Abstract:
A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section. Assuming that the thickness of a gate insulating film of the second transistor section is defined as tc and the thickness of a gate insulating film of the first transistor section is defined as tm, they have a relationship of tc
Abstract:
A nonvolatile memory includes a control register (CRG) for providing instructions as to basic operations such as writing, erasing, reading, etc., a boosted voltage attainment detecting circuit for detecting whether a voltage boosted by a booster circuit has reached a desired level, a circuit which counts the time required to apply each of write and erase voltages, and a circuit which detects the completion of the writing or erasing. Respective operations are automatically advanced by simple setting of the operation instructions to the control register. After the completion of the operations, an end flag (FLAG) provided within the control register is set to notify the completion of the writing or erasing.
Abstract:
Disclosed is a nonvolatile memory system including at least one nonvolatile memory each having a plurality of nonvolatile memory cells and a buffer memory; and a control device coupled to the nonvolatile memory. The control device is enabled to receive external data and to store the data in the nonvolatile memory, and the nonvolatile memory is capable of performing at least a program operation and an erase operation. Moreover, the control device is enabled to receive external data while the nonvolatile memory is operating in the erase operation. Also, the buffer memory is capable of receiving a unit of data, in the program operation, equal to the data length of data to be stored at one time of the program operation, the data length being more than 1 byte.
Abstract:
A method for settling threshold voltages of word lines on a predetermined level in an erasing processing of a non-volatile semiconductor memory device so as to speed up the erasing processing. A word latch circuit is provided for each word line and the threshold voltage of each memory cell is managed for-each word line in a selected memory block. Each word latch circuit is shared by a plurality of word lines so as to reduce the required chip area. A rewriting voltage is set for each finished non-volatile memory and the voltage information is stored in the boot area of the non-volatile memory, so that the voltage is recognized by the system each time the system is powered.
Abstract:
The present invention proposes a non-volatile semiconductor storage, comprising a plurality of main bit lines, a plurality of sub bit lines connected to the main bit lines, and a plurality of memory cell arrays, each including a plurality of non-volatile semiconductor memory cells disposed like an array. Each of those memory cells has a source terminal, a drain terminal, and a control gate, and each source-drain path is connected to a sub bit line. Between a main bit line and a sub bit line connected to the main bit line is disposed the source-drain path of a first transistor, and the source-drain path of a second transistor is connected to the sub bit line.
Abstract:
In a semiconductor storage device wherein data lines connected to a plurality of memory cells selected by a select operation of word lines are sequentially selected by using an address signal generated by an address counter to serially read data in individual unit of at least one word line: redundancy data lines disposed perpendicular to the word lines are provided; a column select circuit receiving a Y address signal selects one of the data lines or redundancy data lines; a redundancy memory circuit stores, in the order of the selection operation by the column select circuit, a defect address signal of a defect data line among the data lines and a redundancy address signal of a corresponding redundancy data line; an address comparator circuit compares one defect address signal read from the redundancy memory circuit with an address signal generated by the address counter; an address signal for the redundancy memory circuit is generated by performing a count operation in response to a coincidence signal generated by the address comparator circuit; and the address signal generated by the address counter is replaced by a redundancy address signal read in response to the coincidence signal from the redundancy memory circuit and used as the Y address signal. Accordingly, a redundancy circuit of simple configuration can be obtained because only a single address comparator circuit is used.
Abstract:
An alkoxylation catalyst comprising metal oxides, having a basicity point expressed in pKa value from 9 to 25 and an acidity point expressed in the amount of ammonia gas adsorbed from 50 to 500 .mu.mol/g, and a process for preparing an alkoxylate with the use of this catalyst. According to the present invention, an alkoxylate having a distribution of the number of moles of alkylene oxide added within a narrow range can be prepared and the reaction product is little contaminated with unreacted starting material and by-products. Further, the catalyst can easily be eliminated from the reaction product.
Abstract:
Each memory cell of a non-volatile semiconductor memory essentially consisting of a one-transistor type memory cell comprising only of an MOSFET having a floating gate electrode. When an electric programming operation is carried out, a positive voltage is applied to an n type drain region, a negative voltage is applied to a control gate and a source region is grounded. When an erasing operation is carried out, the positive voltage is applied to the control gate while all the other electrodes and a semiconductor substrate are grounded. Low power consumption can be accomplished because both of the programming operation and erasing operations are carried out by utilizing a tunneling mechanism. Particularly because the negative voltage is used for the word line, a drain voltage at the time of programming of data can be lowered, so that degradation of a gate oxide film at a channel portion can be mitigated.
Abstract:
An arrangement is provided to enhance the speed in the operation of erasing and programming of a nonvolatile semiconductor memory that is driven by a single supply voltage and to reduce the number of transistors making up the subword decoder circuit thereby minimizing the size of the device. For this purpose, in the subword decoder circuits WDi1-WDij that drive the word lines Wi1-Wij, the block selection address lines Bip and Bin generated from the first address line group are used as supply voltages for the inverter circuit that controls the voltage of the word line, and the gate selection address line Gj generated from the second address line group is used a gate input line.
Abstract:
A semiconductor nonvolatile memory device capable of reducing the overhead time of the time required for switching the verify operation and the verify operation itself. In the semiconductor nonvolatile memory device which operates to program the threshold of the memory cells on the basis of a plurality of repetitive operations, the mincing width .increment.Vth of the variation of the threshold of the memory cells relative to one operation for changing the threshold (applying the program pulse) is expressed by .increment.Vth=Kvth.multidot.log (t2/t1), and the ratio (t2/t1) between the program pulse widths is expressed by (t2/t1)=10E(.increment.Vth/Kvth). The pulses in which the difference .increment.Vth of the variation of the threshold of the memory cells is made constant, and the pulse width is increased as the repetition number increases are applied to the memory cells, thereby reducing the application number of program pulses.