公开(公告)号：US20070022827A1

公开(公告)日：2007-02-01

申请号：US11492090

申请日：2006-07-25

申请人： Hiroshi Ishikawa ,  Satoshi Sano ,  Takashi Katsuki ,  Yuji Takahashi ,  Fumihiko Nakazawa ,  Takayuki Yamaji

发明人： Hiroshi Ishikawa ,  Satoshi Sano ,  Takashi Katsuki ,  Yuji Takahashi ,  Fumihiko Nakazawa ,  Takayuki Yamaji

IPC分类号： G01L3/18

CPC分类号： G01C19/5719

摘要： An angular velocity sensor includes a first gimbal portion, a second gimbal portion connected to the first gimbal portion by first torsion bars provided at opposing sides of the first gimbal portion, a frame portion connected to the second gimbal portion by second torsion bars provided at the opposing sides of the second gimbal portion, first electrostatic coupling portions provided at the opposing sides of the first gimbal portion to electrostatically couple the first gimbal portion and the second gimbal portion, and second electrostatic coupling portions provided at the opposing sides of the second gimbal portion to electrostatically couple the second gimbal portion and the frame portion. In the first gimbal portion, a maximum width of sides of a direction of the first torsion bars is greater than that of the sides where the first torsion bars are provided.

摘要翻译： 角速度传感器包括第一万向架部分，第一万向架部分，通过设置在第一万向架部分的相对侧的第一扭杆连接到第一万向节部分;框架部分，通过设置在第一万向节部件上的第二扭杆连接到第二万向节部分 第二万向节部分的相对侧，设置在第一万向架部分相对侧的第一静电耦合部分，以静电耦合第一万向节部分和第二万向节部分;以及设置在第二万向节部分的相对侧的第二静电耦合部分 以静电耦合第二万向节部分和框架部分。 在第一万向节部分中，第一扭杆的方向的最大宽度的宽度大于设置第一扭杆的侧面的最大宽度。

公开(公告)号：US20060214921A1

公开(公告)日：2006-09-28

申请号：US11204056

申请日：2005-08-16

申请人： Yuji Takahashi ,  Fumihiko Nakazawa ,  Satoshi Sano ,  Takashi Katsuki

发明人： Yuji Takahashi ,  Fumihiko Nakazawa ,  Satoshi Sano ,  Takashi Katsuki

IPC分类号： G09G5/00

CPC分类号： G06F3/0436

摘要： A touch panel device includes an excitation transducer for exciting a surface acoustic wave upon application of a burst wave and a reception transducer for receiving the surface acoustic wave and converting the same into a reception signal that are arranged at a peripheral portion of a detection area so that a position of an object touching the detection area is detected in accordance with a change in the reception signal. A control method for eliminating noises in the touch panel device includes the steps of detecting a differential between a reception signal due to a burst wave and another reception signal due to another burst wave, deciding that there is a noise if the detected differential exceeds a preset threshold value, and performing a control operation so that the detection of an object based on the reception signal is not performed in accordance with the decision.

摘要翻译： 一种触摸面板装置包括用于在施加突发波时激发表面声波的激励换能器和用于接收表面声波并将其转换为布置在检测区域的周边部分的接收信号的接收换能器，因此 根据接收信号的变化来检测接触检测区域的物体的位置。 用于消除触摸面板装置中的噪声的控制方法包括以下步骤：检测由于突发波引起的接收信号与由于另一突发波引起的另一个接收信号之间的差分，如果检测到的差异超过预设值，则确定存在噪声 阈值，并且执行控制操作，使得根据该决定不执行基于接收信号的对象的检测。

公开(公告)号：US08816452B2

公开(公告)日：2014-08-26

申请号：US13613424

申请日：2012-09-13

申请人： Tadashi Nakatani ,  Hisao Okuda ,  Takashi Katsuki

发明人： Tadashi Nakatani ,  Hisao Okuda ,  Takashi Katsuki

IPC分类号： H01L29/86

CPC分类号： B81B3/0067 ,  B81B3/0021 ,  B81B2203/0118 ,  B81B2203/04 ,  H01H59/0009 ,  H01H2057/006 ,  H01L41/0805 ,  H01L41/0933

摘要： There is provided an electric device including a base member, a beam elastically deformable to bend upward and having an outline partially defined by a slit formed in the base member, a conductive pattern provided on a top surface of the beam, a contact electrode provided above the conductive pattern, the contact electrode coming into contact with the conductive pattern, and a bridge electrode elastically deformable, the bridge electrode connecting the conductive pattern and a portion of the base member outside the outline.

摘要翻译： 提供了一种电气装置，其包括基部构件，弹性变形以向上弯曲并具有由形成在基底构件中的狭缝部分限定的轮廓的梁，设置在梁的顶表面上的导电图案，设置在上述 所述导电图案，所述接触电极与所述导电图案接触;以及桥接电​​极，其可弹性变形，所述桥接电极将所述导电图案与所述基部构件的一部分连接在所述轮廓外部。

公开(公告)号：US08289723B2

公开(公告)日：2012-10-16

申请号：US12458604

申请日：2009-07-16

申请人： Hiroaki Inoue ,  Takashi Katsuki ,  Fumihiko Nakazawa

发明人： Hiroaki Inoue ,  Takashi Katsuki ,  Fumihiko Nakazawa

IPC分类号： H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC分类号： G01P15/125 ,  B81C1/00301 ,  G01C19/5719 ,  G01P1/023 ,  G01P15/0802 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  Y10T29/49128 ,  H01L2924/00

摘要： A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer.

摘要翻译： 一种方法包括在包括在第一晶片中的第一区域中形成凹槽以形成由凹槽限定的布线区域; 在槽中形成绝缘部分; 在形成有所述布线区域的所述第一晶片的表面之后，在形成所述绝缘部分之后，将包括器件形成区域的器件晶片的第一表面接合; 在将所述第一晶片连接到所述器件晶片之后，在所述第一晶片的布线区域中形成通孔，所述孔延伸穿过所述第一晶片; 用导电材料填充孔; 将第二晶片连接到与所述第一表面相对的所述器件晶片的第二表面，所述第二晶片包括第二区域; 在将第一晶片连接到器件晶片之后，通过使第一晶片变薄来暴露布线区域; 以及在使所述第一晶片变薄之后切割所述器件晶片，所述第一晶片和所述第二晶片。

公开(公告)号：US20120175757A1

公开(公告)日：2012-07-12

申请号：US13347898

申请日：2012-01-11

申请人： Takashi Katsuki

发明人： Takashi Katsuki

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L24/92 ,  F02P3/0453 ,  H01L23/3107 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/49589 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/29101 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48755 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2224/85455 ,  H01L2224/92 ,  H01L2224/922 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19106 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85

摘要： A method of manufacturing a semiconductor apparatus according to aspects of the invention can include the steps of coating solder on an predetermined area in the upper surface of a lead frame, mounting a chip on solder and melting solder with a hot plate for bonding the chip to the lead frame. The method can also include wiring with bonding wires, turning lead frame upside down, placing lead frame turned upside down on heating cradle, coating solder, the melting point of which is lower than the solder melting point and mounting electronic part on solder; and melting solder with heating cradle for bonding electronic part to lead frame. The bonding with solder can be conducted at a high ambient temperature. Aspects of the semiconductor apparatus can facilitate mounting semiconductor devices and electronic parts on both surfaces of a lead frame divided to form wiring circuits without through complicated manufacturing steps.

摘要翻译： 根据本发明的方面的半导体装置的制造方法可以包括以下步骤：在引线框架的上表面的预定区域上涂覆焊料，将芯片安装在焊料上并用焊盘熔化焊料，以将芯片接合到 引线框架。 该方法还可以包括使用接合线布线，将引线框倒置，将引线框倒置在加热托架上，涂层焊料熔点低于焊料熔点，并将电子部件安装在焊料上; 并用加热支架熔化焊料，用于将电子部件接合到引线框架。 与焊料的接合可以在高环境温度下进行。 半导体装置的方面可以有助于在引导框架的两个表面上安装半导体装置和电子部件，以分离形成布线电路，而无需通过复杂的制造步骤。

公开(公告)号：US07859522B2

公开(公告)日：2010-12-28

申请号：US11204056

申请日：2005-08-16

申请人： Yuji Takahashi ,  Fumihiko Nakazawa ,  Satoshi Sano ,  Takashi Katsuki

发明人： Yuji Takahashi ,  Fumihiko Nakazawa ,  Satoshi Sano ,  Takashi Katsuki

IPC分类号： G06F3/043

CPC分类号： G06F3/0436

摘要： A touch panel device includes an excitation transducer for exciting a surface acoustic wave upon application of a burst wave and a reception transducer for receiving the surface acoustic wave and converting the same into a reception signal that are arranged at a peripheral portion of a detection area so that a position of an object touching the detection area is detected in accordance with a change in the reception signal. A control method for eliminating noises in the touch panel device includes the steps of detecting a differential between a reception signal due to a burst wave and another reception signal due to another burst wave, deciding that there is a noise if the detected differential exceeds a preset threshold value, and performing a control operation so that the detection of an object based on the reception signal is not performed in accordance with the decision.

摘要翻译： 一种触摸面板装置包括用于在施加突发波时激发表面声波的激励换能器和用于接收表面声波并将其转换为布置在检测区域的周边部分的接收信号的接收换能器，因此 根据接收信号的变化来检测接触检测区域的物体的位置。 用于消除触摸面板装置中的噪声的控制方法包括以下步骤：检测由于突发波引起的接收信号与由于另一个突发波形引起的另一个接收信号之间的差异，如果检测到的差分超过预设值，则确定存在噪声 阈值，并且执行控制操作，使得根据该决定不执行基于接收信号的对象的检测。

公开(公告)号：US20090156083A1

公开(公告)日：2009-06-18

申请号：US12278697

申请日：2006-02-08

申请人： Fumihiko Nakazawa ,  Takashi Katsuki ,  Yuji Takahashi ,  Satoshi Sato ,  Satoshi Sasaki ,  Tamotsu Watanabe ,  Kunizo Ogoshi ,  Michiko Endo

发明人： Fumihiko Nakazawa ,  Takashi Katsuki ,  Yuji Takahashi ,  Satoshi Sato ,  Satoshi Sasaki ,  Tamotsu Watanabe ,  Kunizo Ogoshi ,  Michiko Endo

IPC分类号： H01J9/24

CPC分类号： G06F3/0436 ,  G06F3/0412

摘要： First electrodes partially configuring light-emitting elements are patterned in the form of stripes on a first major surface of a transparent substrate. After the step of forming the first electrodes, piezoelectric elements functioning a SAW touch sensor is formed on a second major surface of the transparent substrate. Furthermore, after the step of forming the piezoelectric elements, the light-emitting elements forming step of forming light-emitting elements on the first electrodes which are patterned in advance is sequentially executed.Since the first electrodes are formed in the form of stripes, the piezoelectric elements can be prevented from being damaged by an etching solution used at this time. After the formation of the piezoelectric elements, since the step of forming the light-emitting elements is executed, the light-emitting elements can be prevented from being damaged by receiving heat in the formation of the piezoelectric elements.

摘要翻译： 部分地配置发光元件的第一电极在透明衬底的第一主表面上以条纹的形式被图案化。 在形成第一电极的步骤之后，在透明基板的第二主表面上形成用作SAW触摸传感器的压电元件。 此外，在形成压电元件的步骤之后，依次执行在预先图案化的第一电极上形成发光元件的形成步骤的发光元件。 由于第一电极形成为条状，因此可以防止压电元件被此时使用的蚀刻溶液损坏。 在形成压电元件之后，由于执行形成发光元件的步骤，可以通过在压电元件的形成中受热来防止发光元件的损坏。

公开(公告)号：US07423636B2

公开(公告)日：2008-09-09

申请号：US11017860

申请日：2004-12-22

申请人： Satoshi Sano ,  Takashi Katsuki ,  Yuji Takahashi ,  Fumihiko Nakazawa

发明人： Satoshi Sano ,  Takashi Katsuki ,  Yuji Takahashi ,  Fumihiko Nakazawa

IPC分类号： G09G5/00

CPC分类号： G06F3/0436

摘要： Each of transducers of a touch panel device includes a piezoelectric thin film, a plate electrode disposed at one surface of the piezoelectric thin film and a comb-like electrode disposed at the other surface of the piezoelectric thin film. The comb-like electrode has a plurality of comb-like electrode fingers and a linear bus electrode to which one end of each of the plural comb-like electrode fingers is connected. A plurality of wiring electrodes is provided at the outer side of any of the transducers in parallel with the bus electrode of the transducer and is connected to the bus electrode and the plate electrode of any of the transducers. Each of the wiring electrodes includes an electrode base portion formed by printing silver paste containing fine particles on the substrate and an electrode main body formed by printing silver paste containing large particles and fine particles in a mixed manner on the electrode base portion.

公开(公告)号：US20070035016A1

公开(公告)日：2007-02-15

申请号：US11500427

申请日：2006-08-08

申请人： Takayuki Yamaji ,  Hiroshi Ishikawa ,  Takashi Katsuki ,  Yuji Takahashi ,  Fumihiko Nakazawa ,  Satoshi Sano

发明人： Takayuki Yamaji ,  Hiroshi Ishikawa ,  Takashi Katsuki ,  Yuji Takahashi ,  Fumihiko Nakazawa ,  Satoshi Sano

IPC分类号： H01L23/34

CPC分类号： G01C19/5719 ,  B81B2201/0242 ,  B81B2201/042 ,  B81B2207/097 ,  B81C1/00301 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/30107 ,  H01L2924/00

摘要： A semiconductor device includes a chip having a base semiconductor layer, an insulation layer provided on the base semiconductor layer, and an upper semiconductor layer provided on the insulation layer; a mounting substrate on which the chip is mounted at the base semiconductor layer; and a connecting portion that electrically couples first terminals provided on the mounting substrate and a surface or second terminals provided thereon of the base semiconductor layer.

摘要翻译： 半导体器件包括具有基底半导体层的芯片，设置在基底半导体层上的绝缘层和设置在绝缘层上的上半导体层; 安装基板，芯片安装在基板半导体层上; 以及连接部，其电连接设置在安装基板上的第一端子和设置在该基底半导体层上的表面或第二端子。

公开(公告)号：US06768484B2

公开(公告)日：2004-07-27

申请号：US10055375

申请日：2002-01-25

申请人： Satoshi Sano ,  Takashi Katsuki ,  Yuji Takahashi ,  Fumihiko Nakazawa

发明人： Satoshi Sano ,  Takashi Katsuki ,  Yuji Takahashi ,  Fumihiko Nakazawa

IPC分类号： G09G500

CPC分类号： G06F3/0436

摘要： In a touch panel device for detecting a position touched by an object by sensing an attenuation or break of surface acoustic waves, in which IDTs for exciting or receiving surface acoustic waves comprising comb-like electrode fingers aligned along confronting bus electrodes are placed on a peripheral area of a substrate, drawing electrodes connected to the bus electrode positioned closer to the center of the substrate and led out to the peripheral area side of the substrate are provided. Each of the IDT regions segmented by the drawing electrodes is constituted by repetition, and the drawing electrodes are disposed so that impedance in each IDT region becomes equal.

摘要翻译： 在用于通过感测表面声波的衰减或断裂来检测由物体触摸的位置的触摸面板装置中，其中用于激励或接收包括梳梳状电极指的表面声波的IDT在对面的总线电极上排列在周边 提供连接到位于更靠近基板的中心并被引出到基板的周边区域的总线电极的引出电极的拉伸电极。 由绘图电极分割的每个IDT区域由重复构成，并且布置电极被布置成使得每个IDT区域中的阻抗变得相等。