公开(公告)号：US08759840B2

公开(公告)日：2014-06-24

申请号：US12950128

申请日：2010-11-19

申请人： Hanako Kato ,  Yutaka Mori ,  Hiroshi Kobayashi ,  Tsubasa Tomura

发明人： Hanako Kato ,  Yutaka Mori ,  Hiroshi Kobayashi ,  Tsubasa Tomura

IPC分类号： H01L27/15

CPC分类号： H01L33/56 ,  C08G77/04 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor light-emitting device member excellent in transparency, light resistance, and heat resistance and capable of sealing a semiconductor light-emitting device without causing cracks and peeling even after a long-time use is provided wherein the semiconductor light-emitting device member contains (A) in a solid state Si-nuclear magnetic resonance spectrum, at least one peak selected from (a) peaks whose peak top position is in an area of a chemical shift of −40 ppm to 0 ppm inclusive, and whose full width at half maximum is 0.3 ppm to 3.0 ppm inclusive, and (b) peaks whose peak top position is in an area of the chemical shift of −80 ppm or more and less than −40 ppm, and whose full width at half maximum is 0.3 ppm to 5.0 ppm inclusive, wherein (B) silicon content is 20 weight % or more and (C) silanol content is 0.1 weight % to 10 weight % inclusive.

摘要翻译： 提供透明性，耐光性和耐热性优异的半导体发光元件，即使长时间使用也能够密封半导体发光元件而不引起裂纹和剥离的半导体发光元件，其中半导体发光元件 （A）为固态Si核磁共振谱，选自（a）峰顶位于-40ppm〜0ppm的化学位移范围内的峰的至少一个峰，其全宽度 半峰值为0.3ppm〜3.0ppm，（b）峰顶位置在-80ppm以上且小于-40ppm的化学位移范围内，峰值全差为0.3ppm的峰 至5.0ppm，其中（B）硅含量为20重量％以上，（C）硅烷醇含量为0.1重量％〜10重量％。

公开(公告)号：US08528688B2

公开(公告)日：2013-09-10

申请号：US13292711

申请日：2011-11-09

申请人： Yutaka Mori ,  Yoshiyuki Shibata

发明人： Yutaka Mori ,  Yoshiyuki Shibata

IPC分类号： B60R25/02

CPC分类号： B62D5/04 ,  B60R25/02153 ,  B62D5/0409 ,  H01F7/1615 ,  Y10T70/5956

摘要： A lock device that restricts movement of a movable body includes: a lock member that is engageable with an engagement portion formed at the movable body; an urging member that urges the lock member in a direction away from the engagement portion; and an actuator that moves the lock member toward the engagement portion to engage the lock member with the engagement portion against an urging force generated by the urging member.

摘要翻译： 限制可移动体的移动的锁定装置包括：锁定构件，其与形成在可移动体处的接合部分接合; 推动构件，其沿远离所述接合部的方向推压所述锁定构件; 以及致动器，其将锁定构件朝向接合部移动，以抵抗由推动构件产生的推动力而使锁定构件与接合部接合。

公开(公告)号：US08502364B2

公开(公告)日：2013-08-06

申请号：US12438283

申请日：2007-08-22

申请人： Hanako Kato ,  Yutaka Mori ,  Hiroshi Kobayashi ,  Tsubasa Tomura

发明人： Hanako Kato ,  Yutaka Mori ,  Hiroshi Kobayashi ,  Tsubasa Tomura

IPC分类号： H01L35/24 ,  H01L31/0312 ,  H01L23/58 ,  H01L23/02 ,  H01L51/00

CPC分类号： C09K11/7774 ,  C09K11/7721 ,  C09K11/7734 ,  C09K11/7735 ,  C09K11/7738 ,  C09K11/774 ,  C09K11/7775 ,  C09K11/7781 ,  C09K11/7789 ,  C09K11/7794 ,  C09K11/7795 ,  H01L23/24 ,  H01L23/293 ,  H01L24/17 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： To provide a semiconductor device member that is superior in heat resistance, light resistance, film-formation capability and adhesion, and is capable of sealing a semiconductor device and holding a phosphor without causing cracks, peelings and colorings even after used for a long period of time, the weight loss at the time of heating, measured by a predetermined weight-loss at-the-time-of-heating measurement method, is 50 weight % or lower and the ratio of peeling, measured by a predetermined adhesion evaluation method, is 30% or lower, in the semiconductor device member.

摘要翻译： 为了提供耐热性，耐光性，成膜性和粘合性优异的半导体器件部件，并且即使在长时间使用之后也能够密封半导体器件和保持荧光体而不引起裂纹，剥离和着色 时间，通过预定的加热温度测量方法的重量损失测量的加热时的重量损失为50重量％以下，通过预定的粘合性评价方法测定的剥离比例， 在半导体器件部件中为30％以下。

公开(公告)号：US07862931B2

公开(公告)日：2011-01-04

申请号：US10754111

申请日：2004-01-08

申请人： Jun Furukawa ,  Yasuyuki Nehyo ,  Yutaka Mori ,  Tomohiro Hiraki

发明人： Jun Furukawa ,  Yasuyuki Nehyo ,  Yutaka Mori ,  Tomohiro Hiraki

IPC分类号： H01M4/56 ,  H01M4/58

CPC分类号： H01M4/685 ,  C22C11/06 ,  H01M4/73

摘要： Provided is a lead-based alloy for a lead-acid battery, comprising not less than 0.02% and less than 0.05% by weight of calcium, not less than 0.4% and not more than 2.5% by weight of tin, not less than 0.005% and not more than 0.04% by weight of aluminum, not less than 0.002% and not more than 0.014% by weight of barium, and the balance of lead and unavoidable impurities.

摘要翻译： 本发明提供一种铅酸电池用铅系合金，其含有0.02重量％以上且小于0.05重量％的钙，不低于0.4重量％以上且2.5重量％以下的锡，不小于0.005重量％ ％且不超过0.04重量％的铝，不小于0.002重量％且不大于0.014重量％的钡，余量为铅和不可避免的杂质。

公开(公告)号：US20090309116A1

公开(公告)日：2009-12-17

申请号：US12438283

申请日：2007-08-22

申请人： Hanako Kato ,  Yutaka Mori ,  Hiroshi Kobayashi ,  Tsubasa Tomura

发明人： Hanako Kato ,  Yutaka Mori ,  Hiroshi Kobayashi ,  Tsubasa Tomura

IPC分类号： H01L33/00 ,  C09K11/02

CPC分类号： C09K11/7774 ,  C09K11/7721 ,  C09K11/7734 ,  C09K11/7735 ,  C09K11/7738 ,  C09K11/774 ,  C09K11/7775 ,  C09K11/7781 ,  C09K11/7789 ,  C09K11/7794 ,  C09K11/7795 ,  H01L23/24 ,  H01L23/293 ,  H01L24/17 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： To provide a semiconductor device member that is superior in heat resistance, light resistance, film-formation capability and adhesion, and is capable of sealing a semiconductor device and holding a phosphor without causing cracks, peelings and colorings even after used for a long period of time, the weight loss at the time of heating, measured by a predetermined weight-loss at-the-time-of-heating measurement method, is 50 weight % or lower and the ratio of peeling, measured by a predetermined adhesion evaluation method, is 30% or lower, in the semiconductor device member.

摘要翻译： 为了提供耐热性，耐光性，成膜性和粘合性优异的半导体器件部件，并且即使在长时间使用之后也能够密封半导体器件和保持荧光体而不引起裂纹，剥离和着色 时间，通过预定的加热温度测量方法的重量损失测量的加热时的重量损失为50重量％以下，通过预定的粘合性评价方法测定的剥离比例， 在半导体器件部件中为30％以下。

公开(公告)号：US07564008B2

公开(公告)日：2009-07-21

申请号：US11295150

申请日：2005-12-06

申请人： Yutaka Mori ,  Hiroto Matsuda ,  Kazuhiro Nobori

发明人： Yutaka Mori ,  Hiroto Matsuda ,  Kazuhiro Nobori

IPC分类号： H05B3/68 ,  C23C16/00

CPC分类号： H01L21/68757 ,  B23K35/24 ,  B23K35/32 ,  C04B35/645 ,  C04B37/025 ,  C04B37/026 ,  C04B2235/6562 ,  C04B2235/6567 ,  C04B2235/658 ,  C04B2237/086 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/403 ,  C04B2237/62 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/72 ,  C04B2237/76 ,  C04B2237/84 ,  H01L21/67103 ,  H01L21/6833 ,  Y10T29/49087

摘要： An electrostatic chuck includes a base of a sintered body containing alumina, an electrode as a power-supplied member embedded in the base and supplied with electric power, a bonding member embedded in the base and bonded to the electrode, in which a difference in coefficient of thermal expansion from the sintered body is 2×10−6/K or less, and a melting point is higher than baking temperature of the sintered body, and a terminal bonded to the electrode through the bonding member.

摘要翻译： 静电卡盘包括：包含氧化铝的烧结体的基体，嵌入基座中的电力供给部件的电极，供给电力;嵌入到基体中并与电极接合的接合部件，其中系数差 来自烧结体的热膨胀为2×10 -6 / K以下，熔点高于烧结体的烧结温度，以及通过接合部件与电极接合的端子。

公开(公告)号：US20090072255A1

公开(公告)日：2009-03-19

申请号：US11997926

申请日：2006-08-10

申请人： Tomoko Takahashi ,  Nobuhiro Kodama ,  Yasuo Shimomura ,  Naoto Kijima ,  Tomoyuki Kurushima ,  Takashi Hase ,  Eiji Hattori ,  Kouichi Adachi ,  Keiichi Seki ,  Yutaka Mori

发明人： Tomoko Takahashi ,  Nobuhiro Kodama ,  Yasuo Shimomura ,  Naoto Kijima ,  Tomoyuki Kurushima ,  Takashi Hase ,  Eiji Hattori ,  Kouichi Adachi ,  Keiichi Seki ,  Yutaka Mori

IPC分类号： H01L33/00 ,  C01F17/00 ,  C09K11/77

CPC分类号： C09K11/7734 ,  C09K11/584 ,  C09K11/642 ,  C09K11/665 ,  C09K11/7721 ,  C09K11/7738 ,  C09K11/7739 ,  C09K11/774 ,  C09K11/7741 ,  C09K11/7768 ,  C09K11/7774 ,  C09K11/7789 ,  C09K11/7792 ,  H01L33/502 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention relates to a phosphor that satisfies requirements (1) to (3): (1) the phosphor satisfies Formula [2] and/or Formula [3]: 85≦{R455(125)/R455(25)}×100

摘要翻译： 本发明涉及满足要求（1）〜（3）的荧光体：（1）荧光体满足式[2]和/或式[3]：<？in-line-formula description =“In-Line Formulas “end =”lead“？> 85 <= {R455（125）/ R455（25）} x100 <110 [2] <？in-line-formula description =”In-line Formulas“end =”tail“？> <？in-line-formula description =“In-line formula”end =“lead”？> 92 <= {R405（100）/ R405（25）} x100 <110 [3] 其中R455（125）表示当在125℃下峰值波长为455nm的光激发荧光体时的发射峰强度，（2）发射峰值 波长在570nm至680nm的范围内，（3）发射峰的半峰全宽为90nm以下。 本发明的荧光体具有高的发光效率并以高亮度发出橙色至红色的光。 通过使用荧光体，可以制造出效率高，显色性优异的发光装置，照明装置和图像显示装置。

公开(公告)号：US20070223167A1

公开(公告)日：2007-09-27

申请号：US11688332

申请日：2007-03-20

申请人： Akiyoshi Hattori ,  Yutaka Mori ,  Kazuhiro Nobori

发明人： Akiyoshi Hattori ,  Yutaka Mori ,  Kazuhiro Nobori

IPC分类号： H02H9/06

CPC分类号： C04B35/101

摘要： An alumina sintered body comprises an alumina substrate having a first main surface and a second main surface opposing each other, an embedded film electrode made of a metal and embedded in the alumina substrate at a depth HD of 0.4 mm or less from a first main surface SF1, and an embedded terminal formed of a metal, embedded in the alumina substrate nearer a second main surface SF2 side than the embedded electrode. The embedded terminal is in contact with the embedded electrode and a film thickness HE of the embedded electrode is 25 μm or less.

摘要翻译： 氧化铝烧结体包括具有彼此相对的第一主表面和第二主表面的氧化铝基体，由金属制成并嵌入氧化铝基底中的深度H D D为0.4的嵌入膜电极 mm以下的嵌入式端子，以及由金属构成的嵌入式端子，嵌入在氧化铝基板中，比嵌入的第二主表面SF2更靠近第二主表面SF2 电极。 嵌入式端子与嵌入式电极接触，嵌入式电极的膜厚H E为25μm以下。

公开(公告)号：US20050061087A1

公开(公告)日：2005-03-24

申请号：US10946239

申请日：2004-09-22

申请人： Hiroshi Kichise ,  Yutaka Mori

发明人： Hiroshi Kichise ,  Yutaka Mori

IPC分类号： G01D5/20 ,  G01D5/245 ,  G01L3/02 ,  G01L3/10 ,  G01L5/22

CPC分类号： G01L3/109

摘要： This invention provides a resolver signal processing method and apparatus capable of enlarging an appropriate computation possible range and relaxing the installation accuracy of mechanical components which constitute a resolver and its surroundings. The electrically-powered steering apparatus obtains a steering torque and a steering angle within an allowable input range of those inputted into a first resolver and a second resolver based on a real zero point α and further, a steering torque and a steering angle out of the allowable input range of those inputted to the first resolver and the second resolver based on (+) virtual zero point β and (−) virtual zero point γ, which are set to a different value from the real zero point α. Consequently, of the steering torques and steering angles inputted to the first resolver and the second resolver, the steering torque and steering angle out of the allowable input range impossible to obtain by the real zero point α can be obtained based on the (+) virtual zero point β and the (−) virtual zero point γ.

摘要翻译： 本发明提供了一种解析器信号处理方法和装置，其能够扩大适当的计算可能范围并放松构成旋转变压器及其周围环境的机械部件的安装精度。 电动转向装置在输入到第一旋转变压器和第二旋转变压器的允许输入范围内，基于实际零点α获得转向转矩和转向角，并且进一步地，转向转矩和转向转矩 基于（+）虚拟零点β和（ - ）虚拟零点γ输入到第一解算器和第二解析器的输入范围的允许输入范围，其被设置为与实际零点α不同的值。 因此，输入到第一解算器和第二解算器的转向转矩和转向角中，可以基于（+）虚拟值获得不可能通过实际零点α获得的允许输入范围之外的转向转矩和转向角 零点β和（ - ）虚拟零点伽马。

公开(公告)号：US20050056976A1

公开(公告)日：2005-03-17

申请号：US10903893

申请日：2004-07-30

申请人： Hiroto Matsuda ,  Kazuhiro Nobori ,  Yutaka Mori

发明人： Hiroto Matsuda ,  Kazuhiro Nobori ,  Yutaka Mori

IPC分类号： H05B3/20 ,  C04B35/00 ,  H01C17/065 ,  H01C17/28 ,  H01L21/00 ,  H01L21/02 ,  H01L21/68 ,  H01L21/683 ,  H05B3/10 ,  H05B3/12 ,  H05B3/14 ,  H05B3/18 ,  H05B3/74

CPC分类号： H01L21/67103 ,  H01C17/06513 ,  H01C17/288 ,  H01L21/6831 ,  Y10T29/49083 ,  Y10T29/49087 ,  Y10T29/49098 ,  Y10T29/49124 ,  Y10T29/49158 ,  Y10T29/49163

摘要： A method of manufacturing an electrical-resistance heating element includes forming sintered ceramics or calcined ceramics, forming an electrode on the sintered ceramics or the calcined ceramics, and forming a ceramic base material having mainly a high melting point metal on the electrode embedded therein, thereby forming a heating element with built-in electrode.

摘要翻译： 电阻加热元件的制造方法包括：在烧结陶瓷或煅烧陶瓷上形成烧结陶瓷或煅烧陶瓷，形成电极，在其上嵌入的电极上形成主要具有高熔点金属的陶瓷基材， 形成具有内置电极的加热元件。