公开(公告)号：US20080265003A1

公开(公告)日：2008-10-30

申请号：US11979914

申请日：2007-11-09

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura

IPC分类号： B23K20/10

CPC分类号： B23K20/10 ,  B23K2101/40 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip 52 to a substrate 50 using an ultrasonic mounting apparatus including a horn 15 that propagates ultrasonic vibration of an ultrasonic vibrator, the horn 15 being made of a ceramic that has a higher vibration propagation speed than metal. The method includes steps of disposing the substrate 50 on a stage 13, disposing the semiconductor chip 52 on the substrate 50, and placing the semiconductor chip 52 in contact with a convex part 15a provided on the horn 15 and applying ultrasonic vibration to bond the semiconductor chip 52 to the substrate 50.

公开(公告)号：US07355285B2

公开(公告)日：2008-04-08

申请号：US11041292

申请日：2005-01-25

申请人： Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Takayoshi Matsumura

发明人： Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Takayoshi Matsumura

IPC分类号： H01L23/48

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/75 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/759 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00015 ,  H01L2224/13099 ,  H01L2924/00

摘要： The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit board without displacement. The structure of mounting an electronic component on a circuit board is characterized in that bumps of the electronic component are respectively flip-chip-bonded to electrodes of the circuit board by applying ultrasonic vibrations to the electronic component, and that a center of each of the bumps is previously relatively displaced, with respect to a center of each of the electrodes in a width direction, in a direction parallel to a direction of the ultrasonic vibrations.

摘要翻译： 将电子部件安装在电路板上的结构能够将具有非常短的分离的凸块的电子部件可靠地倒置接合到电路板而没有位移。 将电子部件安装在电路板上的结构的特征在于，通过对电子部件施加超声波振动，电子部件的凸起分别与电路基板的电极倒装接合， 先前相对于每个电极的宽度方向上的中心在与超声波振动的方向平行的方向上相对移位。

公开(公告)号：US07350685B2

公开(公告)日：2008-04-01

申请号：US11041301

申请日：2005-01-25

申请人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

发明人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

IPC分类号： B23K1/06

CPC分类号： H05K3/328 ,  B23K20/10 ,  B23K2101/40 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75343 ,  H01L2224/75755 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K2201/10674 ,  H05K2203/0285 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The method is capable of securely mounting an electronic component on a circuit board by applying ultrasonic vibration. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. Portions of the circuit board, which correspond to peaks of amplitude of vibrations transmitted to the circuit board, are pressed when the ultrasonic vibrations are applied to the electronic component.

摘要翻译： 该方法能够通过施加超声波振动将电子部件牢固地安装在电路板上。 该方法包括对电子部件施加超声波振动以将电子部件倒装芯片连接到具有电极的电路板的步骤。 当将超声波振动施加到电子部件时，电路板的与发送到电路板的振动的振幅的峰值对应的部分被按压。

公开(公告)号：US20060097028A1

公开(公告)日：2006-05-11

申请号：US11062789

申请日：2005-02-23

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura

IPC分类号： B23K1/06

CPC分类号： B23K20/10 ,  B23K2101/40 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip 52 to a substrate 50 using an ultrasonic mounting apparatus including a horn 15 that propagates ultrasonic vibration of an ultrasonic vibrator, the horn 15 being made of a ceramic that has a higher vibration propagation speed than metal. The method includes steps of disposing the substrate 50 on a stage 13, disposing the semiconductor chip 52 on the substrate 50, and placing the semiconductor chip 52 in contact with a convex part 15a provided on the horn 15 and applying ultrasonic vibration to bond the semiconductor chip 52 to the substrate 50.

摘要翻译： 一种超声波安装方法可以通过使用高频超声波提高安装效率，还可以安装大型半导体芯片。 该方法使用包括传播超声波振动器的超声波振动的喇叭15的超声波安装装置将半导体芯片52超声波接合到基板50，喇叭15由具有比金属更高的振动传播速度的陶瓷制成。 该方法包括以下步骤：将基板50设置在台13上，将半导体芯片52配置在基板50上，将半导体芯片52与设置在喇叭15上的凸部15a接触并施加超声波振动， 半导体芯片52到基板50。

公开(公告)号：US20060091185A1

公开(公告)日：2006-05-04

申请号：US11041301

申请日：2005-01-25

申请人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

发明人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

IPC分类号： B23K1/06

CPC分类号： H05K3/328 ,  B23K20/10 ,  B23K2101/40 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75343 ,  H01L2224/75755 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K2201/10674 ,  H05K2203/0285 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The method is capable of securely mounting an electronic component on a circuit board by applying ultrasonic vibration. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. Portions of the circuit board, which correspond to peaks of amplitude of vibrations transmitted to the circuit board, are pressed when the ultrasonic vibrations are applied to the electronic component.

摘要翻译： 该方法能够通过施加超声波振动将电子部件牢固地安装在电路板上。 该方法包括对电子部件施加超声波振动以将电子部件倒装芯片连接到具有电极的电路板的步骤。 当将超声波振动施加到电子部件时，电路板的与发送到电路板的振动的振幅的峰值对应的部分被按压。

公开(公告)号：US20100327435A1

公开(公告)日：2010-12-30

申请号：US12822656

申请日：2010-06-24

申请人： Kimio Nakamura ,  Takayoshi Matsumura ,  Yoshiyuki Satoh ,  Kuniko Ishikawa ,  Kenji Kobae

发明人： Kimio Nakamura ,  Takayoshi Matsumura ,  Yoshiyuki Satoh ,  Kuniko Ishikawa ,  Kenji Kobae

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L23/49811 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electronic component includes a package substrate, a plurality of conductive pads, an insulating material and a semiconductor device. The plurality of conductive pads is disposed on the package substrate. The insulating material is disposed between the plurality of conductive pads. The insulating material includes a top surface located on an identical plane to an upper surface of the plurality of conductive pads. The semiconductor device includes a conductive bump aligned on a corresponding conductive pad of the plurality of conductive pads.

摘要翻译： 电子部件包括封装基板，多个导电焊盘，绝缘材料和半导体器件。 多个导电焊盘设置在封装衬底上。 绝缘材料设置在多个导电焊盘之间。 绝缘材料包括位于与多个导电焊盘的上表面相同的平面上的顶表面。 半导体器件包括对准在多个导电焊盘的相应导电焊盘上的导电凸块。

公开(公告)号：US20090243006A1

公开(公告)日：2009-10-01

申请号：US12402881

申请日：2009-03-12

申请人： Tetsuya TAKAHASHI ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

发明人： Tetsuya TAKAHASHI ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

IPC分类号： H01L29/84 ,  H01L23/12 ,  H01L21/50

CPC分类号： B81B3/0078 ,  B81B2201/042 ,  B81B2203/0109 ,  B81B2203/0307 ,  B81C1/00126 ,  H01L24/14 ,  H01L2224/1134 ,  H01L2224/1403 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01L2924/1461 ,  H01L2924/00

摘要： According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip.

摘要翻译： 根据本发明的一个方面，电子部件包括具有第一平坦表面的基板，固定到基板的第一平面表面的第一凸起，固定到基板的第一平面表面的第二凸起，距离基板的预定距离 第一凸块，包括元件的MEMS芯片，耦合到第一凸块和第二凸块的MEMS芯片，与第一平坦表面分开的MEMS芯片，与第一凸块，基板和MEMS芯片结合的粘合区域。

公开(公告)号：US08308071B2

公开(公告)日：2012-11-13

申请号：US12756487

申请日：2010-04-08

申请人： Shuichi Takeuchi ,  Kenji Kobae ,  Takayoshi Matsumura ,  Tetsuya Takahashi

发明人： Shuichi Takeuchi ,  Kenji Kobae ,  Takayoshi Matsumura ,  Tetsuya Takahashi

IPC分类号： G06K19/06

CPC分类号： G06K19/07749 ,  G06K19/07724 ,  G06K19/07728 ,  Y10T156/10

摘要： An RFID tag includes an inlet on which an antenna pattern serving as an antenna for communication and an IC chip electrically connected to the antenna pattern are mounted. The RFID tag also includes an exterior body that encloses the inlet from outside and a hollow space that is formed by the inlet and the exterior body and that is filled with gas or a gel material.

摘要翻译： RFID标签包括其上安装用作通信用天线的天线图案和与天线图案电连接的IC芯片的入口。 RFID标签还包括从外部包围入口的外部主体和由入口和外部主体形成并且填充有气体或凝胶材料的中空空间。

公开(公告)号：US08395904B2

公开(公告)日：2013-03-12

申请号：US12821938

申请日：2010-06-23

申请人： Takayoshi Matsumura ,  Kenji Kobae ,  Shuichi Takeuchi ,  Tetsuya Takahashi

发明人： Takayoshi Matsumura ,  Kenji Kobae ,  Shuichi Takeuchi ,  Tetsuya Takahashi

IPC分类号： H05K7/00

CPC分类号： H01L24/11 ,  H01L24/45 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13644 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A multichip module includes a package substrate, a first semiconductor device, a second semiconductor device and a conductive bump. The first semiconductor device is flip-chip bonded to the package substrate. The first semiconductor device includes a first chip pad on a surface thereof. The second semiconductor device is mounted on the first semiconductor device. The second semiconductor device includes a second chip pad facing the first chip pad. The conductive bump connects the first chip pad to the second chip pad. The conductive bump includes a first metallic body that has a first diffusion rate and a second metallic body that has a second diffusion rate lower than the first diffusion rate.

摘要翻译： 多芯片模块包括封装基板，第一半导体器件，第二半导体器件和导电凸块。 第一半导体器件被倒装芯片结合到封装衬底。 第一半导体器件包括在其表面上的第一芯片焊盘。 第二半导体器件安装在第一半导体器件上。 第二半导体器件包括面向第一芯片焊盘的第二芯片焊盘。 导电凸块将第一芯片焊盘连接到第二芯片焊盘。 导电凸块包括具有第一扩散速率的第一金属体和具有低于第一扩散速率的第二扩散速率的第二金属体。

公开(公告)号：US08169075B2

公开(公告)日：2012-05-01

申请号：US12402881

申请日：2009-03-12

申请人： Tetsuya Takahashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

发明人： Tetsuya Takahashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

IPC分类号： H01L29/40

CPC分类号： B81B3/0078 ,  B81B2201/042 ,  B81B2203/0109 ,  B81B2203/0307 ,  B81C1/00126 ,  H01L24/14 ,  H01L2224/1134 ,  H01L2224/1403 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01L2924/1461 ,  H01L2924/00

摘要： According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip.

摘要翻译： 根据本发明的一个方面，电子部件包括具有第一平坦表面的基板，固定到基板的第一平面表面的第一凸起，固定到基板的第一平面表面的第二凸起，距离基板的预定距离 第一凸块，包括元件的MEMS芯片，耦合到第一凸块和第二凸块的MEMS芯片，与第一平坦表面分开的MEMS芯片，与第一凸块，基板和MEMS芯片结合的粘合区域。