Cleaning liquid and anticorrosive agent comprising a mercapto compound and solvent
    26.
    发明授权
    Cleaning liquid and anticorrosive agent comprising a mercapto compound and solvent 有权
    包含巯基化合物和溶剂的清洁液体和防腐剂

    公开(公告)号:US08802610B2

    公开(公告)日:2014-08-12

    申请号:US14021505

    申请日:2013-09-09

    IPC分类号: C11D7/34

    CPC分类号: C23G1/26 C23F11/161 C23G1/20

    摘要: A method of cleaning a substrate having a metal layer including copper or a copper-containing alloy, the method including cleaning the substrate using a cleaning liquid that includes a mercapto compound represented by one or both of the following formulas (1) and (2), and a solvent containing water and a water-soluble organic solvent: in which R represents a substituent group; m is an integer of 1 to 3; and n is an integer of 0 to 3, when m is 2 or 3, R may be the same or different; HS—(CH2)x—OH  (2), in which x is an integer of no less than 3.

    摘要翻译: 一种清洗具有包含铜或含铜合金的金属层的基板的方法,所述方法包括使用包括由下式(1)和(2)中的一个或两个表示的巯基化合物的清洗液清洗所述基板, 和含有水和水溶性有机溶剂的溶剂:其中R表示取代基; m为1〜3的整数。 n为0〜3的整数,当m为2或3时,R可以相同或不同, HS-(CH2)x-OH(2),其中x为不小于3的整数。

    Cleaning method by electrolytic sulfuric acid and manufacturing method of semiconductor device
    27.
    发明申请
    Cleaning method by electrolytic sulfuric acid and manufacturing method of semiconductor device 有权
    电解硫酸的清洗方法及半导体装置的制造方法

    公开(公告)号:US20090325390A1

    公开(公告)日:2009-12-31

    申请号:US12459133

    申请日:2009-06-26

    IPC分类号: H01L21/20 C25B1/22 C11D7/34

    摘要: The cleaning method by electrolytic sulfuric acid and the manufacturing method of semiconductor device comprising: the process in which the first sulfuric acid solution is supplied from outside to the sulfuric acid electrolytic cell to form the first electrolytic sulfuric acid containing oxidizing agent in the sulfuric acid electrolytic cell; the process in which the second sulfuric acid solution, which is higher in concentration than said the first sulfuric acid solution previously supplied, is supplied from outside to said sulfuric acid electrolytic cell; said the second sulfuric acid solution and the first electrolytic sulfuric acid are mixed in said sulfuric acid electrolytic cell; and electrolysis is performed to form the cleaning solution comprising the second electrolytic sulfuric acid containing sulfuric acid and oxidation agent in said sulfuric acid electrolytic cell and the process in which cleaning treatment is performed for the cleaning object with said cleaning solution.

    摘要翻译: 电解硫酸的清洗方法以及半导体装置的制造方法,其特征在于,包括:从硫酸电解槽向外部供给第一硫酸溶液,在硫酸电解液中形成含有第一电解硫酸的氧化剂的工序 细胞; 其中比所述先前供应的所述第一硫酸溶液浓度高的第二硫酸溶液从外部供应到所述硫酸电解池的过程; 所述第二硫酸溶液和所述第一电解硫酸在所述硫酸电解池中混合; 并且进行电解以在所述硫酸电解池中形成包含含有硫酸和氧化剂的第二电解硫酸的清洗溶液,以及对所述清洁溶液进行清洁对象的清洁处理的处理。

    Cleaning composition for semiconductor components and process for manufacturing semiconductor device
    29.
    发明申请
    Cleaning composition for semiconductor components and process for manufacturing semiconductor device 审中-公开
    用于半导体元件的清洁组合物和用于制造半导体器件的工艺

    公开(公告)号:US20050284844A1

    公开(公告)日:2005-12-29

    申请号:US11165278

    申请日:2005-06-24

    摘要: A cleaning composition for semiconductor components comprises a water-soluble polymer (a) having a specific molecular weight and a compound (b) represented by the following formula (1): NR4OH  (1) wherein each R is independently a hydrogen atom or an alkyl group of 1 to 6 carbon atoms. A process for manufacturing a semiconductor device comprises chemical mechanical polishing a semiconductor component, and cleaning the semiconductor component with the cleaning composition for semiconductor components. The cleaning composition exerts a high cleaning effect on impurities remaining on a polished surface of a semiconductor component after chemical mechanical polishing, and becomes little burden on the environment.

    摘要翻译: 用于半导体组件的清洁组合物包括具有特定分子量的水溶性聚合物(a)和由下式(1)表示的化合物(b):<?在线公式描述=“在线配方” end =“lead”→NR 4 OH(1)<?in-line-formula description =“In-line Formulas”end =“tail”?>其中每个R独立地为氢原子 或1〜6个碳原子的烷基。 半导体器件的制造方法包括半导体部件的化学机械研磨,以及半导体部件用清洗组合物的半导体部件的清洗。 清洗组合物对化学机械抛光后残留在半导体组件的抛光表面上的杂质产生高清洁效果,并且对环境的负担很小。

    Organic activator
    30.
    发明申请
    Organic activator 失效
    有机活化剂

    公开(公告)号:US20050272631A1

    公开(公告)日:2005-12-08

    申请号:US11116775

    申请日:2005-04-28

    摘要: The present invention relates to organic activators having the following general formula: Wherein R1 is a substituted or unsubstituted alkyl or aryl moiety comprising at least five carbons, R2 is a substituted or unsubstituted alkyl moiety comprising less than five carbons, R3 is a suitable bridging moiety, R4 is a charged moiety, N is nitrogen, each G is, independently, an oxygen containing moiety and Z, when present, is a charge balancing counter ion. The present invention also relates to cleaning compositions comprising said organic activators, and processes for making and using the aforementioned organic activators and cleaning compositions.

    摘要翻译: 本发明涉及具有以下通式的有机活化剂:其中R 1是取代或未取代的包含至少五个碳的烷基或芳基部分,R 2是取代的 或包含少于五个碳的未取代的烷基部分,R 3是合适的桥连部分,R 4是带电部分,N是氮,每个G独立地是 含氧部分和Z(当存在时)是电荷平衡反离子。 本发明还涉及包含所述有机活化剂的清洁组合物,以及制备和使用上述有机活化剂和清洁组合物的方法。