公开(公告)号：US10672606B2

公开(公告)日：2020-06-02

申请号：US16055975

申请日：2018-08-06

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kousuke Yoshihara ,  Takafumi Niwa

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/687 ,  G03F7/16 ,  B05C9/12 ,  B05C11/08 ,  B05C13/00

Abstract: A method of forming a coating film includes horizontally supporting a substrate, supplying a coating solution to a central portion of the substrate and spreading the coating solution by a centrifugal force by rotating the substrate at a first rotational speed, decreasing a speed of the substrate from the first rotational speed toward a second rotational speed and rotating the substrate at the second rotational speed to make a surface of a liquid film of the coating solution even, supplying a gas to a surface of the substrate when the substrate is rotated at the second rotational speed to reduce fluidity of the coating solution, and drying the surface of the substrate by rotating the substrate at a third rotational speed faster than the second rotational speed.

公开(公告)号：US10262880B2

公开(公告)日：2019-04-16

申请号：US13770771

申请日：2013-02-19

Applicant: Tokyo Electron Limited

Inventor： Derek W. Bassett ,  Wallace P. Printz ,  Joshua S. Hooge ,  Katsunori Ichino ,  Yuichi Terashita ,  Kousuke Yoshihara

IPC: G03F7/16 ,  B05C11/08 ,  H01L21/67

Abstract: Techniques disclosed herein provide an apparatus and method of spin coating that inhibits the formation of wind marks and other defects from turbulent fluid-flow, thereby enabling higher rotational velocities and decreased drying times, while maintaining film uniformity. Techniques disclosed herein include a fluid-flow member, such as a ring or cover, positioned or suspended above the surface of a wafer or other substrate. The fluid-flow member has a radial curvature that prevents wind marks during rotation of a wafer during a coating and spin drying process.

公开(公告)号：US10074546B2

公开(公告)日：2018-09-11

申请号：US14485914

申请日：2014-09-15

Applicant: Tokyo Electron Limited

Inventor： Yuichi Terashita ,  Kousuke Yoshihara ,  Koji Takayanagi ,  Toshinobu Furusho ,  Takashi Sasa

IPC: B01D19/00 ,  H01L21/67

CPC classification number: H01L21/67017

Abstract: Disclosed is a processing liquid supplying apparatus. The apparatus includes: a processing liquid supply source configured to supply a processing liquid for processing a substrate to be processed; an ejection unit configured to eject the processing liquid to the substrate to be processed; a filter device configured to remove foreign matters in the processing liquid; a supply pump and an ejection pump which are provided in the supply path at a primary side and a secondary side of the filter device, respectively; and a control unit configured to output a control signal to decompress and degas the processing liquid supplied from the processing liquid supply source by using one of the supply pump and the ejection pump, and subsequently, pass the degassed processing liquid through the filter device beginning from the primary side to the secondary side of the filter device by using the supply pump and the ejection pump.

公开(公告)号：US10035173B2

公开(公告)日：2018-07-31

申请号：US14736582

申请日：2015-06-11

Applicant: TOKYO ELECTRON LIMITED

Inventor： Toshinobu Furusho ,  Takahiro Ookubo ,  Kousuke Yoshihara ,  Yusuke Yamamoto ,  Steffen Hornig

IPC: B05D1/02 ,  H01L21/67 ,  F17D1/00 ,  B01D29/56 ,  B01D35/02 ,  B05C11/10 ,  B05C9/06

CPC classification number: B05D1/02 ,  B01D29/56 ,  B01D35/02 ,  B05C9/06 ,  B05C11/10 ,  F17D1/00 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/67178 ,  Y10T137/794

Abstract: A chemical supply system comprises: a first container and a second container for storing a chemical solution; a first pump, located on a first pipe connecting the first and second containers, for directing the solution stored in the first container to the second container; and a first filter, located in the first pipe, for filtering the solution flowing through the first pipe from the first container toward the second container. The system further includes: a second pipe for connecting the first container and the second container; and a second pump, located on the second pipe, for directing the solution stored in the second container to the first container.

公开(公告)号：US09731226B2

公开(公告)日：2017-08-15

申请号：US14378337

申请日：2013-02-22

Applicant: Tokyo Electron Limited

Inventor： Kousuke Yoshihara ,  Katsunori Ichino ,  Toshinobu Furusho ,  Takashi Sasa ,  Katsuhiro Tsuchiya ,  Yuichi Terashita ,  Hirofumi Takeguchi

IPC: B01D19/00 ,  G03F7/30 ,  G03F7/16 ,  H01L21/67

CPC classification number: B01D19/0063 ,  B01D19/0031 ,  B01D19/0068 ,  G03F7/16 ,  G03F7/30 ,  H01L21/6715

Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.

公开(公告)号：US09690202B2

公开(公告)日：2017-06-27

申请号：US14845827

申请日：2015-09-04

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yuichi Terashita ,  Hirofumi Takeguchi ,  Takeshi Shimoaoki ,  Kousuke Yoshihara ,  Tomohiro Iseki

IPC: G03D5/00 ,  G03B27/42 ,  G03F7/30 ,  H01L21/67

CPC classification number: G03F7/3021 ,  H01L21/6715

Abstract: A developing method includes: forming a puddle of a developer on a surface of the substrate held by the substrate holding unit by a first developer nozzle; subsequently spreading the puddle of the developer over the whole substrate surface, by moving the first developer nozzle discharging the developer from a central or peripheral part to the peripheral or central part of the rotating substrate, with a contacting part of the first developer nozzle contacting with the puddle; supplying the developer from a second developer nozzle onto the rotating substrate, thereby to uniformize, in the substrate plane, distribution of a degree of progress of development by the developer spreading step; and removing the developer between the developer spreading step and the developer supplying step to remove the developer on the substrate.

公开(公告)号：US09575411B2

公开(公告)日：2017-02-21

申请号：US14450704

申请日：2014-08-04

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kousuke Yoshihara ,  Hideharu Kyouda ,  Koshi Muta ,  Taro Yamamoto ,  Yasushi Takiguchi

IPC: B05C11/08 ,  G03F7/30 ,  H01L21/67 ,  B05C5/02 ,  B05D1/00 ,  B05D1/26

CPC classification number: G03F7/30 ,  B05C5/02 ,  B05C5/0287 ,  B05C11/08 ,  B05D1/005 ,  B05D1/26 ,  G03F7/3021 ,  H01L21/6715

Abstract: A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.

Abstract translation: 显影装置包括：水平保持基板的基板支架; 显影剂喷嘴，其将显影剂供应到所述基板上以形成液体熔池; 旋转流产生机构，其包括旋转构件，所述旋转构件在所述旋转构件与所述液体熔池接触的同时围绕垂直于所述基板的轴旋转，从而在形成在所述基板上的所述显影剂的液体池中产生转向流; 以及用于沿着基板的表面移动转向流产生机构的移动机构。 可以通过在衬底的期望区域中形成转向流并搅拌显影剂来改善图案的线宽均匀性。

公开(公告)号：US09217922B2

公开(公告)日：2015-12-22

申请号：US13949733

申请日：2013-07-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Minoru Kubota ,  Kousuke Yoshihara ,  Kouzou Tachibana

IPC: G03F7/16 ,  B05C5/02 ,  H01L21/67 ,  B05C11/10 ,  B05C11/08 ,  B08B3/10 ,  B08B3/08

CPC classification number: G03F7/16 ,  B05C5/0258 ,  B05C11/08 ,  B05C11/1002 ,  B08B3/08 ,  B08B3/10 ,  G03F7/162 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67178

Abstract: A liquid processing apparatus includes a substrate holding unit arranged within a processing cup and configured to horizontally hold a substrate, a rotating mechanism configured to rotate the substrate holding unit about a vertical axis, a processing liquid supply unit configured to supply a processing liquid onto a surface of the substrate, and an exhaust mechanism configured to discharge an atmospheric gas around the substrate. The exhaust mechanism includes an exhaust flow path connected to an exhaust port formed at the processing cup, a circulation flow path branched from the exhaust flow path and configured to communicate with the processing cup, a gas liquid separator, a first regulator valve installed at one end of the exhaust flow path, and a second regulator valve installed at the other end of the exhaust flow path.

Abstract translation: 液体处理装置包括布置在处理杯内并被配置为水平地保持基板的基板保持单元，被配置为使基板保持单元围绕垂直轴旋转的旋转机构，配置成将处理液供给到 基板的表面，以及构造成将基板周围的大气气体排出的排气机构。 排气机构包括连接到形成在处理杯处的排气口的排气流路，从排气流路分支配置成与处理杯连通​​的循环流路，气液分离器，安装在处理杯一侧的第一调节阀 排气流路的端部，以及安装在排气流路的另一端的第二调节阀。

公开(公告)号：US20130189852A1

公开(公告)日：2013-07-25

申请号：US13746476

申请日：2013-01-22

Applicant: Tokyo Electron Limited

Inventor： Kousuke Yoshihara ,  Yuichi Yoshida ,  Soichiro Okada

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01L21/67 ,  G03F7/162 ,  H01L21/02107 ,  H01L21/67017 ,  H01L21/6715

Abstract: A solvent such as PGMEA is coated on a wafer in advance to easily spread resist liquid onto the wafer on a spin chuck. Before coating, the solvent supplied from a solvent supply source is stored in a distill tank first, the solvent is heated by a heating unit to be evaporated, and the evaporated solvent is cooled by a cooler, thereby performing the purification of the solvent by distillation. Therefore, particles among the solvent are removed. The purified solvent is stored in a storage tank first, and then supplied to a solvent nozzle above the spin chuck from a solvent supplying line. And then, the solvent is coated on the wafer by ejecting the solvent from the solvent nozzle to the wafer. Further, the distill tank is cleaned periodically to suppress the increase of the concentration of the particles in the solvent.

Abstract translation: 预先将诸如PGMEA的溶剂涂覆在晶片上，以便在旋转卡盘上容易地将抗蚀剂液体涂覆到晶片上。 涂布前，从溶剂供应源供应的溶剂首先储存在蒸馏罐中，通过加热单元加热溶剂进行蒸发，并将蒸发的溶剂用冷却器冷却，从而通过蒸馏进行溶剂的纯化 。 因此，除去溶剂中的颗粒。 将纯化的溶剂首先储存在储罐中，然后从溶剂供给管线供给到旋转卡盘上方的溶剂喷嘴。 然后，通过将溶剂从溶剂喷嘴喷射到晶片，将溶剂涂覆在晶片上。 此外，定期清洁蒸馏罐以抑制溶剂中颗粒浓度的增加。

公开(公告)号：US20210008588A1

公开(公告)日：2021-01-14

申请号：US17040206

申请日：2019-03-20

Applicant: Tokyo Electron Limited

Inventor： Hiroyuki Ide ,  Hideo Shite ,  Kousuke Yoshihara

IPC: B05C11/10 ,  B05D1/26 ,  H01L21/027

Abstract: A liquid processing device includes: a nozzle configured to discharge, onto a substrate, a processing liquid supplied from a processing liquid source, the processing liquid being configured to process the substrate; a main flow path which connects the processing liquid source and the nozzle; a filter provided in the main flow path; a branch path branched from the main flow path; a pump provided at an end of the branch path; and a controller configured to output a control signal to perform a first process of sucking the processing liquid supplied from the processing liquid source by the pump to flow the processing liquid into the branch path and then a second process of discharging the processing liquid of a smaller amount than a capacity of the branch path from the pump to the branch path to discharge the processing liquid from the nozzle.