公开(公告)号：US3691007A

公开(公告)日：1972-09-12

申请号：US3691007D

申请日：1969-08-14

Applicant: MICA CORP THE

Inventor： PAVLOU JAMES

IPC: H05K1/16 ,  H05K3/24 ,  H05K3/38 ,  B01K3/00 ,  C23B5/48

CPC classification number: H05K3/384 ,  H05K1/167 ,  H05K3/241 ,  H05K2201/0116 ,  H05K2201/0166 ,  H05K2201/0355 ,  H05K2201/0373 ,  H05K2203/0361 ,  H05K2203/0723 ,  H05K2203/0769 ,  Y10T428/12396 ,  Y10T428/12444 ,  Y10T428/12451 ,  Y10T428/12535 ,  Y10T428/12569 ,  Y10T428/12778 ,  Y10T428/12903 ,  Y10T428/3154 ,  Y10T428/31703

Abstract: THE PRESENT PATENT DESCRIBES A PRINTED CIRCUIT BOARD MATERIAL COMPRISING A RIGID PLASTIC SUBSTRATE, A RESISTIVE LAYER CARRIED ON SAID SUBSTRATE AND A CONDUCTIVE FILM CARRIED ON SAID RESISTIVE LAYER; THE IMPROVEMENT WHEREIN THE RESISTIVE LAYER IS APPLIED TO A PREFORMED CONDUCTIVE LAYER THROUGH A POROUS, POLYMERIC MEMBERANE.

公开(公告)号：US3687824A

公开(公告)日：1972-08-29

申请号：US3687824D

申请日：1969-06-19

Applicant: UDYLITE CORP

Inventor： BROWN HENRY ,  TOMASZEWSKI THADDEUS W

IPC: C25D13/02 ,  C25D15/00 ,  C25D15/02 ,  C23B ,  C23B5/48 ,  C23B13/00

CPC classification number: C25D15/00 ,  C25D13/02 ,  C25D15/02

Abstract: FILMS OF DISCRETE FINE PARTICLES OF INORGANIC AND ORGANIC MATERIALS CAN BE CATHODICALLY ELECTRODEPOSITED AT LOW VOLTAGES FROM AQUEOUS SOLUTIONS OF SALTS OF NON-PLATING MONOVALENT CATIONS SUCH AS SOLUTIONS OF SODIUM SULFATE. FOR EXAMPLE, PARTICLES SUCH AS BARIUM SULFATE, BORON AND POLYVINYL CHLORIDE CAN BE DEPOSITED ON A CATHODE FROM SOLUTIONS OF SODIUM SULFATE IN WHICH THE PARTICLES ARE DISPERSED. THESE FILMS OF PARTICLES CAN BE USED AS SUCH OR CAN THEN BE RINSED AND TRANSFERRED TO PLATING BATHS AND THE FILMS OF PARTICLES CAN THUS BE IMBEDDED IN A METAL MATRIX. SUCH 2-PHASE COMPOSITE PLATES CAN BE USED FOR ENGINEERING PURPOSES SUCH AS ANTI-FRICTION APPLICATIONS, AND THE LIKE, OR WITH MULTIPLE PLATES TO OBTAIN EXCELLENT PROTECTION AGAINST ATMOSPHERIC CORROSION.

公开(公告)号：US3677907A

公开(公告)日：1972-07-18

申请号：US3677907D

申请日：1969-06-19

Applicant: UDYLITE CORP

Inventor： BROWN HENRY ,  TOMASZEWSKI THADDEUS W

IPC: C25D15/02 ,  C23B5/48 ,  C23B5/20

CPC classification number: C25D15/02

Abstract: FINE PARTICLES OF FLUOROCARBON RESINS SUCH AS TEFLON PARTICLES CAN BE READILY CODEPOSITED WITH METALS WHEN THEY ARE DISPERSED IN AQUEOUS PLATING BATHS, WHEN THERE IS ALSO PRECENT IN THE BATHS A FLUOROCARBON SURFACTANT SUCH AS PERFLUORO N-OCTANOIC ACID, PERFLUORO N-OCTYL SULFONIC ACID, PERFLUORO P-ETHYL CYCLOHEXYL SULFONIC ACID, OR THEIR SALTS. SUCH 2-PHASE COMPOSITE PLATES HAVE GOOD ANTI-SEIZING AND ANTI-FRICTION PROPERTIES.

公开(公告)号：US3658663A

公开(公告)日：1972-04-25

申请号：US3658663D

申请日：1971-01-25

Applicant: JAPAN ELECTRO PLATING CO

Inventor： FUKANUMA HIROTAKA ,  FUJITA KENJI ,  KASHIURA KENJI

IPC: H05K3/24 ,  C25D5/02 ,  C25D17/10 ,  C23B5/48 ,  C23B5/70

CPC classification number: C25D5/02

Abstract: By the use of an apparatus comprising a supporting and partitioning base having a plurality of spaced openings each having an inner peripheral end edge of a V-shaped cross section for tightly linearly contacting the circumference of the article to be plated when the latter is inserted in place in said opening, and by establishing electric conduction between the terminal of an electrode and the conductive portion in that region of the article located on the inner side of said supporting and partitioning base and not requiring plating via a conductive powder or particles filled on said inner side of the partitioning base, and by immersing that portion of the article protruding on the outer side of said base in the electrolyte, it is possible to accomplish partial metal plating of this article without any complicated steps required in the prior art and to perform mass production at greatly reduced cost.

Abstract translation: 通过使用包括具有多个间隔开口的支撑和分隔底座的装置，每个开口各自具有V形横截面的内周端边缘，用于在插入其中的待镀层制品的圆周上紧密地线性接触 并且通过在位于所述支撑分隔基底的内侧的制品的区域内的电极的端子与导电部之间建立导电，并且不需要通过导电粉末或填充在所述支撑分隔基底上的颗粒进行电镀 分隔基底的内侧，并且通过将制品的突出部分浸在电解质的基底的外侧上，可以在没有现有技术所需的任何复杂步骤的情况下完成该制品的部分金属电镀并执行 批量生产大大降低成本。

公开(公告)号：US3657075A

公开(公告)日：1972-04-18

申请号：US3657075D

申请日：1968-09-18

Applicant: KOKUSAI DENSHIN DENWA CO LTD

Inventor： OSHIMA SHINTARO ,  KOBAYASHI TOSHIHIKO ,  KAMIBAYASHI TETSUSABURO

IPC: H01F10/06 ,  C23B5/48 ,  C23B5/46

CPC classification number: H01F10/06

Abstract: A method of fabricating a memory matrix plane using ferromagnetic thin films, in which a composite film comprising a ferromagnetic thin film, a copper layer, and a chromium layer, is deposited on a glass substrate and is photoetched so as to obtain spaced parallel lines. Ferromagnetic layers are electroplated on the separate lines to coat the copper layer, and the chromium layer together with the ferromagnetic thin film at each of the separate lines, thereby obtaining row lines. Column lines are deposited, through an insulation layer, on the row lines so as to be orthogonally arranged to the row lines by evaporative deposition or adhesive deposition.

Abstract translation: 使用铁磁薄膜制造存储矩阵平面的方法，其中将包含铁磁性薄膜，铜层和铬层的复合薄膜沉积在玻璃基板上，并进行光刻，以获得间隔开的平行线。 将铁磁层电镀在不同的线上以将铜层和铬层与铁磁薄膜一起涂覆在每条分离线上，从而获得行线。 柱线通过绝缘层沉积在行线上，以便通过蒸发沉积或粘合剂沉积与行线正交地布置。

公开(公告)号：US3650908A

公开(公告)日：1972-03-21

申请号：US3650908D

申请日：1969-11-26

Applicant: THOMSON CSF

Inventor： CARBONEL MICHEL

IPC: A45C11/24 ,  A47G1/06 ,  C25D5/10 ,  H01F41/26 ,  C23B5/48 ,  C23B7/00

CPC classification number: C25D5/10 ,  A45C11/24 ,  H01F41/26

Abstract: In a method of manufacturing integrated magnetic memory elements the steps of: deposition by electrolysis on one face of a substrate made of a metal easily removed by etching agents through a mask, of the magnetic circuit; forming apertures through the substrate, inside the circuit, by etching through a second mask placed over the other face of the substrate; deposition by electrolysis of a further layer of metal on the assembly and in the apertures; depositing the conductor by electrolysis on the two faces of the assembly and in the apertures.

Abstract translation: 在制造集成磁存储元件的方法中，通过电解沉积由在电路上形成的由通过蚀刻剂容易地除去的金属构成的基板的磁性层; 通过蚀刻通过放置在衬底的另一个表面上的第二掩模，在电路内部，通过衬底形成孔; 通过在组件和孔中电解另一层金属来沉积; 通过电解在组件的两个表面和孔中沉积导体。

公开(公告)号：US3647643A

公开(公告)日：1972-03-07

申请号：US3647643D

申请日：1969-09-29

Applicant: IBM

Inventor： ALBERTS GENE S ,  FLUR BARRY L

IPC: G11C11/14 ,  H01F10/06 ,  H01F41/20 ,  H01F41/32 ,  C23B5/46 ,  C23B5/48 ,  G11B5/00

CPC classification number: H01F41/32 ,  H01F10/06

Abstract: MULTILAYER MAGNETIC FILM DEVICES ARE PREPARED IN WHICH A FIRST MAGNETIC FILM IS VACUUM DEPOSITED, AND A SECOND MAGNETIC FILM IS ELECTROPLATED. THE FIRST MAGNETIC FILM IS VACUUM EVAPORATED ON A SUITABLE SUBSTRATE, SUCH AS SILICON MONOXIDE-COATED OR POLYIMIDE-COATED METAL. AN ELECTRICALLY CONTINUOUS COPPER LAYER IS VACUUM EVAPORATED ON THE FIRST MAGNETIC FILM. AN ADDITIONAL THICKNESS OF COPPER IS ELECTROPLATED ON THE ELECTRICALLY CONTINUOUS COPPER LAYER. A SECOND MAGNETIC FILM IS THEN ELECTROPLATED ON THE ADDITIONAL THICKNESS OF COPPER. THE LAYER SO DEPOSITED MAY THEN BE ETCHED INTO ANY ARRAY OF MAGNETIC FILM DEVICES IN A SINGLE STEP ETCHING PROCESS, USING A SUITABLE ETCHANT FOR BOTH THE MAGNETIC FILMS AND THE COPPER, SUCH AS FERRIC CHLORIDE IN THE CASE OF NICKEL-IRON MAGNETIC FILMS. SINGLE

STEP ETCHING RESULTS IN BETTER DEFINITION, ALLOWING SUBSTANTIALLY GREATER DENSITY OF INDIVIDUAL STORAGE LOCATIONS IN A MEMORY EMPLOYING THE MAGNETIC FILM DEVICES.

公开(公告)号：US3640853A

公开(公告)日：1972-02-08

申请号：US3640853D

申请日：1968-12-27

Applicant: RCA CORP

Inventor： RYAN ROBERT J

IPC: C23C18/20 ,  H01B1/00 ,  H05K3/18 ,  H05K3/38 ,  C23B5/48

CPC classification number: H05K3/387 ,  C23C18/2033 ,  C23C18/2066 ,  C23C18/2086 ,  H01B1/00 ,  H05K3/181 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/0773

Abstract: An improved metal-to-substrate bond is attained by applying a resinous adhesive mixture to the surface of a nonconducting substrate, the mixture having finely divided particles dispersed therethrough. The particles are thereafter removed from the mixture to provide a microporous tortuous structure upon the substrates. Subsequently deposited metals are keyed into and upon the microporous structural layer to result in greatly improved peel strengths.

Abstract translation: 通过将树脂粘合剂混合物施加到非导电基材的表面，该混合物具有通过其分散的细碎颗粒而获得改进的金属对基材粘结。 然后从混合物中除去颗粒以在基材上提供微孔曲折结构。 随后，沉积的金属键入微孔结构层中并在微孔结构层上，导致剥离强度大大提高。

公开(公告)号：US3607674A

公开(公告)日：1971-09-21

申请号：US3607674D

申请日：1968-03-21

Applicant: SCHMITH NIELS BAY

Inventor： LAURITZEN ERIK

IPC: A61M5/32 ,  C23C18/20 ,  C25D1/02 ,  C23B7/02 ,  C23B5/48 ,  C23B5/56

CPC classification number: A61M5/32 ,  C23C18/2006 ,  C25D1/02

Abstract: The invention relates to a method for producing hollow needles, such as cannulae, hypodermic needles and the like. A material, such as metal, is applied as discrete particles, e.g. electrogalvanicly, by chemical precipitation or by spraying, to a surface part of a basic body made from an easily shapeable material, such as plastics or glass. The basic body may be solid or tubular, and the metal layer may be applied to the outer and/or inner surface thereof. The basic body may also have such a form that a needle integral with another syringe part is produced. After the application of the basic layer the basic body material may be partly or totally removed, if desired.

公开(公告)号：US3591352A

公开(公告)日：1971-07-06

申请号：US3591352D

申请日：1968-12-04

Applicant: NIBOT CORP

Inventor： KENNEDY PETER D ,  GOLDSTEIN HAROLD M

IPC: C23C18/16 ,  C23B5/48 ,  B44D1/18 ,  C23B5/60

CPC classification number: C23C18/1641 ,  C23C18/1607 ,  C23C18/1653 ,  Y10S428/935 ,  Y10S428/936 ,  Y10T428/12243 ,  Y10T428/12347 ,  Y10T428/12549 ,  Y10T428/12562 ,  Y10T428/12569 ,  Y10T428/12944 ,  Y10T428/31507 ,  Y10T428/31678 ,  Y10T428/31696 ,  Y10T428/31699

Abstract: THERE ARE DICLOSED HEREIN PROCESSES FOR PRODUCING MULTI-COMPONENT PLASTIC WORKPIECES IN WHICH AT LEAST A FIRST COMPONENT THEREOF HAS A PLATED METAL COATING THEREON, AND WORKPIECES PRODUCED BY SUCH PROCESSES. THESE PROCESSES GENERALLY COMPRISE PROVIDING A STRIKE SOLUTION, PROVIDING A MULTI-COMPONENT WORKPIECE INCLUDING A FIRST COMPONENT FORMED OF A FIRST PLASTIC MATERIAL ON WHICH A METAL IS DEPOSITED UPON APPLICATION OF THE STRIKE SOLUTION THERETO AND AT LEAST A SECOND COMPONENT FORMED OF A SECOND PLASTIC MATERIAL ON WHICH NO METAL IS DEPOSITED UPON APPLICATION OF THE STRIKE SOLUTION THERETO, APPLYING THE STRIKE SOLUTION TO THE WORKPIECE TO DEPOSIT A METAL STRIKE ON THE FIRST COMPONENT WITHOUT DEPOSITING A METAL STRIKE ON THE SECOND COMPONENT, AND PLATING A LAYER OF PLATING METAL OVER THE METAL STRIKE TO PROVIDE A PLATED METAL COATING ON THE FIRST COMPONENT WHILE NO METAL IS PLATED ON THE SECOND COMPONENT.