Abstract:
A semiconductor device includes: an element array portion in which unit elements are disposed in a matrix; and a signal processing portion including a signal processing circuit executing predetermined signal processing based on unit signals outputted from the circuit elements, respectively, every column, in which a function of the signal processing circuit is controlled in such a way that power consumption of the signal processing circuit concerned corresponding to the unit elements each not required becomes lower in a phase of an element selection mode in which only information on a part of the unit pixels for one row in the element array portion is required than in a phase of a normal operation mode.
Abstract:
An imaging device comprises a sensor of surface area of at least 10 cm2 and comprising: an image zone produced on a single substrate and comprising a group of pixels disposed in rows and columns, the number of pixels per column not being uniform for all the columns of pixels, each pixel collecting electric charges generated by a photosensitive element, row conductors linking the pixels row by row, column conductors linking the pixels column by column, row addressing blocks linked to the row conductors to address each row of pixels individually, and column reading blocks linked to the column conductors to read the electric charges collected by the pixels of the row selected by the row addressing blocks, the column reading blocks being situated at the periphery of the image zone; the row addressing blocks and the column reading blocks being produced on the same substrate as the image zone.
Abstract:
A CMOS sensor has unit pixels each structured by a light receiving element and three transistors, to prevent against the phenomenon of saturation shading and the reduction of dynamic range. The transition time (fall time), in switching off the voltage on a drain line shared in all pixels, is given longer than the transition time in turning of any of the reset line and the transfer line. For this reason, the transistor constituting a DRN drive buffer is made proper in its W/L ratio. Meanwhile, a control resistance or current source is inserted on a line to the GND, to make proper the operation current during driving. This reduces saturation shading amount. By making a reset transistor in a depression type, the leak current to a floating diffusion is suppressed to broaden the dynamic range.
Abstract:
A solid-state imaging device includes: a pixel section wherein pixels including photoelectric conversion devices are arranged in a matrix; and a pixel driving section including a row selection circuit which controls the pixels to perform an electronic shutter operation and readout of the pixel section. The row selection circuit has a function of selecting a readout row from which a signal is read out and a shutter row on which reset is performed by discharging charge accumulated in the photoelectric conversion devices, in accordance with address and control signals. The row selection circuit can set, in accordance with the address and control signals, in the pixels of the selected row, at least a readout state, a discharge state where a smaller amount of the charge accumulated in the photoelectric conversion devices than the reset is discharged, an electronic shutter state, and a charge state where the charge is accumulated in the photoelectric conversion devices.
Abstract:
An image sensor comprises: a first semiconductor including a plurality of pixels two-dimensionally arranged, and a plurality of divided output lines, in a first direction, configured to read out pixel signals from the plurality of pixels in the first direction; and a second semiconductor including a plurality of signal processing units, corresponding to the plurality of output lines, respectively, configured to process the readout pixel signals, and a readout unit configured to read out the signals output from the signal processing units in a second direction, wherein the first semiconductor and the second semiconductor are stacked, and the plurality of output lines and the plurality of signal processing units are connected in correspondence with each other.
Abstract:
The present technology relates to an image sensor and a control method for an image sensor which are capable of measuring illuminance of each color in an image sensor. Each of a plurality of pixel units includes a pixel and a reset transistor, and the pixel includes a photoelectric converting unit that performs photoelectric conversion on light of a certain color incident through a color filter and a transfer transistor that transfers charges obtained by the photoelectric conversion of the photoelectric converting unit and is controllable for each color. According to control of the transfer transistor, the charges are read from the photoelectric converting unit through the transfer transistor and the reset transistor, and a voltage corresponding to the charges is supplied to an AD converting unit connected to the reset transistor. The present technology can be applied to, for example, an image sensor that photographs an image.
Abstract:
An object is to provide a solid-state imaging apparatus capable of causing driving signals of pixels to reach the entire screen and of driving all the pixels. The solid-state imaging apparatus includes a pixel region including a plurality of pixels therein, each pixel having a photoelectric conversion element and at least one transistor, and a plurality of driving lines, each driving each of the plurality of transistors arranged in the pixel region, wherein the driving line supplies a driving signal through a buffer arranged in the pixel region to the transistor, and the number of the buffers is smaller than the number of the pixels.
Abstract:
A pixel cell includes a photodiode disposed within a first semiconductor chip for accumulating an image charge in response to light incident upon the photodiode. A transfer transistor is disposed within the first semiconductor chip and coupled to the photodiode to transfer the image charge from the photodiode. A bias voltage generation circuit disposed within a second semiconductor chip for generating a bias voltage. The bias voltage generation circuit is coupled to the first semiconductor chip to bias the photodiode with the bias voltage. The bias voltage is negative with respect to a ground voltage of the second semiconductor chip. A floating diffusion is disposed within the second semiconductor chip. The transfer transistor is coupled to transfer the image charge from the photodiode on the first semiconductor chip to the floating diffusion on the second semiconductor chip.
Abstract:
An image sensor architecture with multi-bit sampling is implemented within an image sensor system. A pixel signal produced in response to light incident upon a photosensitive element is converted to a multiple-bit digital value representative of the pixel signal. If the pixel signal exceeds a sampling threshold, the photosensitive element is reset. During an image capture period, digital values associated with pixel signals that exceed a sampling threshold are accumulated into image data.
Abstract:
Provided is an imaging apparatus, including: a driving circuit switching between a current supplying state and a current non-supplying state of the current sources included in column circuits in the respective columns; at least one second readout line to which image signals output from the column circuits in the respective columns are input; switches each having one terminal and another terminal; and a switch control circuit configured to output switch control signals for respectively controlling the switches to be turned on or off, each of the one terminals being connected to corresponding second readout line and each of the another terminals being connected commonly to an output line, in which, in a period in which the switch control signals for respectively controlling the switches to be turned on are output, the number of the current sources controlled to be in the current supplying state by the driving circuit is constant.