公开(公告)号：US06312312B1

公开(公告)日：2001-11-06

申请号：US09175561

申请日：1998-10-20

申请人： Tetsuji Togawa ,  Nobuyuki Takada ,  Seiji Katsuoka ,  Hiroyuki Osawa

发明人： Tetsuji Togawa ,  Nobuyuki Takada ,  Seiji Katsuoka ,  Hiroyuki Osawa

IPC分类号： B24B722

CPC分类号： B24B37/345 ,  B23Q7/06 ,  B24B37/04

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface, a top ring for supporting the workpiece to be polished and pressing the workpiece against the polishing surface, and a transferring device for transferring the workpiece between the top ring and the transferring device. The transferring device includes a stage having a support surface for supporting the workpiece, an actuating unit for moving the stage in a vertical direction, and a guide member disposed radially outwardly of the stage and having a guide surface of an inverted conical shape. The centering of the workpiece is conducted by bringing a periphery of the workpiece into contact with the guide surface, and then the workpiece is transferred from the transferring device to the top ring by raising the stage.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括具有研磨面的转台，用于支撑待研磨的工件的顶环，将工件压靠在研磨面上，以及用于在顶环和转印装置之间传递工件的转印装置。 转印装置包括具有用于支撑工件的支撑表面的台，用于沿垂直方向移动台的致动单元和设置在该台的径向外侧并具有倒圆锥形形状的引导表面的引导构件。 通过使工件的周边与引导面接触来进行工件的定心，然后通过升高工作台将工件从传送装置传送到顶环。

公开(公告)号：US5643067A

公开(公告)日：1997-07-01

申请号：US571598

申请日：1995-12-13

申请人： Seiji Katsuoka ,  Kunihiko Sakurai ,  Tetsuji Togawa

发明人： Seiji Katsuoka ,  Kunihiko Sakurai ,  Tetsuji Togawa

IPC分类号： B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  B24B21/18 ,  B24B33/00 ,  B24B47/26 ,  B24B55/00

CPC分类号： B24B53/017 ,  B24B53/00

摘要： A dressing apparatus is used to resurface a polishing surface of a polish cloth used to polish semiconductor wafers. A dressing brush which spins on its own axis is also coupled to a drive shaft of a main drive of the dressing apparatus through a planetary gear mechanism so that the brush will rotate or orbit about the drive shaft. Therefore, the dressing brush traces a complex path and its dressing action is spread over a wide surface area of the polishing cloth to produce thorough resurfacing of the polishing surface. The service life of the cloth is significantly increased and contributes to improving the overall efficiency of preparing high quality polished semiconductor wafers. For economy, the dressing apparatus can be mounted easily on a conventional polishing apparatus having a dressing facility.

摘要翻译： 修整装置用于重新表面抛光用于抛光半导体晶片的抛光布的抛光表面。 在其自身的轴线上旋转的修整刷也通过行星齿轮机构联接到修整设备的主驱动器的驱动轴，使得电刷将围绕驱动轴旋转或轨道。 因此，修整刷跟踪复杂的路径，并且其修整作用分布在抛光布的宽表面区域上，以产生抛光表面的彻底表面。 布的使用寿命显着增加，有助于提高制备高质量抛光半导体晶片的整体效率。 为了经济，敷料装置可以容易地安装在具有修整设备的常规抛光装置上。

公开(公告)号：US06354918B1

公开(公告)日：2002-03-12

申请号：US09335778

申请日：1999-06-18

申请人： Tetsuji Togawa ,  Nobuyuki Takada ,  Seiji Katsuoka ,  Kenichi Shigeta

发明人： Tetsuji Togawa ,  Nobuyuki Takada ,  Seiji Katsuoka ,  Kenichi Shigeta

IPC分类号： B24B100

CPC分类号： B24B53/017

摘要： A polishing apparatus has a turntable with a polishing surface, a top ring for pressing a workpiece against the polishing surface under a given pressure to polish the workpiece, and a dresser for dressing the polishing surface. The polishing surface has an outer circumferential edge portion cut off or the dresser has a predetermined outside diameter, such that the polishing surface has an outer circumferential edge positioned in alignment with or radially inwardly of an outer circumferential edge of the dresser in the radial direction of the turntable when the polishing surface is dressed by the dresser.

摘要翻译： 抛光装置具有带有抛光面的转台，用于在给定压力下将工件压靠在抛光表面上以抛光工件的顶环和用于修整抛光表面的修整器。 抛光表面具有切割的外周缘部分或修整器具有预定的外径，使得抛光表面具有位于修整器的外周边缘的径向方向上与外周边缘对准或径向向内的外圆周边缘 抛光表面由梳妆台穿着时的转盘。

公开(公告)号：US5647792A

公开(公告)日：1997-07-15

申请号：US580341

申请日：1995-12-28

申请人： Seiji Katsuoka ,  Kunihiko Sakurai ,  Tetsuji Togawa

发明人： Seiji Katsuoka ,  Kunihiko Sakurai ,  Tetsuji Togawa

IPC分类号： B24B37/12 ,  B24B5/00

CPC分类号： B24B45/006 ,  B24B37/11

摘要： A polishing apparatus has a cloth cartridge detachably mounted on a turntable, an abrasive liquid nozzle for supplying an abrasive liquid onto an abrasive cloth of the cloth cartridge, and a top ring for holding a workpiece against the abrasive cloth. The turntable and the top ring are rotatable relatively to each other while the abrasive liquid is being supplied onto the abrasive cloth from the abrasive liquid nozzle and the workpiece is being held against the abrasive cloth. A cartridge tightener which is angularly movably mounted on the turntable has a tapered surface for engaging an engageable surface of the cloth cartridge in response to angular movement of the cartridge tightener. The tapered surface is included to a plane substantially perpendicular to an axis about which the turntable is rotatable. The cartridge tightener also has a resilient member acting between the tapered surface and the turntable and elastically deformable for applying resilient forces between the tapered surface and the engageable surface in response to angular movement of the cartridge tightener.

摘要翻译： 抛光装置具有可拆卸地安装在转台上的布料盒，用于将研磨液体供应到布料筒的研磨布上的研磨液喷嘴和用于将工件保持在研磨布上的顶环。 当研磨液从研磨液喷嘴供给到研磨布上并且工件被保持抵靠研磨布时，转盘和顶环可相对旋转。 可旋转地安装在转台上的盒式收紧器具有锥形表面，用于响应于盒式收紧器的角度运动而啮合布料盒的可接合表面。 锥形表面被包括在基本上垂直于转盘可旋转的轴线的平面内。 盒式收紧器还具有作用在锥形表面和转盘之间的弹性构件，并且可弹性变形，以响应于盒式收紧器的角度运动而在锥形表面和可接合表面之间施加弹性力。

公开(公告)号：US06328629B1

公开(公告)日：2001-12-11

申请号：US09026122

申请日：1998-02-19

申请人： Tetsuji Togawa ,  Norio Kimura ,  Koji Ono

发明人： Tetsuji Togawa ,  Norio Kimura ,  Koji Ono

IPC分类号： B24B4908

CPC分类号： B24B37/30 ,  B24B37/0053 ,  B24B37/013 ,  B24B49/08 ,  B24B49/16

摘要： A workpiece such as a semiconductor wafer is held by a top ring, and a lower surface of the workpiece is polished to a flat mirror finish by being pressed against a polishing surface of the turntable while the top ring and the turntable are rotated. While the workpiece is being polished, at least one of the pressure and the flow rate of a fluid which is supplied to an upper surface of the workpiece is detected. When at least one of the detected pressure and the detected flow rate changes, the polishing of the workpiece is stopped.

摘要翻译： 诸如半导体晶片的工件由顶环保持，并且当顶环和转盘旋转时，通过被压靠在转盘的抛光表面上而将工件的下表面抛光成平坦的镜面。 当工件被抛光时，检测供给到工件的上表面的流体的压力和流速中的至少一个。 当检测到的压力和检测到的流量中的至少一个改变时，停止对工件的抛光。

公开(公告)号：US5670011A

公开(公告)日：1997-09-23

申请号：US643099

申请日：1996-05-02

申请人： Tetsuji Togawa ,  Norio Kimura

发明人： Tetsuji Togawa ,  Norio Kimura

IPC分类号： B24B37/00 ,  B24B37/30 ,  B24B57/02 ,  B24B7/22

CPC分类号： B24B37/04 ,  B24B57/02

摘要： A workpiece such as a semiconductor wafer is polished to a flat mirror finish. The workpiece is held by a top ring, and a lower surface of the workpiece is polished by pressing the workpiece against an abrasive cloth mounted on a turntable while applying an abrasive solution onto the abrasive cloth. While the workpiece is being polished, an upper surface of the semiconductor wafer is prevented from being etched by supplying a neutralizer between the upper surface of the semiconductor wafer and the holding surface of the top ring.

摘要翻译： 诸如半导体晶片的工件被抛光成平面镜面。 工件由顶环保持，并且通过在安装在转盘上的研磨布上将工件压靠在研磨布上的同时将工件的下表面抛光。 当抛光工件时，通过在半导体晶片的上表面和顶环的保持表面之间提供中和剂来防止半导体晶片的上表面被蚀刻。

公开(公告)号：US09457447B2

公开(公告)日：2016-10-04

申请号：US13073218

申请日：2011-03-28

申请人： Masaya Seki ,  Tetsuji Togawa ,  Masayuki Nakanishi

发明人： Masaya Seki ,  Tetsuji Togawa ,  Masayuki Nakanishi

IPC分类号： B24B1/00 ,  B24B21/00 ,  B24B9/06 ,  B24B21/20 ,  H01L21/306 ,  H01L21/67 ,  H01L21/68 ,  H01L21/84 ,  H01L21/66

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/20 ,  H01L21/30625 ,  H01L21/67092 ,  H01L21/67259 ,  H01L21/68 ,  H01L21/84 ,  H01L22/20

摘要： The polishing apparatus has a polishing unit capable of forming a right-angled cross section by polishing a peripheral portion of the substrate. The polishing unit includes a polishing head having a pressing member configured to press a polishing tape against the peripheral portion of the substrate from above, a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and to recover the polishing tape from the polishing head, a first moving mechanism configured to move the polishing head in a radial direction of the substrate, and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate.

摘要翻译： 抛光装置具有能够通过抛光基板的周边部分而形成直角横截面的抛光单元。 抛光单元包括：抛光头，其具有被配置成从上方将研磨带压靠在基板的周边部分上的按压构件，配置成将抛光带供给到抛光头并将抛光带从 抛光头，构造成沿着基板的径向方向移动抛光头的第一移动机构和被配置为沿着基板的径向移动带供给和恢复机构的第二移动机构。 引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。

公开(公告)号：US08979615B2

公开(公告)日：2015-03-17

申请号：US13308857

申请日：2011-12-01

申请人： Masaya Seki ,  Tetsuji Togawa ,  Masayuki Nakanishi ,  Naoki Matsuda ,  Atsushi Yoshida

发明人： Masaya Seki ,  Tetsuji Togawa ,  Masayuki Nakanishi ,  Naoki Matsuda ,  Atsushi Yoshida

IPC分类号： B24B21/04 ,  B24B9/06 ,  B24B21/00

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/006 ,  B24B21/008 ,  B24B21/20

摘要： The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.

摘要翻译： 抛光装置具有能够抛光基板的周边部分以形成直角横截面的抛光单元。 抛光装置包括：保持和旋转衬底的衬底保持器; 支撑抛光带的导辊; 以及抛光头，其具有从上方将研磨带的边缘压靠在基板的周边部分的按压部件。 引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。 基板保持器包括：保持基板的保持台; 以及支撑台，其整体地支撑基板的周边部分的下表面。 支撑台与保持台一致地旋转。

公开(公告)号：US20110207294A1

公开(公告)日：2011-08-25

申请号：US13027551

申请日：2011-02-15

申请人： Masayuki NAKANISHI ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota

发明人： Masayuki NAKANISHI ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota

IPC分类号： H01L21/762

CPC分类号： H01L21/02038 ,  B24B9/065 ,  B24B21/002 ,  B24B37/042 ,  H01L21/02087 ,  H01L21/304 ,  H01L21/76256

摘要： A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes: pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon; and pressing a second polishing tape against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.

摘要翻译： 一种制造半导体器件的方法使得可以在抛光条件下，在特别适用于沉积膜的抛光条件和沉积膜下面的硅的抛光条件下，用研磨带有效地抛光硅衬底的周边部分。 该方法包括：在第一旋转速度旋转器件基板的同时，将第一研磨带压在具有沉积膜的器件基板的周边部分上，同时以第一转速旋转器件基板，从而去除位于器件基板周边部分的沉积膜 并暴露下面的硅; 并且在第二旋转速度旋转所述装置基板的同时将第二研磨带压靠在所述装置基板的周边部分中的暴露的硅上，从而将所述硅抛光至预定的深度。

公开(公告)号：US20090137190A1

公开(公告)日：2009-05-28

申请号：US12292685

申请日：2008-11-24

申请人： Tetsuji Togawa ,  Keisuke Namiki ,  Satoru Yamaki

发明人： Tetsuji Togawa ,  Keisuke Namiki ,  Satoru Yamaki

IPC分类号： B24B49/00 ,  B24B49/10 ,  B24B53/02 ,  B24B7/20

CPC分类号： B24B53/017 ,  B24B37/013 ,  B24B49/10 ,  B24B49/16

摘要： The present invention provides a dressing method of dressing a polishing pad used in a polishing apparatus for polishing a substrate. This method includes repetitively moving the dresser on an upper surface of the polishing pad in a radial direction of the polishing pad so as to perform a dressing process on the polishing pad, during the dressing process, measuring a height of an upper surface of the polishing pad at a predetermined point in one of plural zones on the polishing surface, and repeating the repetitive moving of the dresser and the measuring of the height of the upper surface of the polishing pad so as to measure the height of the upper surface of the polishing pad in all of the plural zones.

摘要翻译： 本发明提供了一种修整抛光装置中用于抛光基板的抛光垫的修整方法。 该方法包括在抛光垫的径向上重复地将修整器沿抛光垫的径向重复地移动到抛光垫的上表面上，以便在修整过程中对抛光垫进行修整处理，测量抛光上表面的高度 在抛光表面上的多个区域中的一个区域中的预定点处的垫，并且重复修整器的重复移动和测量抛光垫的上表面的高度，以便测量抛光上表面的高度 在所有多个区域中的垫。