公开(公告)号：US07758041B2

公开(公告)日：2010-07-20

申请号：US11833597

申请日：2007-08-03

申请人： Tokujiro Okuno ,  Hiroyuki Tajima ,  Kiyotaka Nakamura

发明人： Tokujiro Okuno ,  Hiroyuki Tajima ,  Kiyotaka Nakamura

IPC分类号： B65H5/00 ,  B65H1/08

CPC分类号： F16D11/06 ,  B65H3/0607 ,  B65H3/0661 ,  B65H3/34 ,  B65H3/56 ,  B65H3/565 ,  B65H2220/09 ,  B65H2301/4222 ,  B65H2403/421 ,  B65H2403/47 ,  B65H2403/512 ,  B65H2403/70 ,  B65H2513/412 ,  F16D11/16

摘要： [Object] To provide a clutch apparatus that can smoothly switch from a clutch engaged state to a clutch non-engaged state, while tooth jump does not occur even with a small-sized clutch apparatus.[Solving Means] A recessed portion 153 is provided in a cam face of a cam 45. A cam shaft 13 is configured to pivot by a predetermined amount as a cam follower 51 is fitted in the recessed portion, and, when the cam initiates to engage the cam follower, it enters a clutch engaged state. A driven side gear 99 is pivoted by a predetermined amount as the cam follower is fitted in the recessed portion and, thereby, a clutch member 93 is rotated by a predetermined amount in a direction in which a toothed portion 94 is spaced apart from a drive side gear 92. In a state where the cam follower is not fitted in the recessed portion, when the clutch member 93 switches its clutch state, at least a portion of a swing locus of the toothed portion 94 of the clutch member 93 maintains a clearance with a gear tooth of the drive side gear 92.

摘要翻译： 本发明提供一种能够从离合器接合状态顺利地切换到离合器未接合状态的离合器装置，而即使使用小型离合器装置也不会发生跳齿。 [解决方案]凹凸部153设置在凸轮45的凸轮面中。凸轮轴13构造成当凸轮从动件51装配在凹部中时枢转预定量，并且当凸轮开始 接合凸轮从动件，它进入离合器接合状态。 从动侧齿轮99随着凸轮从动件嵌合在凹部中而枢转预定量，因此离合器构件93沿齿形部分94与驱动器间隔开的方向旋转预定量 在凸轮从动件未装配在凹部中的状态下，当离合器构件93切换离合器状态时，离合器构件93的齿部94的摆动轨迹的至少一部分保持间隙 与驱动侧齿轮92的齿轮齿。

公开(公告)号：US20100052006A1

公开(公告)日：2010-03-04

申请号：US12585058

申请日：2009-09-02

申请人： Shigeo Takeda ,  Hiroyuki Tajima ,  Shota Shimonishi ,  Yosuke Tsuchiya

发明人： Shigeo Takeda ,  Hiroyuki Tajima ,  Shota Shimonishi ,  Yosuke Tsuchiya

IPC分类号： H01L33/00

CPC分类号： H01L33/508 ,  H01L33/507 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting semiconductor device includes a base substrate; a light emitting semiconductor element including a crystal growth basis and provided on the base substrate so that the crystal growth basis faces in opposite direction to the base substrate; a first transparent sealing medium which seals the light emitting semiconductor on the base substrate; and a second transparent sealing medium which seals the light emitting semiconductor over the first transparent sealing medium and contains phosphor. A thickness of the second sealing medium in a portion with high emission intensity is larger than that of the other portion of the first sealing medium; and the portion with high emission intensity is defined as a portion where light emission intensity from the light emitting semiconductor element is maximum.

摘要翻译： 发光半导体器件包括：基底; 包括晶体生长基础的发光半导体元件，并且设置在所述基底基板上，使得所述晶体生长基底面向与所述基底基板相反的方向; 密封基底基板上的发光半导体的第一透明密封介质; 以及第二透明密封介质，其密封所述第一透明密封介质上的所述发光半导体并且包含磷光体。 发光强度高的部分的第二密封介质的厚度大于第一密封介质的其他部分的厚度; 并且具有高发光强度的部分被定义为来自发光半导体元件的发光强度最大的部分。

公开(公告)号：US20090206718A1

公开(公告)日：2009-08-20

申请号：US12320824

申请日：2009-02-05

申请人： Shota Shimonishi ,  Hiroyuki Tajima ,  Toshimasa Hayashi ,  Hideki Kokubu

发明人： Shota Shimonishi ,  Hiroyuki Tajima ,  Toshimasa Hayashi ,  Hideki Kokubu

IPC分类号： H01J61/52

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21V19/0015 ,  F21V29/87 ,  F21V29/89 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： The present invention provides a LED lamp module including a metal base, a flexible board mounted on the metal base and having a through hole, a surface mounted type LED lamp including a ceramic package having a projection portion on a back of the ceramic package, a LED chip mounted on the ceramic package, and a light output surface. The projection part is thermally connected with the metal base through the through hole, and the LED lamp is electrically connected with the flexible board through an electric conductive member at a portion other than the projection portion. The LED lamp module includes a cover covering a part of the LED lamp other than the light output surface and the flexible board and pressing the LED lamp

摘要翻译： 本发明提供一种LED灯模块，包括金属基座，安装在金属基底上的柔性基板，具有通孔，表面安装型LED灯，其包括在陶瓷封装的背面上具有突出部分的陶瓷封装， LED芯片安装在陶瓷封装上，并具有光输出面。 突出部分通过通孔与金属基座热连接，并且LED灯通过导电构件在突出部分之外的部分处与柔性板电连接。 LED灯模块包括覆盖除了光输出表面之外的LED灯的一部分的盖和柔性板并按压LED灯

公开(公告)号：US20050248167A1

公开(公告)日：2005-11-10

申请号：US11180530

申请日：2005-07-14

申请人： Chiharu Totani ,  Shuji Inui ,  Hidenori Yokoyama ,  Hiroyuki Tajima ,  Takeshi Hosokawa ,  Hikaru Ando ,  Mitsuyoshi Ohno

发明人： Chiharu Totani ,  Shuji Inui ,  Hidenori Yokoyama ,  Hiroyuki Tajima ,  Takeshi Hosokawa ,  Hikaru Ando ,  Mitsuyoshi Ohno

IPC分类号： B60N3/02 ,  B60R27/00

CPC分类号： B60N3/026 ,  B60N3/023 ,  Y10T16/44 ,  Y10T24/307 ,  Y10T24/45487

摘要： A clip engages an assist grip with an engaging portion of the clip engaged with a clip insertion hole of an attachment part. The assist grip is mounted to a body panel by engaging a first locking pawl of the clip with a rear surface of the body panel, and engaging a second locking pawl of the clip with a front surface of the body panel. A pressure plug is fitted into a rear end gap portion of the clip when a cap on the attachment part is closed.

公开(公告)号：US20050116456A1

公开(公告)日：2005-06-02

申请号：US10988841

申请日：2004-11-16

申请人： Hiroyuki Tajima ,  Takahiko Sato ,  Osamu Fukawatase ,  Takeaki Kato

发明人： Hiroyuki Tajima ,  Takahiko Sato ,  Osamu Fukawatase ,  Takeaki Kato

IPC分类号： B60R21/00 ,  B60R21/02 ,  B60R21/04 ,  B60R21/045

CPC分类号： B60R21/045 ,  B60R2021/0051 ,  B60R2021/0414

摘要： The invention provides a vehicular shock absorbing body which absorbs a shock by a grid-like rib formed on a support plate portion and can inhibit a load point at an initial stage and a terminal stage, in a load-displacement (F-S) curve of the vehicular shock absorbing body. A shock absorbing body (40) used for absorbing a shock in a vehicle and made of a synthetic resin, is provided with a support plate portion (42), and a shock absorbing portion (45) formed in a grid shape on the support plate portion (42) by a plurality of thin ribs (44, 44), and plastically deforming at a time of applying a shock load so as to be absorbable a shock energy. A notch (a leading end side notch) 48 is formed between grid crossing points (46) in the thin rib (44) from a leading end side, and a notch (a root side notch) 50 is formed from a root side of the grid crossing points (46) so as to include the support plate portion (42), thereby inhibiting a load point from being generated at an initial stage and a terminal stage in the F-S curve.

摘要翻译： 本发明提供了一种车辆冲击吸收体，其通过形成在支撑板部分上的格栅状肋吸收冲击，并且能够抑制在初始阶段和末端阶段的载荷位置（FS）曲线中的载荷点 车辆减震体。 用于吸收车辆中的冲击并由合成树脂制成的减震体（40）设置有支撑板部分（42）和在支撑板上形成为格子状的冲击吸收部分（45） 部分（42）由多个薄肋（44,44）构成，并且在施加冲击载荷时塑性变形以便可吸收冲击能。 从前端侧在薄肋（44）的格栅交叉点（46）之间形成有切口（前端侧切口）48，并且从切口（根侧切口）50的根侧形成有切口 栅格交叉点（46），以包括支撑板部分（42），从而阻止在FS曲线的初始阶段和终端阶段产生负载点。

公开(公告)号：US06565116B1

公开(公告)日：2003-05-20

申请号：US09586613

申请日：2000-06-02

申请人： Hiroyuki Tajima ,  Yutaka Nagai ,  Fumitake Kobayashi ,  Chiharu Totani ,  Yasuyuki Osawa ,  Yoshitaka Terada

发明人： Hiroyuki Tajima ,  Yutaka Nagai ,  Fumitake Kobayashi ,  Chiharu Totani ,  Yasuyuki Osawa ,  Yoshitaka Terada

IPC分类号： B60R2122

CPC分类号： B60R21/215 ,  B60R13/0206 ,  B60R13/025 ,  B60R21/213 ,  B60R21/2165 ,  B60R21/26 ,  B60R2013/016 ,  B60R2013/0293 ,  F16B5/065 ,  F16B5/0657 ,  F16B5/0664 ,  F16B21/075 ,  F16B21/088 ,  Y10T24/309 ,  Y10T24/42

摘要： A head-protecting airbag device includes an airbag cover mounted on the body of a vehicle for covering a folded airbag. The airbag cover includes an airbag cover body and a clip portion protruding from the back side of the airbag cover body. The clip portion is inserted into a retaining of the vehicle body and is retained by the vehicle body. The clip portion can establish two states: a first retaining state, in which the clip portion is so unextractably retained in the retaining hole that the clip portion cannot be pulled from the body; and a second retaining state, in which the clip portion is inserted farther into the retaining hole compared to the first retaining state and is extractably retained to permit extraction of the clip portion from the body. The head-protecting airbag device can firmly mount the airbag cover to and easily dismount the airbag cover from the vehicle body.

摘要翻译： 头部保护气囊装置包括安装在车辆的车身上用于覆盖折叠的气囊的气囊盖。 安全气囊盖包括气囊盖主体和从安全气囊盖主体的后侧突出的夹持部。 夹子部分被插入到车体的保持件中并被车身保持。 夹子部分可以建立两个状态：第一保持状态，其中夹持部分被非提取地保持在保持孔中，使得夹持部分不能从身体拉出; 以及第二保持状态，其中夹持部分与第一保持状态相比进一步插入到保持孔中，并且被可抽取地保持以允许夹子部分从身体抽出。 头部保护用安全气囊装置可以将安全气囊盖牢固地安装在车身上并且容易地从气囊拆卸。

公开(公告)号：USD689450S1

公开(公告)日：2013-09-10

申请号：US29424056

申请日：2012-06-07

申请人： Syota Shimonishi ,  Hiroyuki Tajima ,  Yosuke Tsuchiya ,  Akira Sengoku

设计人： Syota Shimonishi ,  Hiroyuki Tajima ,  Yosuke Tsuchiya ,  Akira Sengoku

公开(公告)号：US20120074445A1

公开(公告)日：2012-03-29

申请号：US13137930

申请日：2011-09-21

申请人： Shota Shimonishi ,  Hiroyuki Tajima ,  Yosuke Tsuchiya

发明人： Shota Shimonishi ,  Hiroyuki Tajima ,  Yosuke Tsuchiya

IPC分类号： H01L33/60

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2933/0091 ,  H01L2924/00014

摘要： A light emitting element housing package comprises a ceramic substrate on which a light emitting element is mounted, and a wiring pattern that is formed on the ceramic substrate and to which a light emitting element chip is electrically connected, wherein a white thin film layer formed from a sintered body of white inorganic particles is formed on at least an upper surface of the wiring pattern, except a connection region in the wiring pattern to be connected to the light emitting element chip.

摘要翻译： 一种发光元件外壳封装，包括其上安装有发光元件的陶瓷基板，以及形成在陶瓷基板上并与发光元件芯片电连接的布线图案，其中形成有白色薄膜层 除了要连接到发光元件芯片的布线图案中的连接区域之外，在布线图案的至少上表面上形成白色无机颗粒的烧结体。

公开(公告)号：US20120070920A1

公开(公告)日：2012-03-22

申请号：US13137855

申请日：2011-09-19

申请人： Shota Shimonishi ,  Hiroyuki Tajima ,  Yosuke Tsuchiya

发明人： Shota Shimonishi ,  Hiroyuki Tajima ,  Yosuke Tsuchiya

IPC分类号： H01L33/48

CPC分类号： H01L33/005 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/743 ,  H01L24/81 ,  H01L24/83 ,  H01L33/46 ,  H01L2224/1132 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/1301 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2224/45099 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/81805

摘要： A method for mounting a luminescent device having a mount layer on a substrate, comprising the steps of coating a metallic nano-particle paste on the substrate, disposing the mount layer of the luminescent device on the metallic nano-particle paste, and heating the mount layer and the metallic nano-particle paste to form an alloy, thereby bonding the luminescent device and the substrate.

摘要翻译： 一种用于将具有安装层的发光装置安装在基板上的方法，包括以下步骤：在基板上涂覆金属纳米颗粒糊料，将发光装置的安装层设置在金属纳米颗粒糊料上， 层和金属纳米颗粒糊形成合金，从而结合发光装置和基板。

公开(公告)号：US07985522B2

公开(公告)日：2011-07-26

申请号：US12246188

申请日：2008-10-06

申请人： Hiroyuki Tajima ,  Yuuta Kumano

发明人： Hiroyuki Tajima ,  Yuuta Kumano

IPC分类号： G03G5/047

CPC分类号： G03G5/0672 ,  G03G5/056 ,  G03G5/0592 ,  G03G5/0596 ,  G03G5/0614

摘要： Disclosed is an electrophotographic photoreceptor which is excellent in wear resistance and electrical characteristics. Specifically disclosed is an electrophotographic photoreceptor containing a polyester resin in a photosensitive layer provided on an electroconductive substrate. The polyester resin is composed of a copolymer represented by the general formula 1 below, which has a viscosity average molecular weight (Mv) of 10,000-300,000 and contains a diphenyl ether 4,4′-dicarboxylic acid component and a bivalent phenol component. In the general formula 1, A represents a diphenyl ether 4,4′-dicarboxylic acid residue represented by the formula A below, and B represents a bivalent phenol residue represented by the formula B below. In the formula A, each of Ra1 and Ra2 independently represents a hydrogen atom or a monovalent substituent which may have a substituent, and each of n and m is independently an integer from 0 to 4. In the formula B, each of R1 and R2 independently represents one selected from the group consisting of a hydrogen atom, an alkyl group, an aryl group, a halogen group, and an alkoxy group.

摘要翻译： 公开了耐磨性和电特性优异的电子照相感光体。 具体公开了一种在设置在导电性基体上的感光层中含有聚酯树脂的电子照相感光体。 聚酯树脂由下述通式1表示的共聚物组成，其粘均分子量（Mv）为10,000-300,000，并含有二苯基醚4,4'-二羧酸组分和二价苯酚组分。 在通式1中，A表示下式A表示的二苯醚4,4'-二羧酸残基，B表示下式B表示的二价酚残基。 在式A中，Ra1和Ra2各自独立地表示氢原子或可以具有取代基的一价取代基，n和m各自独立地为0〜4的整数。在式B中，R 1和R 2各自 独立地表示选自氢原子，烷基，芳基，卤素基和烷氧基的一个基团。