Abstract:
Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.
Abstract:
The present invention springs from the discovery that mild acids could be utilized to shear undesired metals away from desired precious metals that have been plated onto circuit board runners or contacts. This shearing action occurs at a high rate when metal scrap segments are immersed in mild acid and excited by application of an electromagnetic field at specific frequencies and power levels. These frequencies and power levels are based on the end metal desired and the metals contained in the scrap and the acid utilized. When mild acid saturated with copper sulfate and loaded with scrap metals is subjected to an electromagnetic field at the appropriate frequency and power levels, copper and nickel molecules are sheared rapidly and absorbed into solution, leaving only the desired metal, such as gold, in a 99.5% pure flake which can be skimmed off the surface of the solution or filtered from the solution. The captured metal flake is then rinsed in water and denatured alcohol, compressed, melted and poured into bars or nuggets for further use or sale.
Abstract:
The present invention springs from the discovery that mild acids could be utilized to shear undesired metals away from desired precious metals that have been plated onto circuit board runners or contacts. This shearing action occurs at a high rate when metal scrap segments are immersed in mild acid and excited by application of an electromagnetic field at specific frequencies and power levels. These frequencies and power levels are based on the end metal desired and the metals contained in the scrap and the acid utilized. When mild acid saturated with copper sulfate and loaded with scrap metals is subjected to an electromagnetic field at the appropriate frequency and power levels, copper and nickel molecules are sheared rapidly and absorbed into solution, leaving only the desired metal, such as gold, in a 99.5% pure flake which can be skimmed off the surface of the solution or filtered from the solution. The captured metal flake is then rinsed in water and denatured alcohol, compressed, melted and poured into bars or nuggets for further use or sale.
Abstract:
A waste disposal apparatus comprising a crushing means for crushing waste including a circuit board into fragments, and a circuit board sorting means for sorting fragments of the circuit board from the fragments of the waste crushed by the crushing means through eddy current sorting or gravity concentration so as overcome a difficulty in separation between nonferrous metals. With this arrangement, lead contained in the circuit boards can be sorted and separated without being diffused, and further, the volume of fragments of the circuit boards adapted to be mingled into fragments of other waste such as nonferrous metals and plastics can be decreased. Thus, even though waste including circuit board is directly crushed by the crushing means, thereby it is possible to enhance the quality of recovered valuables.
Abstract:
A method for treating waste printed circuit boards, the method has the steps of: heating up for dry-distilling the waste printed circuit boards having copper foil retaining solder in at least a part of the surface, at a temperature of 250° C. or higher; pulverizing the dry-distilled material of the waste printed circuit boards obtained in the heating step; and separating the pulverized material of the waste printed circuit boards obtained in the pulverizing step, into board resin component and metal component.
Abstract:
A method for treating waste printed circuit boards, the method has the steps of: heating up for dry-distilling the waste printed circuit boards having copper foil retaining solder in at least a part of the surface, at a temperature of 250null C. or higher; pulverizing the dry-distilled material of the waste printed circuit boards obtained in the heating step; and separating the pulverized material of the waste printed circuit boards obtained in the pulverizing step, into board resin component and metal component.
Abstract:
Preferred processes to separate metallic and non-metallic constituent components of at least one electronic product are generally comprised of the following steps: (a) repeatedly crushing the at least one electronic product to create a plurality of crushed electronic components; (b) repeatedly screening the plurality of crushed electronic components to ensure that the plurality of crushed electronic components substantially conform to a specific size; and (c) separating the plurality of crushed electronic components after steps (a) and (b) into non-metallic constituent components and metallic constituent components by weight. In addition, before step (a), the at least one electronic product must be provided or otherwise transported to crushing machines to perform step (a). Likewise, the crushed electronic components must be transported from one crushing machine to another crushing machine and to the separating apparatus to perform step (c). At least three crushing machines are generally used, so that the at least one electronic product are generally crushed at least three times (and transported between the crushing machines). The crushed electronic products are also periodically screened, such as after each crushing step to limit the size of the crushed materials in the stream of crushed materials being evaluated. Lightweight material is also removed from the stream of crushed materials by at least one air separator. Portions of the light weight material that comprise metallic material are returned to the stream of crushed material. Portions of lightweight material substantially comprised of non-metallic materials (i.e., dust) is transported to a collection apparatus. The products can be shredded before step (a).
Abstract:
A low-cost, portable, destructive sanitization method for solid state drives (SSDs) is provided. Preferably, an SSD is destroyed by disintegration within a given time period (approximately 30 minutes or less) using a blending device operating at a given peak power, e.g., greater than 450 W. A pulverizing agent may be admixed with pieces of an SSD printed circuit board prior to initiating the disintegration process to increase the number of particle collisions in a processing/blending chamber. The pulverizing agent may also contain moisture that mitigates suspension of processed SDD particles in the surrounding air (when the mixing chamber is opened). The overall process may be video-recorded for compliance purposes.
Abstract:
Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.
Abstract:
The present invention relates to a process of manufacturing a formaldehyde-free zero-carbon-emission environment-friendly plate made from circuit board powder, raw materials of the plate comprise circuit board powder, an isocyanate, a mold release agent, water, wood fiber powder and carbon fiber. These raw materials are mixed together and pressed to form the plate of the present invention. The weight percentage of circuit board powder in the plate can be as high as 95%, and the plate of the present invention has no bubbles therein and has excellent water-proofing performance.