公开(公告)号：US11073677B2

公开(公告)日：2021-07-27

申请号：US15769916

申请日：2016-10-21

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Kai Engelhardt ,  Markus Rossi

IPC: G02B7/02 ,  G02B27/00 ,  G02B13/18 ,  G02B27/42 ,  G02B7/00

Abstract: This disclosure describes optical assemblies that generate output with substantial stability over a wide variation in temperature. The optical assemblies can be integrated, for example, as part of array generators arranged to project an array or other pattern of dots onto an object or projection plane.

公开(公告)号：US20200348456A1

公开(公告)日：2020-11-05

申请号：US16935641

申请日：2020-07-22

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Dmitry Bakin ,  Markus Rossi ,  Kai Engelhardt

IPC: G02B3/04 ,  G02B13/00 ,  G02B13/18

Abstract: This disclosure describes illumination assemblies operable to generate a patterned illumination that maintain high contrast over a wide temperature range. An implementation of the illumination assembly can include an array of monochromatic light sources positioned on an illumination plane, first and second optical elements, and an exit aperture. A chief ray of each light source within the array of monochromatic light sources can substantially converge at an exit aperture. In such implementations light generated by the array of monochromatic light sources can be used efficiently.

公开(公告)号：US10771714B2

公开(公告)日：2020-09-08

申请号：US15121459

申请日：2015-02-23

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Jukka Alasirniö ,  Tobias Senn ,  Ohad Meitav ,  Moshe Doron ,  Alireza Yasan ,  Mario Cesana ,  Florin Cutu ,  Hartmut Rudmann ,  Markus Rossi ,  Peter Roentgen ,  Daniel Perez Calero ,  Bassam Hallal ,  Jens Geiger

IPC: H04N5/247 ,  G03B37/04 ,  G03B35/08 ,  G03B15/05 ,  G03B17/12 ,  G02B13/00 ,  H04N5/225 ,  H04N5/33

Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

公开(公告)号：US10734366B2

公开(公告)日：2020-08-04

申请号：US14413891

申请日：2013-07-09

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Markus Rossi

IPC: H01L25/075 ,  H01L25/00 ,  F21V14/04 ,  F21V14/06 ,  F21V5/04 ,  F21V7/00 ,  G02B7/02 ,  G02B19/00 ,  H01L33/58 ,  H01L31/0232 ,  H01L27/146 ,  H01L25/16 ,  F21Y115/30 ,  F21Y115/10

Abstract: The opto-electronic module comprises a first substrate member; a second substrate member; a first spacer member comprised in the first substrate member or comprised in the second substrate member or distinct from and located between these, which comprises at least one opening; a light emission element arranged on the first substrate member; a first passive optical component; at least one of the first and second substrate members comprising one or more transparent portions through which light can pass, the first passive optical component being comprised in or distinct from the one or more transparent portions, and wherein the first passive optical component has adjustable optical properties. Such modules are well mass-producible in high precision and can be used in photo cameras, e.g., as flashes.

公开(公告)号：US10345611B2

公开(公告)日：2019-07-09

申请号：US14517225

申请日：2014-10-17

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Daniel Dias ,  Ville Kettunen ,  Markus Rossi

IPC: F21V5/00 ,  G02B5/18 ,  F21V33/00 ,  G02B27/30 ,  G03B15/05

Abstract: An illumination system including at least one light source such as an electroluminescent element, e.g. a light emitting diode (LED), and at least one optical element whose surface is structured by diffraction and/or refraction type optical microstructures. In order to shape the beam, the optical element includes at least two sections whose optical microstructures and therefore optical properties are different from one another. The pattern of the microstructures in each of the at least two sections is, at least over a predetermined angular range, rotationally symmetric with respect to the optical axis or another symmetry axis.

公开(公告)号：US10302279B2

公开(公告)日：2019-05-28

申请号：US15618253

申请日：2017-06-09

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Markus Rossi ,  Peter Riel ,  Peter Roentgen

IPC: F21V9/08 ,  F21V5/00 ,  F21V7/22 ,  F21V9/30 ,  F21Y115/30

Abstract: The present disclosure describes light conversion modules each having a single laser diode or multiple laser diodes. The light conversion modules can be particularly small in size (height and lateral footprint) and can overcome various challenges associated with the high optical power and heat emitted by laser diodes. In some implementations, the light conversion modules include glass phosphors, which, in some instances, can resist degradation caused by the optical power and/or heat generated by the laser diodes. In some instances, the light conversion modules include optical filters which, in some instances, can reduce or eliminate human eye-safety risk.

公开(公告)号：US12130454B2

公开(公告)日：2024-10-29

申请号：US17318345

申请日：2021-05-12

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Nicola Spring ,  Hartmut Rudmann ,  Markus Rossi

IPC: B29D11/00 ,  F21V7/00 ,  G02B3/00 ,  G02B5/04 ,  G02B6/12 ,  G02B6/122 ,  G02B6/13 ,  G02B6/34 ,  G02B13/00 ,  G02B17/08 ,  G02B6/43

CPC classification number: G02B5/045 ,  B29D11/00692 ,  B29D11/00721 ,  F21V7/0091 ,  G02B3/0062 ,  G02B5/04 ,  G02B6/12004 ,  G02B6/122 ,  G02B6/13 ,  G02B6/34 ,  G02B13/0065 ,  G02B17/0856 ,  G02B2006/12114 ,  G02B2006/12166 ,  G02B6/43

Abstract: The method for manufacturing optical light guide elements comprises providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; and fixing the plurality of initial bars with respect to each other in the position to obtain a bar arrangement.

公开(公告)号：US11692813B2

公开(公告)日：2023-07-04

申请号：US16957289

申请日：2018-12-26

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Jens Geiger ,  Lijian Mai ,  Markus Rossi

IPC: G01B11/02 ,  A61B5/024 ,  A61B5/026 ,  G01S17/48 ,  A61B5/00

CPC classification number: G01B11/026 ,  A61B5/0261 ,  A61B5/02427 ,  A61B5/02438 ,  A61B5/6844 ,  G01S17/48 ,  A61B2562/0257

Abstract: Optoelectronic modules operable to measure proximity independent of object surface reflectivity and, in some implementations, operable to measure characteristics (such as surface reflectivity or absorptivity) of stationary or moving objects are disclosed. The optoelectronic modules are operable to determine, for example, pulse rate, peripheral blood circulation, and/or blood oxygen levels of moving objects, such as the appendage of a user, in some instances. The optoelectronic modules can be used to measure peripheral blood circulation, for example, when a user of the optoelectronic module is engaged in physical activity, such as walking, running or cycling.

公开(公告)号：US20220028908A1

公开(公告)日：2022-01-27

申请号：US17498105

申请日：2021-10-11

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Simon Gubser ,  Mario Cesana ,  Markus Rossi ,  Hartmut Rudmann

IPC: H01L27/146 ,  H01L31/0203 ,  H01L33/54 ,  H01L51/52 ,  H01L51/56

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

公开(公告)号：US11005001B2

公开(公告)日：2021-05-11

申请号：US15939636

申请日：2018-03-29

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Hartmut Rudmann ,  Markus Rossi

IPC: H01L31/16 ,  H01L27/146 ,  G02B13/00 ,  H01L25/16 ,  H01L31/0232 ,  H01L31/167 ,  G02B3/00 ,  G01J1/02 ,  G01J5/04 ,  G01J1/04 ,  G01J1/06 ,  G01J1/42 ,  G01J5/00 ,  G01J5/02 ,  G01J5/20 ,  G01J5/08 ,  B29D11/00

Abstract: Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.