公开(公告)号：US5374454A

公开(公告)日：1994-12-20

申请号：US13652

申请日：1993-02-04

申请人： Harry R. Bickford ,  Peter J. Duke ,  Elizabeth Foster ,  Martin J. Goldberg ,  Voya R. Markovich ,  Linda C. Matthew ,  Donald G. McBride ,  Terrence R. O'Toole ,  Stephen L. Tisdale ,  Alfred Viehbeck

发明人： Harry R. Bickford ,  Peter J. Duke ,  Elizabeth Foster ,  Martin J. Goldberg ,  Voya R. Markovich ,  Linda C. Matthew ,  Donald G. McBride ,  Terrence R. O'Toole ,  Stephen L. Tisdale ,  Alfred Viehbeck

IPC分类号： C08J3/24 ,  C23C18/20 ,  C23C18/28 ,  C25D5/56 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  B05D1/00

CPC分类号： H05K3/422 ,  C23C18/208 ,  C23C18/2093 ,  C23C18/30 ,  C25D5/56 ,  H05K3/381 ,  H05K1/034 ,  H05K3/181 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24339 ,  Y10T428/24802 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31678

摘要： A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical conductivity therein. Also, new structures containing a free standing halogenated polymeric-containing layer and electrical conductive pattern thereon are provided.

摘要翻译： 将卤化聚合物材料暴露于还原剂和/或电解质和施加的电压以使得能够被金属化并被蚀刻的暴露部分。 暴露部分也可以被掺杂从而在其中诱导电导率。 此外，提供了含有独立卤代聚合物层和在其上的导电图案的新结构。

公开(公告)号：US5310580A

公开(公告)日：1994-05-10

申请号：US874665

申请日：1992-04-27

申请人： Eugene J. O'Sullivan ,  Terrence R. O'Toole ,  Judith M. Roldan ,  Lubomyr T. Romankiw ,  Carlos J. Sambucetti ,  Ravi Saraf

发明人： Eugene J. O'Sullivan ,  Terrence R. O'Toole ,  Judith M. Roldan ,  Lubomyr T. Romankiw ,  Carlos J. Sambucetti ,  Ravi Saraf

IPC分类号： B05D1/34 ,  C23C18/20 ,  H05K3/18 ,  H05K3/38 ,  B05D2/06

CPC分类号： H05K3/387 ,  B05D1/34 ,  C23C18/20 ,  C23C18/2033 ,  C23C18/208 ,  C23C18/24 ,  C23C18/30 ,  H05K2201/0154 ,  H05K2201/0212 ,  H05K2203/0759 ,  H05K2203/0773 ,  H05K2203/0793 ,  H05K3/181 ,  H05K3/381

摘要： Improved adhesion of electroless metal deposited on an organic dielectric layer with phase separated morphology is accomplished by the spontaneous formation of a morphologically and topographically rough surface. In one embodiment a ternary solution of a polar solvent and two polymer precursors of the same polymer which are separable in two phases of different order are cast in film on a substrate and heated to form two phases of different order to spontaneously produce a rough surface. Upon exposure to an alkaline solution, one phase is etched at a faster rate than the other. Seeding and electroless deposition of a metal on the rough surface results in improved adhesion of the metal to the dielectric layer. In a second embodiment a quaternary solution of a polar solvent, a seeding agent, two polymer precursors of the same polymer which are separable in two phases of different order are cast in a thin film on a substrate and heated to form three phases. Upon curing the precursors there is surface roughening as a result of phase separation. Upon exposure to alkaline solution there is etching of one of the polymer phases at a faster rate and simultaneous opening of the seeding colloid. The rough surface is overcoated with a photoresist, exposed and developed. Subsequent electroless metal deposition results in improved metal to dielectric layer adhesion. The method is applicable to selective deposition of electroless copper onto a polyimide layer.

摘要翻译： 沉积在具有相分离形态的有机电介质层上的化学金属的改善的粘附通过自发形成形态和形貌上粗糙的表面来实现。 在一个实施方案中，可以将不同顺序的两相分离的相同聚合物的极性溶剂和两种聚合物前体的三元溶液在基材上成膜并加热形成不同阶数的两相以自发产生粗糙表面。 在暴露于碱性溶液时，以比另一相更快的速率蚀刻一相。 在粗糙表面上的金属的接种和无电沉积导致金属对电介质层的附着力提高。 在第二个实施方案中，将极性溶剂，接种剂，可以在两相中分离的相同聚合物的两种聚合物前体的四元溶液浇铸在基材上的薄膜中，并加热形成三相。 固化前体由于相分离而导致表面粗糙化。 暴露在碱性溶液中时，以更快的速率蚀刻聚合物相之一并同时打开接种胶体。 粗糙表面用光致抗蚀剂涂覆，曝光和显影。 随后的无电金属沉积导致金属与电介质层粘附性的改善。 该方法适用于将化学镀铜选择性沉积到聚酰亚胺层上。

公开(公告)号：US5152880A

公开(公告)日：1992-10-06

申请号：US676660

申请日：1991-03-28

申请人： Terrence R. O'Toole ,  Alfred Viehbeck

发明人： Terrence R. O'Toole ,  Alfred Viehbeck

IPC分类号： C08G73/10 ,  C09D5/44 ,  C25D13/06 ,  H01B3/30 ,  H01L23/29

CPC分类号： H01L23/293 ,  C08G73/1089 ,  C09D5/4461 ,  H01B3/306 ,  H01L2924/0002 ,  H01L2924/12044

摘要： A polyimide is deposited onto a conductive substrate by providing a composition containing the polyimide and an electrolyte and/or reducing agent, providing the substrate and a counter electrode in the composition, and providing a bias between the substrate and counter electrode to thereby deposit the polyimide on the substrate.

摘要翻译： 通过提供含有聚酰亚胺和电解质和/或还原剂的组合物将聚酰亚胺沉积到导电基材上，在组合物中提供基材和对电极，并在基板和对电极之间提供偏压，从而沉积聚酰亚胺 在基板上。

公开(公告)号：US5133840A

公开(公告)日：1992-07-28

申请号：US523764

申请日：1990-05-15

申请人： Leena P. Buchwalter ,  Stephen L. Buchwalter ,  Terrence R. O'Toole ,  Richard R. Thomas ,  Alfred Viehbeck

发明人： Leena P. Buchwalter ,  Stephen L. Buchwalter ,  Terrence R. O'Toole ,  Richard R. Thomas ,  Alfred Viehbeck

IPC分类号： C08G73/10 ,  C08J7/12 ,  C09D179/08 ,  C09J5/02 ,  C23C18/20 ,  C23C18/22 ,  H05K3/38

CPC分类号： C08J7/12 ,  C23C18/22 ,  H05K3/381 ,  C08J2379/08

摘要： The surface modification of polyimide materials by a chemical process is disclosed to provide a variety of functional groups on the surface. The surface is treated to produce polyamic acid carboxyl groups which are subsequently reacted with epoxies, hydrazines, or alcohols. The carboxyl groups can be also be subjected to other organic reactions, such as reduction with metal hydrides and the like. The versatility and controllability of this process lends itself to promoting adhesion of the polyimide to similarly treated polyimides, other polymers and other substrates as well as combining with metals such as metal catalysts used for depositing conductors on non-conductive surfaces such as circuit boards.

公开(公告)号：US5021129A

公开(公告)日：1991-06-04

申请号：US411952

申请日：1989-09-25

申请人： Gary V. Arbach ,  Terrence R. O'Toole ,  Alfred Viehbeck

发明人： Gary V. Arbach ,  Terrence R. O'Toole ,  Alfred Viehbeck

IPC分类号： C08G73/10 ,  C23C18/16 ,  C23C18/31 ,  C25D5/02 ,  C25D5/54 ,  C25D7/00 ,  H01L21/48 ,  H01L23/12 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24

CPC分类号： H01L21/4846 ,  C23C18/1608 ,  C23C18/1641 ,  C23C18/2086 ,  C23C18/2093 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  C25D5/022 ,  C25D5/54 ,  H05K3/184 ,  H05K3/188 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K3/0023 ,  H05K3/0041 ,  H05K3/107 ,  Y10S205/926

摘要： Structures and methods of fabrication thereof wherein the method selectively supplies electrons to a first electroactive material in the presence of a second electroactive material wherein the first and second electroactive materials have different redox potentials. The electrons are selectively supplied either by electrochemical means or by appropriately chosen reducing agents. A structure fabricated by these methods has a first electroactive body disposed on a second electroactive body wherein the first body has a pattern therein exposing at the base thereof the surface of the second electroactive material body. Electrons can be selectively supplied to the surface of the second electroactive material body which is exposed at the base of the pattern in the first electroactive material body. Upon exposing the structure to a seeding solution seed is selectively supplied to those regions to which electrons have been selectively supplied. Electrically conductive material can then be electrolessly deposited onto the seed material to form an electrically conductive pattern in the pattern in the first electroactive body. The electroactive material bodies are preferably polyimide materials. The structures can be used as the top metallization levels of an electronic device such as a semiconductor chip or a semiconductor chip packaging substrate.

公开(公告)号：US4711708A

公开(公告)日：1987-12-08

申请号：US917383

申请日：1986-10-09

申请人： Thomas J. Meyer ,  Terrence R. O'Toole ,  Lawrence D. Margerum ,  T. David Westmoreland ,  William J. Vining ,  Royce W. Murray ,  B. Patrick Sullivan

发明人： Thomas J. Meyer ,  Terrence R. O'Toole ,  Lawrence D. Margerum ,  T. David Westmoreland ,  William J. Vining ,  Royce W. Murray ,  B. Patrick Sullivan

IPC分类号： C08G79/00 ,  B01D57/02 ,  C25B7/00

CPC分类号： C08G79/00

摘要： An electrode that has a film adsorbed to its surface by reductive electropolymerization of (vbpy)Re(CO).sub.3 Cl (4-vinyl-4'-methyl-2,2'-bipyridine tricarbonylchlororhenium(I)) or its acetonitrile analogue, [(vbpy)Re(CO).sub.3 (MeCN)].sup.+ (4-vinyl-4'-methyl-2,2'-bipyridine tricarbonylacetonitrile rhenium (I)). The poly (vbpy)Re(CO).sub.3 Cl or poly-[(vbpy)Re(CO).sub.3 (MeCN)].sup.+ adsorbed onto the electrode, acts as a catalyst for CO.sub.2 reduction to CO. Stability and the reactivity of the polymer film may be increased by co-reductive electropolymeriaztion of either of the aforesaid Re complexes with [(bpy).sub.2 Ru(vpy).sub.2.sup.2+ ](bis(4-vinyl-pyridine)bis(2,2'-bipyridine) ruthenium (II)) (vpy is 4-vinylpyridine). A bilayer film assembly consisting of poly-[(bpy).sub.2 Ru(vpy).sub.2 ].sup.2+ as an inner film and the aforementioned copolymer of Ru/Re yields even greater reactivity to CO.sub.2.A method of forming a polymeric film on an electrode.A method of reducing CO.sub.2 to CO using an electrode having a polymeric film adsorbed to its surface.

摘要翻译： 通过（vbpy）Re（CO）3Cl（4-乙烯基-4'-甲基-2,2'-联吡啶三羰基氯钌（I））或其乙腈类似物的还原电解聚合[ vbpy）Re（CO）3（MeCN）] +（4-乙烯基-4'-甲基-2,2'-联吡啶三羰基乙腈铼（I））。 吸附到电极上的聚（vbpy）Re（CO）3Cl或聚 - [（vbpy）Re（CO）3（MeCN）] +作为CO 2还原为CO的催化剂。稳定性和聚合物膜的反应性 可以通过上述Re配合物与[（bpy）2uu（vpy）22 +]（双（4-乙烯基 - 吡啶）双（2,2'-联吡啶）钌（II））的共还原电聚合来增加。 （vpy是4-乙烯基吡啶）。 由作为内膜的聚[（bpy）2u（vpy）2] 2 +和Ru / Re的上述共聚物组成的双层膜组合物对CO 2产生更大的反应性。 在电极上形成聚合物膜的方法。 使用吸附在其表面上的聚合物膜的电极将CO 2还原成CO的方法。