THIN FILM CAPACITOR
    21.
    发明申请

    公开(公告)号:US20250029791A1

    公开(公告)日:2025-01-23

    申请号:US18708472

    申请日:2022-10-12

    Inventor: Hitoshi SAITA

    Abstract: A thin film capacitor includes a dielectric layer, capacitor electrodes formed respectively on first and second surfaces of the dielectric layer, a protective insulating film formed on the first surface of the dielectric layer so as to embed therein one of the capacitor electrodes, a protective insulating film formed on the second surface of the dielectric layer so as to embed therein another of the capacitor electrodes, and terminal electrodes connected respectively to the capacitor electrodes. One of the terminal electrodes includes a first section positioned on the protective insulating film so as to overlap the other of the capacitor electrodes, a second section positioned on the protective insulating film so as not to overlap the other of the capacitor electrodes, and a third section connecting the first and second sections.

    THIN FILM CAPACITOR, SUBSTRATE, AND ELECTRONIC DEVICE

    公开(公告)号:US20250006432A1

    公开(公告)日:2025-01-02

    申请号:US18754832

    申请日:2024-06-26

    Abstract: A thin film capacitor includes a first electrode layer, a second electrode layer, and a dielectric layer provided between the first electrode layer and the second electrode layer. The thin film capacitor includes an intermediate layer between the dielectric layer and the second electrode layer. The intermediate layer includes at least one stacking unit including a first intermediate layer and a second intermediate layer stacked in contact with the first intermediate layer. The first intermediate layer of the at least one stacking unit closest to the dielectric layer is stacked in contact with the dielectric layer. The first intermediate layer includes a first metal (M1) as a main component. The second intermediate layer includes a second metal (M2), different from the first metal, as a main component.

    DIELECTRIC DEVICE
    23.
    发明公开
    DIELECTRIC DEVICE 审中-公开

    公开(公告)号:US20230420186A1

    公开(公告)日:2023-12-28

    申请号:US18080962

    申请日:2022-12-14

    CPC classification number: H01G4/1209 H01G4/33

    Abstract: A dielectric device includes a first electrode, dielectric film, and second electrode, which are laminated. The dielectric film includes columnar crystals extending in a lamination direction. Provided that “x” denotes a reciprocal (1/μm) of a dielectric film thickness and “y” denotes a dielectric material average crystallite size (nm) calculated by the Scherrer equation, “x” and “y” are located within a quadrilateral having point A (0.10, 5), point B (10, 20), point C (10, 35), and point D (0.10, 10) as vertices. Alternatively, the columnar crystals have an average width of less than 40 nm within a distance range from one tenth to one third of the dielectric film thickness from one electrode to the other and an average width of 40 nm or more within a distance range from one tenth to one third of the dielectric film thickness from the other electrode to the one in the lamination direction.

    CAPACITOR COMPONENT
    24.
    发明申请

    公开(公告)号:US20220254566A1

    公开(公告)日:2022-08-11

    申请号:US17581060

    申请日:2022-01-21

    Inventor: Hitoshi SAITA

    Abstract: Disclosed herein is a capacitor component that includes a lower electrode, a capacitive insulating film covering the lower electrode, a plurality of upper electrodes overlapping the lower electrode through the capacitive insulating film, a first external terminal connected to the lower electrode, a plurality of fuse wires connected respectively to the plurality of upper electrodes, and a second external terminal connected in common to the plurality of fuse wires. The resistance values of the plurality of respective fuse wires are higher than the resistance values of the plurality of corresponding upper electrodes.

    THIN FILM CAPACITOR, AND METHOD OF PRODUCING THIN FILM CAPACITOR

    公开(公告)号:US20190295774A1

    公开(公告)日:2019-09-26

    申请号:US16359149

    申请日:2019-03-20

    Abstract: A thin film capacitor comprises a first electrode, a second electrode, and a dielectric substance disposed between the first electrode 10 and the second electrode. The second electrode has a first metallic layer, an intermediate layer, and a second metallic layer in sequence in this order from the side of the dielectric substance. The first metallic layer contains a metal element M1 as a main component, and the second metallic layer contains a metal element M2 different from the metal element M1 as a main component. The intermediate layer has one or more laminate structures each having a second metal sublayer containing the metal element M2 as a main component and a first metal sublayer containing the metal element M1 as a main component in sequence from the side of the first metallic layer toward the side of the second metallic layer.

    THIN FILM CAPACITOR
    28.
    发明申请
    THIN FILM CAPACITOR 审中-公开

    公开(公告)号:US20170110251A1

    公开(公告)日:2017-04-20

    申请号:US15296374

    申请日:2016-10-18

    Abstract: In a thin film capacitor, a first electrode layer 1 has one or more regions B in which a distance Hb between a boundary surface I of the first electrode layer 1 and a dielectric layer 2, and a surface of the first electrode layer 1, becomes maximum, and an outer layer 12 has one or more regions T in which a distance Ht between the boundary surface I and a surface of the outer layer 12 becomes maximum, as well as one or more regions t in which the distance Ht between the boundary surface I and the surface of the outer layer 12 does not become maximum. A projected area SHb, a projected area SHt, and a projected area S, satisfy equations (1) and (2): 60%≦(SHb/S)  (1); 60%≦(SHt/S)  (2).

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