公开(公告)号：US20090047446A1

公开(公告)日：2009-02-19

申请号：US12256405

申请日：2008-10-22

申请人： Ganesh Balasubramanian ,  Juan Carlos Rocha-Alvarez ,  Tom K. Cho ,  Daemian Raj

发明人： Ganesh Balasubramanian ,  Juan Carlos Rocha-Alvarez ,  Tom K. Cho ,  Daemian Raj

IPC分类号： C23C16/455 ,  H05H1/24

CPC分类号： C23C16/4405 ,  C23C16/45565 ,  C23C16/45574

摘要： Apparatus and methods for distributing gases into a processing chamber are disclosed. In one embodiment, the apparatus includes a gas distribution plate having a plurality of apertures disposed therethrough and a blocker plate having both a plurality of apertures disposed therethrough and a plurality of feed through passageways disposed therein. A first gas pathway delivers a first gas through the plurality of apertures in the blocker plate with sufficient pressure drop to more evenly distribute the gases prior to passing through the gas distribution plate. A bypass gas pathway delivers a second gas through the plurality of feed through passageways in the blocker plate and to areas around the blocker plate prior to the second gas passing through the gas distribution plate.

摘要翻译： 公开了将气体分配到处理室中的装置和方法。 在一个实施例中，该装置包括一个气体分配板，该气体分配板具有穿过其中的多个孔，以及一个阻挡板，其具有设置在其间的多个孔和设置在其中的多个进给通道。 第一气体通道以足够的压降将阻塞板中的多个孔中的第一气体输送，以在通过气体分布板之前更均匀地分布气体。 旁路气体通道在第二气体通过气体分配板之前，通过多个进料通过阻挡板中的通道和阻塞板周围的区域输送第二气体。

公开(公告)号：US07354501B2

公开(公告)日：2008-04-08

申请号：US10150458

申请日：2002-05-17

申请人： Sudhir Gondhalekar ,  Tom K. Cho ,  Rolf Guenther ,  Steve H. Kim ,  Mehrdad Moshfegh ,  Shigeru Takehiro ,  Thomas Kring ,  Tetsuya Ishikawa

发明人： Sudhir Gondhalekar ,  Tom K. Cho ,  Rolf Guenther ,  Steve H. Kim ,  Mehrdad Moshfegh ,  Shigeru Takehiro ,  Thomas Kring ,  Tetsuya Ishikawa

IPC分类号： C23C16/00 ,  H01L21/306

CPC分类号： H01J37/32522 ,  C23C16/507 ,  H01J37/321

摘要： The present invention is directed to an upper chamber design of a plasma CVD chamber which provides more uniform conditions for forming thin CVD films on a substrate. Embodiments of the invention improve temperature control of the upper chamber and improve particle performance by reducing or minimizing the temperature fluctuations on the dome between the deposition and non-deposition cycles. In accordance with an aspect of the present invention, an apparatus for processing semiconductor substrates comprises a chamber defining a plasma processing region therein. The chamber includes a bottom, a side wall, and a dome disposed on top of the side wall. The dome has a substantially flat dome top. A top RF coil is disposed above the dome top, and has an outer loop which is larger in size than the substrates to be processed in the chamber. A cold plate is disposed above the top RF coil, and is larger in size than the substrates to be processed in the chamber.

摘要翻译： 本发明涉及一种等离子体CVD室的上室设计，其提供在衬底上形成薄CVD膜的更均匀的条件。 本发明的实施例通过减少或最小化沉积和非沉积循环之间的圆顶上的温度波动来改善上室的温度控制并提高颗粒性能。 根据本发明的一个方面，用于处理半导体衬底的设备包括限定其中的等离子体处理区域的室。 该室包括底部，侧壁和设置在侧壁顶部的圆顶。 圆顶具有基本平坦的圆顶。 顶部RF线圈设置在圆顶顶部上方，并且具有比在腔室中要处理的基板尺寸更大的外环。 冷板设置在顶部RF线圈上方，并且尺寸大于在腔室中要处理的基板。

公开(公告)号：US06450117B1

公开(公告)日：2002-09-17

申请号：US09633494

申请日：2000-08-07

申请人： Laxman Murugesh ,  Padmanaban Krishnaraj ,  Michael Cox ,  Canfeng Lai ,  Narendra Dubey ,  Tom K. Cho ,  Sudhir Ram Gondhalekar ,  Lily L. Pang

发明人： Laxman Murugesh ,  Padmanaban Krishnaraj ,  Michael Cox ,  Canfeng Lai ,  Narendra Dubey ,  Tom K. Cho ,  Sudhir Ram Gondhalekar ,  Lily L. Pang

IPC分类号： C23C1600

CPC分类号： C23C16/45574 ,  C23C16/4402 ,  C23C16/4405 ,  C23C16/452 ,  C23C16/45508 ,  H01J37/3244 ,  H01J37/32862 ,  Y10S438/905

摘要： A substrate processing chamber 30 comprising a first gas distributor 65 adapted to provide a process gas into the chamber 30 to process the substrate 25, a second gas distributor 215 adapted to provide a cleaning gas into the chamber 30 to clean the chamber, and an exhaust 90 to exhaust the process gas or cleaning gas from the chamber 30.

摘要翻译： 衬底处理室30，其包括适于将处理气体提供到室30中以处理衬底25的第一气体分配器65，适于将清洁气体提供到腔室30中以清洁腔室的第二气体分配器215以及排气 以从腔室30排出处理气体或清洁气体。

公开(公告)号：US08203126B2

公开(公告)日：2012-06-19

申请号：US12841935

申请日：2010-07-22

申请人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Andrzei Kaszuba ,  Tom K. Cho

发明人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Andrzei Kaszuba ,  Tom K. Cho

IPC分类号： G01N21/00 ,  G01N21/33 ,  B01J19/08 ,  B29C35/08

CPC分类号： B05D3/0209 ,  B05D3/0493 ,  B05D3/067 ,  H01L21/31058 ,  H01L21/67115

摘要： Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed.

摘要翻译： 本发明的实施方案一般涉及用于固化设置在基底上的介电材料的紫外（UV）固化室和使用UV辐射固化电介质材料的方法。 根据一个实施例的基板处理工具包括限定基板处理区域的主体; 衬底支撑件，适于支撑衬底处理区域内的衬底; 与衬底支撑件间隔开的紫外线辐射灯，所述灯被配置为将紫外线辐射透射到位于所述衬底支撑件上的衬底; 以及可操作地耦合以使所述紫外线辐射灯或衬底支撑体中的至少一个相对于彼此旋转至少180度的电动机。 衬底处理工具还可以包括一个或多个反射器，其适于在衬底上产生具有互补的高和低强度区域的紫外线辐射的泛化图案，其结合以在旋转时产生基本上均匀的辐照度图案。 还公开了其他实施例。

公开(公告)号：US20100285240A1

公开(公告)日：2010-11-11

申请号：US12841935

申请日：2010-07-22

申请人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Andrzei Kaszuba ,  Tom K. Cho

发明人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Andrzei Kaszuba ,  Tom K. Cho

IPC分类号： B05D3/06

CPC分类号： B05D3/0209 ,  B05D3/0493 ,  B05D3/067 ,  H01L21/31058 ,  H01L21/67115

摘要： Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed.

摘要翻译： 本发明的实施方案一般涉及用于固化设置在基底上的介电材料的紫外（UV）固化室和使用UV辐射固化电介质材料的方法。 根据一个实施例的基板处理工具包括限定基板处理区域的主体; 衬底支撑件，适于支撑衬底处理区域内的衬底; 与衬底支撑件间隔开的紫外线辐射灯，所述灯被配置为将紫外线辐射透射到位于所述衬底支撑件上的衬底; 以及可操作地耦合以使所述紫外线辐射灯或衬底支撑体中的至少一个相对于彼此旋转至少180度的电动机。 衬底处理工具还可以包括一个或多个反射器，其适于在衬底上产生具有互补的高和低强度区域的紫外线辐射的泛化图案，其结合以在旋转时产生基本上均匀的辐照度图案。 还公开了其他实施例。

公开(公告)号：US07777198B2

公开(公告)日：2010-08-17

申请号：US11686881

申请日：2007-03-15

申请人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Andrzei Kaszuba ,  Tom K. Cho

发明人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Andrzei Kaszuba ,  Tom K. Cho

IPC分类号： H01J37/20

CPC分类号： B05D3/0209 ,  B05D3/0493 ,  B05D3/067 ,  H01L21/31058 ,  H01L21/67115

摘要： Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed.

摘要翻译： 本发明的实施方案一般涉及用于固化设置在基底上的介电材料的紫外（UV）固化室和使用UV辐射固化电介质材料的方法。 根据一个实施例的基板处理工具包括限定基板处理区域的主体; 衬底支撑件，适于支撑衬底处理区域内的衬底; 与衬底支撑件间隔开的紫外线辐射灯，所述灯被配置为将紫外线辐射透射到位于所述衬底支撑件上的衬底; 以及可操作地耦合以使所述紫外线辐射灯或衬底支撑体中的至少一个相对于彼此旋转至少180度的电动机。 衬底处理工具还可以包括一个或多个反射器，其适于在衬底上产生具有互补的高和低强度区域的紫外线辐射的泛化图案，其结合以在旋转时产生基本上均匀的辐照度图案。 还公开了其他实施例。

公开(公告)号：US20100151127A1

公开(公告)日：2010-06-17

申请号：US12628034

申请日：2009-11-30

申请人： Tom K. Cho ,  Lun Tsuei ,  Kuan-Yuan Peng ,  Kyle S. Reinke ,  Brian Sy-Yuan Shieh

发明人： Tom K. Cho ,  Lun Tsuei ,  Kuan-Yuan Peng ,  Kyle S. Reinke ,  Brian Sy-Yuan Shieh

IPC分类号： C23C16/52 ,  C23C16/00

CPC分类号： C23C16/4401 ,  H01L21/67259 ,  H01L21/67288 ,  H01L21/68742

摘要： Embodiments of the present invention generally provide apparatus and methods for preventing contamination within a processing system due to substrate breakage. In one embodiment, an acoustic detection mechanism is disposed on or within a process chamber to monitor conditions within the process chamber. In one embodiment, the acoustic detection mechanism detects conditions indicative of substrate breakage within the process chamber. In one embodiment, the acoustic detection mechanism detects conditions that are known to lead to substrate breakage within the process chamber. In one embodiment, the acoustic detection mechanism is combined with an optical detection mechanism. By early detection of substrate breakage or conditions known to lead to substrate breakage, the process chamber may be taken off line and repaired prior to contamination of the entire process system.

摘要翻译： 本发明的实施方案通常提供用于防止由于基底破裂而导致处理系统内的污染的装置和方法。 在一个实施例中，声学检测机构设置在处理室内或内部，以监测处理室内的状况。 在一个实施例中，声学检测机构检测指示处理室内的衬底断裂的条件。 在一个实施例中，声学检测机构检测已知导致处理室内的基板破裂的状况。 在一个实施例中，声学检测机构与光学检测机构组合。 通过早期检测到底物断裂或已知导致基底破裂的条件，处理室可以在整个过程系统被污染之前脱机并修复。

公开(公告)号：US07572337B2

公开(公告)日：2009-08-11

申请号：US11131010

申请日：2005-05-16

申请人： Juan Carlos Rocha-Alvarez ,  Ganesh Balasubramanian ,  Tom K. Cho ,  Deenesh Padhi ,  Thomas Nowak ,  Bok Hoen Kim ,  Hichem M'Saad ,  Daemian Raj

发明人： Juan Carlos Rocha-Alvarez ,  Ganesh Balasubramanian ,  Tom K. Cho ,  Deenesh Padhi ,  Thomas Nowak ,  Bok Hoen Kim ,  Hichem M'Saad ,  Daemian Raj

IPC分类号： C23C16/455 ,  C23F1/00 ,  H01L21/306 ,  C23C16/06 ,  C23C16/22

CPC分类号： C23C16/45574 ,  C23C16/4405 ,  C23C16/45565 ,  H01J37/3244 ,  H01J37/32449

摘要： Apparatus and methods for distributing gases into a processing chamber are disclosed. In one embodiment, the apparatus includes a gas distribution plate having a plurality of apertures disposed therethrough and a blocker plate having both a plurality of apertures disposed therethrough and a plurality of feed through passageways disposed therein. A first gas pathway delivers a first gas through the plurality of apertures in the blocker plate and the gas distribution plate. A bypass gas pathway delivers a second gas through the plurality of feed through passageways in the blocker plate and to areas around the blocker plate prior to the second gas passing through the gas distribution plate.

摘要翻译： 公开了将气体分配到处理室中的装置和方法。 在一个实施例中，该装置包括一个气体分配板，该气体分配板具有穿过其中的多个孔，以及一个阻挡板，其具有设置在其间的多个孔和设置在其中的多个进给通道。 第一气体通道通过阻挡板和气体分配板中的多个孔传送第一气体。 旁路气体通道在第二气体通过气体分配板之前，通过多个进料通过阻挡板中的通道和阻塞板周围的区域输送第二气体。

公开(公告)号：US07566891B2

公开(公告)日：2009-07-28

申请号：US11686878

申请日：2007-03-15

申请人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Andrzei Kaszuba ,  Tom K. Cho

发明人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Andrzei Kaszuba ,  Tom K. Cho

IPC分类号： G01N21/00 ,  G01N21/33 ,  B01J19/08 ,  B29C35/08

CPC分类号： B05D3/067

摘要： Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed.

摘要翻译： 本发明的实施方案一般涉及用于固化设置在基底上的介电材料的紫外（UV）固化室和使用UV辐射固化电介质材料的方法。 根据一个实施例的基板处理工具包括限定基板处理区域的主体; 衬底支撑件，适于支撑衬底处理区域内的衬底; 与衬底支撑件间隔开的紫外线辐射灯，所述灯被配置为将紫外线辐射透射到位于所述衬底支撑件上的衬底; 以及可操作地耦合以使所述紫外线辐射灯或衬底支撑体中的至少一个相对于彼此旋转至少180度的电动机。 衬底处理工具还可以包括一个或多个反射器，其适于在衬底上产生具有互补的高和低强度区域的紫外线辐射的泛化图案，其结合以在旋转时产生基本上均匀的辐照度图案。 还公开了其他实施例。

公开(公告)号：US07141138B2

公开(公告)日：2006-11-28

申请号：US10630989

申请日：2003-07-28

申请人： Sudhir Gondhalekar ,  Padmanabhan Krishnaraj ,  Tom K. Cho ,  Muhammad Rasheed ,  Hemant Mungekar ,  Thanh N. Pham ,  Zhong Qiang Hua

发明人： Sudhir Gondhalekar ,  Padmanabhan Krishnaraj ,  Tom K. Cho ,  Muhammad Rasheed ,  Hemant Mungekar ,  Thanh N. Pham ,  Zhong Qiang Hua

IPC分类号： H01L21/306 ,  C23C16/00 ,  C23F1/00

CPC分类号： H01L21/67017 ,  H01L21/67109

摘要： The present invention is directed to improving defect performance in semiconductor processing systems. In specific embodiments, an apparatus for processing semiconductor substrates comprises a chamber defining a processing region therein, and a substrate support disposed in the chamber to support a semiconductor substrate. At least one nozzle extends into the chamber to introduce a process gas into the chamber through a nozzle opening. The apparatus comprises at least one heat shield, each of which is disposed around at least a portion of one of the at least one nozzle. The heat shield has an extension which projects distally of the nozzle opening of the nozzle and which includes a heat shield opening for the process gas to flow therethrough from the nozzle opening. The heat shield decreases the temperature of nozzle in the processing chamber for introducing process gases therein to reduce particles.