公开(公告)号：US06746944B1

公开(公告)日：2004-06-08

申请号：US10341345

申请日：2003-01-14

Applicant: Qi Xiang ,  Robert B. Ogle ,  Eric N. Paton ,  Cyrus E. Tabery ,  Bin Yu

Inventor： Qi Xiang ,  Robert B. Ogle ,  Eric N. Paton ,  Cyrus E. Tabery ,  Bin Yu

IPC: H01L213205

CPC classification number: H01L29/6659 ,  H01L21/26506 ,  H01L21/26513 ,  H01L21/268 ,  H01L21/28518 ,  H01L29/665 ,  H01L29/7833

Abstract: Semiconductor devices with reduced NiSi/Si interface contact resistance are fabricated by forming preamorphized regions in a substrate at a depth overlapping the subsequently formed NiSi/Si interface, ion implanting impurities to form deep source/drain implants overlapping the preamorphized regions deeper in the substrate and laser thermal annealing to activate the deep source/drain regions. Nickel silicide layers are then formed in a main surface of the substrate and on the gate electrode. Embodiments include forming deep source/drain regions with an activated impurity concentration of 1×1020 to 1×1021 atoms/cm3 at the NiSi/Si interface.

Abstract translation: 具有降低的NiSi / Si界面接触电阻的半导体器件通过在与随后形成的NiSi / Si界面重叠的深度的衬底中形成预变形区域，离子注入杂质以形成与衬底中较深的预变形区域重叠的深源/漏注入; 激光热退火激活深源/漏区。 然后在衬底的主表面和栅电极上形成硅化镍层。 实施例包括在NiSi / Si界面处形成具有1×10 20至1×10 21原子/ cm 3的活化杂质浓度的深源/漏区。

公开(公告)号：US06717212B2

公开(公告)日：2004-04-06

申请号：US09879724

申请日：2001-06-12

Applicant: Dong-Hyuk Ju ,  William George En ,  Srinath Krishnan ,  Concetta E. Riccobene ,  Zoran Krivokapic ,  Judy Xilin An ,  Bin Yu

Inventor： Dong-Hyuk Ju ,  William George En ,  Srinath Krishnan ,  Concetta E. Riccobene ,  Zoran Krivokapic ,  Judy Xilin An ,  Bin Yu

IPC: H01L31392

CPC classification number: H01L21/76254 ,  H01L21/187 ,  H01L29/78603 ,  H01L29/78606 ,  H01L29/78609 ,  H01L29/78612

Abstract: A device and method for making a semiconductor-on-insulator (SOI) structure having a leaky, thermally conductive material (LTCIM) layer disposed between a semiconductor substrate and a semiconductor layer.

Abstract translation: 一种用于制造绝缘体半导体（SOI）结构的装置和方法，其具有设置在半导体衬底和半导体层之间的具有泄漏的导热材料（LTCIM）层。

公开(公告)号：US06716690B1

公开(公告)日：2004-04-06

申请号：US10385692

申请日：2003-03-12

Applicant: Haihong Wang ,  Judy Xilin An ,  Bin Yu

Inventor： Haihong Wang ,  Judy Xilin An ,  Bin Yu

IPC: H01L21336

CPC classification number: H01L29/785 ,  H01L21/26586 ,  H01L29/458 ,  H01L29/66795 ,  Y10S438/914

Abstract: Multiple dopant implantations are performed on a FinFET device to thereby distribute the dopant in a substantially uniform manner along a vertical depth of the FinFET in the source/drain junction. Each of the multiple implantations may be performed at different tilt angles.

Abstract translation: 在FinFET器件上执行多个掺杂剂注入，从而沿着源极/漏极结中的FinFET的垂直深度以大致均匀的方式分布掺杂剂。 多个注入中的每一个可以以不同的倾斜角执行。

公开(公告)号：US06709982B1

公开(公告)日：2004-03-23

申请号：US10303702

申请日：2002-11-26

Applicant: Matthew S. Buynoski ,  Judy Xilin An ,  Haihong Wang ,  Bin Yu

Inventor： Matthew S. Buynoski ,  Judy Xilin An ,  Haihong Wang ,  Bin Yu

IPC: H01L21311

CPC classification number: H01L29/785 ,  H01L21/3086 ,  H01L21/3088 ,  H01L21/32139 ,  H01L29/66795

Abstract: A method for forming a group of structures in a semiconductor device includes forming a conductive layer on a substrate, where the conductive layer includes a conductive material, and forming an oxide layer over the conductive layer. The method further includes etching at least one opening in the oxide layer, filling the at least one opening with the conductive material, etching the conductive material to form spacers along sidewalls of the at least one opening, and removing the oxide layer and a portion of the conductive layer to form the group of structures.

Abstract translation: 一种在半导体器件中形成一组结构的方法包括在基底上形成导电层，其中导电层包括导电材料，并在导电层上形成氧化物层。 该方法还包括蚀刻氧化物层中的至少一个开口，用导电材料填充至少一个开口，蚀刻导电材料以在至少一个开口的侧壁上形成间隔物，并且去除氧化物层和一部分 导电层形成一组结构。

公开(公告)号：US06709935B1

公开(公告)日：2004-03-23

申请号：US09817580

申请日：2001-03-26

Applicant: Bin Yu

Inventor： Bin Yu

IPC: H01L21336

CPC classification number: H01L29/66477 ,  H01L21/26506 ,  H01L29/1054 ,  H01L29/66545

Abstract: A method of forming a specialized channel region removes a sacrificial gate material and provides a semiconductor implant though the recess associated with the remove sacrificial gate material. The process can be utilized to form a silicon germanium layer in the channel region having a sharp profile in the vertical direction. Further, the silicon germanium layer can be ultra-thin. The silicon germanium channel region has increased charge mobility with respect to conventional channel regions.

Abstract translation: 形成专用沟道区的方法去除牺牲栅极材料并通过与去除的牺牲栅极材料相关联的凹槽来提供半导体注入。 该方法可用于在垂直方向具有锐利轮廓的通道区域中形成硅锗层。 此外，硅锗层可以是超薄的。 硅锗沟道区相对于常规沟道区具有增加的电荷迁移率。

公开(公告)号：US06703281B1

公开(公告)日：2004-03-09

申请号：US10274038

申请日：2002-10-21

Applicant: Bin Yu

Inventor： Bin Yu

IPC: H01L21336

CPC classification number: H01L29/6653 ,  H01L21/26506 ,  H01L21/268 ,  H01L21/28518 ,  H01L29/665 ,  H01L29/6659

Abstract: MOSFETs are fabricated with accurately defined, high and uniformly concentrated source/drain regions and extensions employing plural, sequential pre-amorphizing, implanting and laser thermal annealing steps with intervening spacer removal. Embodiments include forming sidewall spacers on a gate electrode, sequentially pre-amorphizing, ion implanting and laser thermal annealing to form deep source/drain regions, removing the sidewall spacers, and then sequentially pre-amorphizing, ion implanting and laser thermal annealing to form shallow source/drain extensions.

Abstract translation: 使用精确定义的高均匀浓度的源极/漏极区域和采用多个连续的前非晶化，注入和激光热退火步骤的间隔来制造MOSFET，并且间隔物移除。 实施例包括在栅电极上形成侧壁间隔物，顺序地预非晶化，离子注入和激光热退火以形成深源极/漏极区域，去除侧壁间隔物，然后依次预非晶化，离子注入和激光热退火以形成浅的 源/漏扩展。

公开(公告)号：US06696725B1

公开(公告)日：2004-02-24

申请号：US09527227

申请日：2000-03-16

Applicant: Judy X. An ,  Bin Yu

Inventor： Judy X. An ,  Bin Yu

IPC: H01L31119

CPC classification number: H01L29/66484 ,  H01L21/28105 ,  H01L29/4983 ,  H01L29/66545 ,  H01L29/66553 ,  H01L29/6659 ,  H01L29/7831

Abstract: A semiconductor device with reduced hot carrier injection and punch through is formed with a dual gate electrode comprising edge conductive portions, a central conductive portion, and dielectric sidewall spacers formed between the edge conductive portions and central conductive portion. The edge conductive portions provide high potential barriers against the active regions, thereby reducing threshold voltage roll off and leakage current.

Abstract translation: 具有减少的热载流子注入和穿通的半导体器件由双栅极电极形成，该双栅电极包括边缘导电部分，中心导电部分和形成在边缘导电部分和中心导电部分之间的电介质侧壁间隔物。 边缘导电部分提供抵抗有源区域的高电势势垒，从而降低阈值电压滚降和漏电流。

公开(公告)号：US06682973B1

公开(公告)日：2004-01-27

申请号：US10147650

申请日：2002-05-16

Applicant: Eric N. Paton ,  Qi Xiang ,  Bin Yu

Inventor： Eric N. Paton ,  Qi Xiang ,  Bin Yu

IPC: H01L218242

CPC classification number: H01L21/28185 ,  H01L21/02126 ,  H01L21/0214 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02236 ,  H01L21/02238 ,  H01L21/02247 ,  H01L21/02249 ,  H01L21/02255 ,  H01L21/2807 ,  H01L21/28194 ,  H01L21/28202 ,  H01L21/28291 ,  H01L21/31604 ,  H01L21/31662 ,  H01L21/31691 ,  H01L28/56 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518

Abstract: A process for fabricating a semiconductor device having a high-K dielectric layer over a silicon substrate, including steps of growing on the silicon substrate an interfacial layer of a silicon-containing dielectric material; and depositing on the interfacial layer a layer comprising at least one high-K dielectric material, in which the interfacial layer is grown by laser excitation of the silicon substrate in the presence of oxygen, nitrous oxide, nitric oxide, ammonia or a mixture of two or more thereof. In one embodiment, the silicon-containing material is silicon dioxide, silicon nitride, silicon oxynitride or a mixture thereof.

Abstract translation: 一种用于制造在硅衬底上具有高K电介质层的半导体器件的方法，包括在硅衬底上生长含硅介电材料的界面层的步骤; 并且在所述界面层上沉积包含至少一种高K电介质材料的层，其中所述界面层通过在氧，一氧化二氮，一氧化氮，氨或两者的混合物的存在下通过硅衬底的激光激发而生长 或更多。 在一个实施方案中，含硅材料是二氧化硅，氮化硅，氮氧化硅或其混合物。

公开(公告)号：US06670260B1

公开(公告)日：2003-12-30

申请号：US09577332

申请日：2000-05-24

Applicant: Bin Yu ,  Ming-Ren Lin ,  Shekhar Pramanick

Inventor： Bin Yu ,  Ming-Ren Lin ,  Shekhar Pramanick

IPC: H01L21425

CPC classification number: H01L29/6659 ,  H01L29/0649 ,  H01L29/78

Abstract: A thin filmed fully-depleted silicon-on-insulator (SOI) metal oxide semiconductor field defect transistor (MOSFET) utilizes a local insulation structure. The local insulative structure includes a buried silicon dioxide region under the channel region. The MOSFET body thickness is very small and yet silicon available outside of the channel region and buried silicon dioxide region is available for sufficient depths of silicide in the source and drain regions. The buried silicon dioxide region can be formed by a trench isolation technique or a LOCOS technique.

Abstract translation: 薄膜完全耗尽的绝缘体上硅（SOI）金属氧化物半导体场缺陷晶体管（MOSFET）利用局部绝缘结构。 局部绝缘结构包括沟道区下方的埋置二氧化硅区域。 MOSFET体的厚度非常小，而在沟道区域和掩埋的二氧化硅区域之外可用的硅可用于源极和漏极区域中足够的硅化物深度。 掩埋的二氧化硅区域可以通过沟槽隔离技术或LOCOS技术形成。

公开(公告)号：US06630386B1

公开(公告)日：2003-10-07

申请号：US09618857

申请日：2000-07-18

Applicant: Bin Yu

Inventor： Bin Yu

IPC: H01L21336

CPC classification number: H01L21/26506 ,  H01L21/26513 ,  H01L21/2658 ,  H01L21/324 ,  H01L29/1083 ,  H01L29/51 ,  H01L29/517 ,  H01L29/518 ,  H01L29/6659

Abstract: A method of manufacturing an integrated circuit may include the steps of annealing a gate structure and a halo section disposed over a substrate using a first temperature, implanting dopants to form drain and source regions, and annealing drain and source regions at a second temperature. The second temperature is substantially less than the first temperature.

Abstract translation: 制造集成电路的方法可以包括以下步骤：使用第一温度退火设置在衬底上的栅极结构和卤素区段，注入掺杂剂以形成漏极和源极区域，以及在第二温度下退火漏极和源极区域。 第二温度基本上小于第一温度。