及用于产生用于可动部分的枢转运动的驱动力的致动器。 封装基座包括内部互连结构。 导电连接器设置在微移动基板和封装基座之间，用于将致动器和内部互连结构彼此电连接。

公开(公告)号：US20080218933A1

公开(公告)日：2008-09-11

申请号：US12071746

申请日：2008-02-26

申请人： Xiaoyu Mi ,  Takeaki Shimanouchi ,  Masahiko Imai ,  Satoshi Ueda

发明人： Xiaoyu Mi ,  Takeaki Shimanouchi ,  Masahiko Imai ,  Satoshi Ueda

IPC分类号： H01G5/011

CPC分类号： H01G5/16 ,  H01G5/011 ,  H01G5/06 ,  H03J3/20

摘要： A micro-device includes a movable part, a frame and a connecting part. The movable part has a main portion, a first capacitor electrode and a first driver electrode. The capacitor electrode and the driver electrode have electrode teeth extending from the main portion. The frame includes second capacitor and driver electrodes, where the second capacitor electrode has electrode teeth extending toward the first capacitor electrode, and the second driver electrode has electrode teeth extending toward the first driver electrode. The connecting part connects the movable part to the frame. The first and second capacitor electrodes have their electrode teeth overlapped in their initial position. The movable part is rotatable for varying the extent of the overlapping between the first and second driver electrodes.

摘要翻译： 微型装置包括可移动部件，框架和连接部件。 可动部具有主要部分，第一电容电极和第一驱动电极。 电容电极和驱动电极具有从主要部分延伸的电极齿。 该框架包括第二电容器和驱动电极，其中第二电容器电极具有朝着第一电容器电极延伸的电极齿，并且第二驱动电极具有朝向第一驱动电极延伸的电极齿。 连接部将可动部连接到框架。 第一和第二电容器电极的电极齿在其初始位置重叠。 可移动部分可旋转以改变第一和第二驱动器电极之间的重叠程度。