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    Methods and apparatus for a semiconductor device having bi-material die attach layer
    21.
    发明授权
    Methods and apparatus for a semiconductor device having bi-material die attach layer 有权

    公开(公告)号：US10784188B2

    公开(公告)日：2020-09-22

    申请号：US16443653

    申请日：2019-06-17

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Rongwei Zhang ,  Vikas Gupta

    IPC: H01L23/495 ,  H01L23/00 ,  H01L21/48

    Abstract: Described examples include a device including a semiconductor die having a first surface with bond pads and an opposite second surface attached to a substrate by an adhesive layer covering at least a portion of the surface area of the second surface. The adhesive layer includes first zones composed of a first polymeric compound and adding up to a first portion of the surface area, and second zones composed of a second polymeric compound and adding up to a second portion of the surface area, the first zones and the second zones being contiguous. The first polymeric compound has a first modulus and the second polymeric compound has a second modulus greater than the first modulus.

    SEMICONDUCTOR DEVICE CONNECTIONS WITH SINTERED NANOPARTICLES
    22.
    发明申请
    SEMICONDUCTOR DEVICE CONNECTIONS WITH SINTERED NANOPARTICLES 审中-公开

    公开(公告)号：US20200185322A1

    公开(公告)日：2020-06-11

    申请号：US16213557

    申请日：2018-12-07

    Applicant: Texas Instruments Incorporated

    Inventor： Rongwei Zhang ,  Vikas Gupta

    IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

    Abstract: In a described example, a packaged device includes a substrate having a device mounting surface with conductive lands having a first thickness spaced from one another on the device mounting surface. A first polymer layer is disposed on the device mounting surface between the conductive lands having a second thickness equal to the first thickness. The conductive lands have an outer surface not covered by the first polymer layer. A second polymer layer is disposed on the first polymer layer, the outer surface of the conductive lands not covered by the second polymer layer. Conductive nanoparticle material is disposed on the outer surface of the conductive lands. A third polymer layer is disposed on the second polymer layer between the conductive nanoparticle material on the conductive lands. At least one semiconductor device die is mounted to the third polymer layer having electrical terminals bonded to the conductive nanoparticle material.

    Methods and Apparatus for a Semiconductor Device Having Bi-Material Die Attach Layer
    23.
    发明申请
    Methods and Apparatus for a Semiconductor Device Having Bi-Material Die Attach Layer 审中-公开

    公开(公告)号：US20190304881A1

    公开(公告)日：2019-10-03

    申请号：US16443653

    申请日：2019-06-17

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Rongwei Zhang ,  Vikas Gupta

    IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00

    Abstract: Described examples include a device including a semiconductor die having a first surface with bond pads and an opposite second surface attached to a substrate by an adhesive layer covering at least a portion of the surface area of the second surface. The adhesive layer includes first zones composed of a first polymeric compound and adding up to a first portion of the surface area, and second zones composed of a second polymeric compound and adding up to a second portion of the surface area, the first zones and the second zones being contiguous. The first polymeric compound has a first modulus and the second polymeric compound has a second modulus greater than the first modulus.

    Self-adhesive die
    24.
    发明授权
    Self-adhesive die 有权

    公开(公告)号：US10312212B2

    公开(公告)日：2019-06-04

    申请号：US14541208

    申请日：2014-11-14

    Applicant: Texas Instruments Incorporated

    Inventor： Rongwei Zhang

    IPC: B82Y10/00 ,  B82Y40/00 ,  H01L23/00 ,  H01L23/495 ,  H01L29/06

    Abstract: An apparatus for enhancing the thermal performance of semiconductor packages effectively. The concept of this invention is to provide silicon nanowires on the backside of an integrated circuit die to directly attach the die to the substrate, thereby improving the interface between die and substrate, and thus enhancing thermal performance and enhancing reliability by improving adhesion.

    Package heat dissipation including a die attach film
    29.
    发明授权
    Package heat dissipation including a die attach film 有权

    公开(公告)号：US12199008B2

    公开(公告)日：2025-01-14

    申请号：US17219602

    申请日：2021-03-31

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Jaimal Mallory Williamson ,  Rongwei Zhang

    IPC: H01L23/373 ,  H01L23/00 ,  H01L23/31

    Abstract: In examples, a semiconductor package comprises a substrate including a conductive layer; a conductive pillar coupled to the conductive layer; and a semiconductor die having first and second opposing surfaces. The first surface is coupled to the conductive pillar. The package also includes a die attach film abutting the second surface of the semiconductor die and a metal layer abutting the die attach film and having a metal layer surface facing away from the die attach film. The metal layer surface is exposed to an exterior of the FCCSP. The package includes a mold compound layer covering the substrate.

    IC PACKAGE WITH HEAT SPREADER
    30.
    发明公开
    IC PACKAGE WITH HEAT SPREADER 审中-公开

    公开(公告)号：US20240332119A1

    公开(公告)日：2024-10-03

    申请号：US18740444

    申请日：2024-06-11

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Rongwei Zhang ,  Woochan Kim ,  Patrick Francis Thompson

    IPC: H01L23/367 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065

    CPC classification number: H01L23/3677 ,  H01L21/4882 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/48138 ,  H01L2224/48158

    Abstract: An integrated circuit (IC) package includes a molding having a first surface and a second surface, the first surface opposing the second surface. An interconnect is encased in the molding. The interconnect includes pads situated at a periphery of a side of the IC package. A portion of the pads are exposed at the first surface of the molding. A die pad is situated proximal to the second surface of the molding. The die pad has a first surface and a second surface, the first surface opposing the second surface, and the second surface is circumscribed by the second surface of the molding. A die is mounted on the first surface of the die pad. A heat spreader is mounted on the second surface of the molding and the second surface of the die pad. The heat spreader extends between edges of the second surface of the molding.

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