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公开(公告)号：US20050059300A1
公开(公告)日：2005-03-17
申请号：US10901934
申请日：2004-07-28
申请人： Maksim Kuzmenka
发明人： Maksim Kuzmenka
IPC分类号： H01R12/16 , H01R12/18 , H01R13/193 , H01R43/02 , H01R24/00
CPC分类号： H01R43/0242 , H01R12/856 , H01R13/193
摘要： A connector has a connector body, at least one contact and at least one bimetal stripe. One end of the contact is fixed to the connector body and another end of each contact extends from a surface of the connector body forming a springy contact. One end of the bimetal stripe is fixed in the connector body and another end of the bimetal stripe extends from the surface of the connector body. The bimetal stripe is arranged for moving the contact in a first or second position depending on the temperature of the bimetal stripe.
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公开(公告)号：US20040067664A1
公开(公告)日：2004-04-08
申请号：US10342417
申请日：2003-01-15
IPC分类号： H01R012/00
CPC分类号： H01R43/0242 , H01R4/024 , H01R43/0256
摘要： A circuit assembly comprising: a circuit associated with a support substrate; and a connection terminal disposed on said support substrate for electrically connecting said circuit assembly to an other device; characterized in that said circuit assembly comprises a terminal adapter, said terminal adapter comprising a conductive member, said conductive member comprising a first connection element, a second connection element, and an intermediate connection element, said intermediate connection element electrically connecting said first connection element to said second connection element, said terminal adapter being disposed such that said second connection element is fixed and electrically connected to said connection terminal, and said first connection element is disposed for electrical connection to said other device. The circuit assembly may be used to facilitate incorporation of electronic components into a larger assembly.
摘要翻译： 一种电路组件，包括：与支撑衬底相关联的电路; 以及连接端子，其设置在所述支撑基板上，用于将所述电路组件电连接到另一装置; 其特征在于，所述电路组件包括端子适配器，所述端子适配器包括导电构件，所述导电构件包括第一连接元件，第二连接元件和中间连接元件，所述中间连接元件将所述第一连接元件电连接到 所述第二连接元件，所述端子适配器被布置成使得所述第二连接元件被固定并电连接到所述连接端子，并且所述第一连接元件设置成与所述另一个设备电连接。 电路组件可以用于促进将电子部件并入更大的组件中。
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公开(公告)号：US5579575A
公开(公告)日：1996-12-03
申请号：US307727
申请日：1994-09-23
申请人： Alain Lamome , Jacques Delalle , Sylvain Briens
发明人： Alain Lamome , Jacques Delalle , Sylvain Briens
CPC分类号： H01R43/0242 , H01R4/723 , H01R9/0503 , H01R9/0512 , Y10S174/08 , Y10T29/49179 , Y10T29/49201
摘要： A method and apparatus of forming a solder connection between a plurality of elongate bodies, comprises:(i) forming an initial connection between the elongate bodies by inserting them into an induction heatable connecting element of a connector, the connector comprising a dimensionally heat-recoverable sleeve and, retained within the sleeve, the connecting element and a solder insert that is in thermal contact with the connecting element; and(ii) heating the connector (a) by subjecting the connecting element to an alternating magnetic field so that it is heated by induction thereby melting the solder insert, and (b) subjecting the sleeve to hot air and/or infrared radiation, thereby causing the sleeve to recover.The apparatus for applying heat to an elongate connector, comprises a first heat source which comprises an induction coil, and a second heat source arranged to generate hot air or infrared radiation.
摘要翻译： PCT No.PCT / GB93 / 00658 Sec。 371日期1994年9月23日 102（e）1994年9月23日PCT 1993年3月30日PCT公布。 出版物WO93 / 20596 日期：1993年10月14日在多个细长体之间形成焊料连接的方法和装置包括：（i）通过将细长体插入到连接器的感应加热连接元件中，在细长体之间形成初始连接，该连接器包括 尺寸上可热恢复的套筒，并且保持在套筒内的连接元件和与连接元件热接触的焊料插入件; 和（ii）通过对连接元件进行交变磁场加热连接器（a），使得其通过感应加热，从而熔化焊料插入物，和（b）使套管经受热空气和/或红外辐射，由此 导致套筒恢复。 用于向细长连接器施加热量的装置包括包括感应线圈的第一热源和布置成产生热空气或红外辐射的第二热源。
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公开(公告)号：US5281167A
公开(公告)日：1994-01-25
申请号：US68876
申请日：1993-05-28
申请人： Lang T. Le , Michael E. Pastal
发明人： Lang T. Le , Michael E. Pastal
CPC分类号： H01R24/40 , H01R43/0242 , H01R2103/00 , H01R4/02
摘要： A retention sleeve (140) placed over the rearward end (116) of the outer (102) of a coaxial plug connector (100) providing a rearward stop for retaining the coupling nut (126) on the housing. The retention sleeve includes an inwardly directed flange (146) along the cable-receiving passageway therethrough for retention of solder preforms (128) within cable-receiving bore (114) of the outer conductive housing (102). The retention sleeve can be of low resistance copper having a thin outer layer (152) of magnetic high resistance metal, defining a self-regulating temperature thermal energy source when subjected to RF current, to reflow solder. A recess (154) in rearward portion (148) of retention sleeve (140) provides a site for an additional preform (156) of solder which when reflowed defines a robust solder joint (176,178) of the outer conductor (162) of the cable (160) to not only the outer conductive housing (102) but also axially forwardly and rearwardly of the annular flange (146) of the retention sleeve ( 140).
摘要翻译： 保持套（140）放置在同轴插头连接器（100）的外部（102）的后端（116）上，提供用于将联接螺母（126）保持在壳体上的向后止动件。 保持套筒包括沿着电缆接收通道的向内指向的凸缘（146），用于将焊料预制件（128）保持在外导电壳体（102）的电缆接收孔（114）内。 保持套筒可以是具有薄的磁性高电阻金属外层（152）的低电阻铜，当受到RF电流时限定自调节温度热能源，以回流焊料。 在保持套筒（140）的后部（148）中的凹部（154）提供用于附加的预成型件（156）的位置，当回流限定了电缆的外部导体（162）的坚固的焊接接头（176,178）时， （160）不仅是外导电壳体（102），而且轴向地保持在保持套筒（140）的环形凸缘（146）的前方和后方。
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公开(公告)号：US5232377A
公开(公告)日：1993-08-03
申请号：US841664
申请日：1992-03-03
IPC分类号： H01R4/02 , H01R13/622 , H01R24/40 , H01R43/02
CPC分类号： H01R24/40 , H01R13/622 , H01R4/024 , H01R2103/00 , H01R43/0242
摘要： A retention sleeve (150) is placed over the rearward end (134) of the outer conductive shell (120) of a coaxial plug connector (100), providing a rearward stop for retaining the coupling nut (12) on the shell. The retention sleeve can include an inwardly directed flange (158) at its rearward end for retention of an annular solder preform (132) within the cable-receiving bore (136) of the outer conductive shell. The retention sleeve (150) can be of low resistance copper having a thin outer layer (170) of magnetic high resistance metal, defining a self-regulating temperature source when subjected to RF current, to reflow the solder of the preform (132) and thus solder the outer conductive shell (120) to the semirigid outer conductor (82) of the coaxial cable end inserted into the cable-receiving bore (136) providing for automated soldering.
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公开(公告)号：US5059756A
公开(公告)日：1991-10-22
申请号：US277116
申请日：1988-11-29
IPC分类号： B23K1/002 , B23K3/04 , B23K3/047 , H01R43/02 , H05B3/12 , H05B3/40 , H05K1/02 , H05K1/11 , H05K3/24 , H05K3/34 , H05K3/36 , H05K3/40
CPC分类号： H05K1/0212 , B23K3/0475 , H01R43/0242 , H05B3/12 , H05K1/0242 , H05K1/117 , H05K2201/083 , H05K2201/1028 , H05K2201/10924 , H05K2203/1115 , H05K3/244 , H05K3/3494 , H05K3/363 , H05K3/4015
摘要： Spaced contact pads (23,43,83,84) on a printed circuit board (19,45,85) are soldered to respective spaced contacts (21,41,51,81,82) in a cable (230,50) or connector assembly (40,80) by means of respective spaced connecting members (15,48,57,70,92,94,96,98,100,102,104,106) interposed between contacts to be soldered. The connecting members are typically electrically and thermally conductive finger-like projections formed as part of a heater body (10,60,55,47,91) and are readily severably from the heater body after soldering to thereby remain part of the final solder connection. A presecribed amount of fusible material (e.g., solder) is pre-deposited on the connecting members and/or contacts and is melted when the heater is actuated. The heater body may be a self-regulating heater in the form of a copper substrate (11,61,65) having a thin surface layer (13, 63,67) of magnetically permeable, high resistance alloy. An alternating current of constant amplitude and high frequency is passed through the heater body and is concentrated in the surface layer at temperatures below the surface layer Curie temperature. At higher temperatures the current is distributed through the lower resistance substrate to limit further heating. During the time interval required for the surface layer to reach its Curie temperature, the resistive power dissipation creates sufficient thermal energy to melt the pre-deposited solder. The connecting members are positioned and configured as necessary to reach their respective connection sites.
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公开(公告)号：US4789767A
公开(公告)日：1988-12-06
申请号：US59767
申请日：1987-06-08
申请人： Frank A. Doljack
发明人： Frank A. Doljack
CPC分类号： H01R43/0242 , H05K3/3421 , H05K3/3494
摘要： Contacts of a multipin connector may be soldered to leads of a board of the like by forming coatings of magnetic materials on each contact and locating the contacts between poles defined by an air gap of the magnetic core, each pole having a separate pair of opposed pole pieces disposed adjacent a pair of contacts whereby upon application of a constant a.c. current to a coil wound about the core the magnetic material is heated to a temperature approaching its Curie temperature whereby temperature regulation occurs.
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公开(公告)号：US20190221981A1
公开(公告)日：2019-07-18
申请号：US15999483
申请日：2017-02-10
CPC分类号： H01R43/005 , H01R4/022 , H01R4/72 , H01R4/723 , H01R43/0242
摘要： The invention relates to a method for sealing a contact point region comprising at least one contact point at an electrical line connection, wherein the line connection comprises at least one electrical line and at least one conductive element electrically connected thereto. The method starts by arranging a shrink tube on the outer circumference of the contact point region, in a first region extending over the contact point region on both sides in the longitudinal direction. This is followed by heating the shrink tube to shrinking temperature. During the heating of the shrink tube, an inductive heating of the electrical conductor is additionally performed, at least in the contact point region, and so hotmelt adhesive arranged inside the shrink tube and/or on the outer circumference of the contact point region is heated to its melting temperature. The invention also relates to a device for sealing a contact point region and to a sealing at such a region.
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公开(公告)号：US20050274704A1
公开(公告)日：2005-12-15
申请号：US10963570
申请日：2004-10-14
CPC分类号： H01R43/0214 , B23K1/0056 , H01R43/0221 , H01R43/0242 , H05K3/3421 , H05K3/3494 , H05K2203/0195 , H05K2203/0278 , H05K2203/107 , H05K2203/111 , Y02P70/613
摘要： A method of joining terminals by soldering is provided which allows control of increasing gas supply even in soldering performed in a gas atmosphere within a gas chamber. Utilizing a springback phenomenon occurring at a flat portion of a terminal, a solder joint of the terminal is immersed in molten solder. Then, laser soldering is performed using a gas chamber made of a material which transmits a laser beam at least in part.
摘要翻译： 提供了通过焊接连接端子的方法，其允许即使在气体室内的气体气氛中进行的焊接中也可以控制增加的气体供应。 利用在端子的平坦部分发生的回弹现象，将端子的焊点浸入熔融焊料中。 然后，使用由至少部分透射激光束的材料制成的气室进行激光焊接。
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公开(公告)号：US06974339B2
公开(公告)日：2005-12-13
申请号：US10901934
申请日：2004-07-28
申请人： Maksim Kuzmenka
发明人： Maksim Kuzmenka
IPC分类号： H01R12/16 , H01R12/18 , H01R13/193 , H01R43/02 , H01R13/20
CPC分类号： H01R43/0242 , H01R12/856 , H01R13/193
摘要： A connector has a connector body, at least one contact and at least one bimetal stripe. One end of the contact is fixed to the connector body and another end of each contact extends from a surface of the connector body forming a springy contact. One end of the bimetal stripe is fixed in the connector body and another end of the bimetal stripe extends from the surface of the connector body. The bimetal stripe is arranged for moving the contact in a first or second position depending on the temperature of the bimetal stripe.
摘要翻译： 连接器具有连接器主体，至少一个触点和至少一个双金属条。 接触件的一端固定到连接器主体，并且每个接触件的另一端从形成弹性接触件的连接器主体的表面延伸。 双金属条的一端固定在连接器主体中，双金属条的另一端从连接器主体的表面延伸。 双金属条被布置用于根据双金属条的温度在第一或第二位置移动触点。
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