Abstract:
A planarization process for a pre-damascene structure is described, wherein the pre-damascene structure includes a metal hard mask that is disposed on a first material layer with a damascene opening therein and a second material layer that fills the damascene opening and covers the metal hard mask. A first CMP step is conducted using a first slurry to remove the second material layer outside the damascene opening. A second CMP step is conducted using a second slurry to remove the metal hard mask.
Abstract:
A digital power factor correction device is provided, which is an all-digital control module. The digital power factor correction device includes a voltage loop control unit, an input power control unit, a current loop control unit, and a pulse width modulation generation unit, to perform power factor correction for minimizing the phase difference between input current and input voltage through adjusting input current with an external driver and a switch unit. The voltage loop control unit and the current loop control unit contain proportion-integral-differentiation controller to form voltage control loop and current control loop, respectively. The input power control unit adjusts current waveform according to the input power, while the pulse width modulation generation unit decides stop time of pulse width modulation to produce a pulse width modulation signal, to control the external driver and the switch unit for eliminating loading effect.
Abstract:
A flash memory system and managing and collecting methods for flash memory with invalid page messages thereof are described. When the valid data pages of the flash memory are changed to invalid data pages, a recording area is used to record the message of the invalid data pages to effectively collect the occupied space of the invalid data pages in the flash memory. Further, while garbage collecting step is performed, a block is rapidly selected according to the message of the recording area and the valid data pages in the selected block are correctly identified, copied and removed.
Abstract:
A chemical mechanical polishing (CMP) process includes steps of providing a substrate, performing a first polishing step to the substrate with an acidic slurry, and performing a second polishing step to the substrate with a basic slurry after the first polishing step.
Abstract:
The present invention relates to a drive circuit of light source by color sequential method for generating a full-color image based on sequential switching between red, green and blue illuminations. The drive circuit of light source by color sequential method includes a color-sequential control circuit and a plurality of radiating areas coupled to multiple light units. The color-sequential control circuit is connected to those radiating areas to control the operation thereof by the color sequential method.
Abstract:
A PWM step wave and sine wave driving device is provided. The driving device includes an ADC unit, an input processing unit, a first pulse width calculation unit, a register unit, a first output unit, a zero point detecting unit, a second pulse width calculation unit, a second output unit, and a multiplexer output unit. The driving device receives input signals, and output desired step wave or sine wave driving signals for driving an external electric device. The driving device detects a point of zero voltage of the system power supply by the zero point detecting unit. When the system power supply is abnormal, the first output unit outputs predetermined PWM step wave output signals, or the second output unit outputs predetermined PWM sine wave output signals. In such a way, the external electric device can be maintained for regular operation, so that the malfunction or breakdown thereof is prevented.
Abstract:
A solenoid valve includes a bobbin, a coil, a rod, and at least one ball. The bobbin has a through hole and a multiple-turning-point groove in the inner wall of the bobbin. The coil winds around the bobbin. The rod is disposed in the through hole and is capable of moving inward or outward along the through hole, and has a recess in the outer wall of the rod. Each ball is received in the groove and the recess at the same time.
Abstract:
A semiconductor device having light-emitting diodes (LEDs) formed on a concave textured substrate is provided. A substrate is patterned and etched to form recesses. A separation layer is formed along the bottom of the recesses. An LED structure is formed along the sidewalls and, optionally, along the surface of the substrate between adjacent recesses. In these embodiments, the surface area of the LED structure is increased as compared to a planar surface. In another embodiment, the LED structure is formed within the recesses such that the bottom contact layer is non-conformal to the topology of the recesses. In these embodiments, the recesses in a silicon substrate result in a cubic structure in the bottom contact layer, such as an n-GaN layer, which has a non-polar characteristic and exhibits higher external quantum efficiency.
Abstract:
An LED package structure comprises a substrate, a first electrically conductive pattern, a second electrically conductive pattern, at least one electrically conductive element, and an LED chip. The substrate has a first surface and a second surface opposite to the first surface. The first electrically conductive pattern is disposed on the first surface. The second electrically conductive pattern is disposed on the second surface. The at least one electrically conductive element traverses the fluorescent substrate and connects the first and second electrically conductive patterns. The LED chip is disposed on the second surface and has a light extraction surface that connects the second electrically conductive pattern. The LED chip is electrically coupled to the first electrically conductive pattern via the at least one electrically conductive element.
Abstract:
In one aspect, an LED package structure comprises a fluorescent substrate, a first electrically conductive pattern, a second electrically conductive pattern, at least one electrically conductive element, and an LED chip. The fluorescent substrate has a first surface and a second surface opposite the first surface. The fluorescent substrate comprises a mixture of a fluorescent material and a glass material. The first electrically conductive pattern is disposed on the first surface. The second electrically conductive pattern is disposed on the second surface. The electrically conductive element passes through the fluorescent substrate and connects the first and second electrically conductive patterns. The LED chip is disposed on the second surface and has a light extraction surface that connects the second electrically conductive pattern. The LED chip is electrically coupled to the first electrically conductive pattern via the electrically conductive element.