公开(公告)号：US08349880B2

公开(公告)日：2013-01-08

申请号：US12683791

申请日：2010-01-07

Applicant: Lawrence R. Marcin ,  Lorin A. Thompson, III ,  Kenneth M. Boy ,  Jason M. Guernon ,  Mendi A. Higgins ,  Jianliang Shi ,  Yong-Jin Wu ,  Yunhui Zhang ,  John E. Macor

Inventor： Lawrence R. Marcin ,  Lorin A. Thompson, III ,  Kenneth M. Boy ,  Jason M. Guernon ,  Mendi A. Higgins ,  Jianliang Shi ,  Yong-Jin Wu ,  Yunhui Zhang ,  John E. Macor

IPC: A61K31/41 ,  A61K31/425 ,  C07D249/00 ,  C07D277/82

CPC classification number: C07D487/04 ,  C07D417/12 ,  C07D471/04 ,  C07D513/10

Abstract: The present disclosure provides a series of compounds of the formula (I) which reduce β-amyloid peptide (β-AP) production and are useful in the treatment of Alzheimer's Disease and other conditions affected by β-amyloid peptide (β-AP) production.

Abstract translation: 本公开提供了一系列式（I）的化合物，其减少β-淀粉状蛋白肽（＆bgr--AP）产生，并且可用于治疗阿尔茨海默氏病和其它受β-淀粉状蛋白肽（＆bgr; -AP）生产。

公开(公告)号：US08323803B2

公开(公告)日：2012-12-04

申请号：US12416197

申请日：2009-04-01

Applicant: Jin Wu ,  Jing Zhou

Inventor： Jin Wu ,  Jing Zhou

IPC: B32B27/34

CPC classification number: B41M5/368 ,  B41C1/1041 ,  Y10T428/31725

Abstract: An imaging member is disclosed having a surface layer comprising a heat-sensitive material whose surface compatibility to printing agents, such as toners and inks, can be substantially reversed in response to small changes in temperature. The imaging member is suitable for use in lithographic and printing applications, permitting reversible switching between compatibility states of printing agents, such as between hydrophilic and hydrophobic states or oleophilic and oleophobic states, and enabling rapid production of images on a recording medium. The heat-sensitive material comprises an acrylamide polymer and a silicon material.

Abstract translation: 公开了一种成像构件，其具有包括热敏材料的表面层，其与打印剂（例如调色剂和墨水）的表面相容性可以响应于温度的微小变化而基本上反转。 成像构件适用于平版印刷和印刷应用，允许打印剂的相容性状态之间的可逆切换，例如在亲水和疏水状态之间或亲油和疏油状态下，以及使得能够在记录介质上快速生成图像。 热敏材料包括丙烯酰胺聚合物和硅材料。

公开(公告)号：US08304152B2

公开(公告)日：2012-11-06

申请号：US12846023

申请日：2010-07-29

Applicant: Jin Wu

Inventor： Jin Wu

IPC: G03G5/047 ,  G03G5/05

CPC classification number: G03G5/0564 ,  G03G5/0517 ,  G03G5/0589 ,  G03G5/0592 ,  G03G5/0614 ,  G03G5/0696 ,  G03G5/076 ,  G03G5/142 ,  G03G5/144

Abstract: A photoconductor that includes a supporting substrate, an optional ground plane layer, an optional hole blocking layer, an optional adhesive layer, a photogenerating layer, and at least one charge transport layer, and where the charge transport layer contains a spirodilactam based polycarbonate.

Abstract translation: 一种光电导体，其包括支撑衬底，可选的接地平面层，可选的空穴阻挡层，任选的粘合剂层，光生成层和至少一个电荷输送层，并且其中电荷输送层含有螺内酰胺基聚碳酸酯。

公开(公告)号：US08280284B2

公开(公告)日：2012-10-02

申请号：US13026247

申请日：2011-02-12

Applicant: Jin Wu ,  Yuhua Tong ,  Brian P. Gilmartin ,  Robert J. Meyer

Inventor： Jin Wu ,  Yuhua Tong ,  Brian P. Gilmartin ,  Robert J. Meyer

IPC: G03G15/14

CPC classification number: G03G15/162

Abstract: Flexible members for use in imaging devices comprise a polyamideimide comprising phosphorus.

Abstract translation: 用于成像装置的柔性构件包括含磷的聚酰胺酰亚胺。

公开(公告)号：US08268520B2

公开(公告)日：2012-09-18

申请号：US12788020

申请日：2010-05-26

Applicant: Jin Wu ,  Kenny-Tuan T Dinh ,  Linda L Ferrarese ,  Marc J Livecchi ,  Edward C Savage ,  Michael E Zak

Inventor： Jin Wu ,  Kenny-Tuan T Dinh ,  Linda L Ferrarese ,  Marc J Livecchi ,  Edward C Savage ,  Michael E Zak

IPC: G03G5/00

CPC classification number: G03G5/0614 ,  G03G5/0517 ,  G03G5/0539 ,  G03G5/0567 ,  G03G5/0609

Abstract: A photoconductor that includes a supporting substrate, an optional ground plane layer, an optional hole blocking layer, an optional adhesive layer, a photogenerating layer, and at least one charge transport layer, and where the charge transport layer contains a polyalkylene glycol benzoate and a fluorinated polymer.

Abstract translation: 一种光电导体，其包括支撑衬底，可选的接地平面层，可选的空穴阻挡层，任选的粘合剂层，光生成层和至少一个电荷输送层，并且其中电荷输送层含有聚亚烷基二醇苯甲酸盐和 氟化聚合物。

公开(公告)号：US20120208906A1

公开(公告)日：2012-08-16

申请号：US13026249

申请日：2011-02-12

Applicant: Jin Wu

Inventor： Jin Wu

IPC: C08J5/20 ,  B28B7/30 ,  G03G15/01

CPC classification number: G03G15/162 ,  B28B7/30 ,  C08J5/18 ,  C08J5/20 ,  C08J2381/06 ,  C08J2479/08

Abstract: Flexible members for use in imaging devices comprise a polyphenylsulfone and a polyetherimide; and optionally, a polysiloxane surfactant.

Abstract translation: 用于成像装置的柔性构件包括聚苯砜和聚醚酰亚胺; 和任选的聚硅氧烷表面活性剂。

公开(公告)号：US08232140B2

公开(公告)日：2012-07-31

申请号：US12731281

申请日：2010-03-25

Applicant: Ku-Feng Yang ,  Weng-Jin Wu ,  Wen-Chih Chiou ,  Tsung-Ding Wang

Inventor： Ku-Feng Yang ,  Weng-Jin Wu ,  Wen-Chih Chiou ,  Tsung-Ding Wang

IPC: H01L21/00

CPC classification number: H01L23/3114 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/16 ,  H01L24/32 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/80006 ,  H01L2224/80894 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/81005 ,  H01L2224/81801 ,  H01L2224/83005 ,  H01L2224/8385 ,  H01L2224/94 ,  H01L2224/95001 ,  H01L2225/06541 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/83

Abstract: A method for thin wafer handling and processing is provided. In one embodiment, the method comprises providing a wafer having a plurality of semiconductor chips, the wafer having a first side and a second side. A plurality of dies are attached to the first side of the wafer, at least one of the dies are bonded to at least one of the plurality of semiconductor chips. A wafer carrier is provided, wherein the wafer carrier is attached to the second side of the wafer. The first side of the wafer and the plurality of dies are encapsulated with a planar support layer. A first adhesion tape is attached to the planar support layer. The wafer carrier is then removed from the wafer and the wafer is diced into individual semiconductor packages.

Abstract translation: 提供了一种用于薄晶片处理和处理的方法。 在一个实施例中，该方法包括提供具有多个半导体芯片的晶片，该晶片具有第一侧和第二侧。 多个管芯附接到晶片的第一侧，至少一个管芯被结合到多个半导体芯片中的至少一个。 提供晶片载体，其中晶片载体附接到晶片的第二侧。 晶片的第一侧和多个管芯被平坦的支撑层封装。 第一粘合带附接到平面支撑层。 然后将晶片载体从晶片上移除，并将晶片切成单独的半导体封装。

公开(公告)号：US20120183729A1

公开(公告)日：2012-07-19

申请号：US13009073

申请日：2011-01-19

Applicant: Jin Wu ,  Jonathan H. Herko ,  Francisco J. Lopez ,  Kyle Bruce Tallman ,  Dante M. Pietrantoni ,  David W. Martin ,  Yuhua Tong ,  Michael S. Roetker ,  Scott J. Griffin ,  Markus R. Silvestri

Inventor： Jin Wu ,  Jonathan H. Herko ,  Francisco J. Lopez ,  Kyle Bruce Tallman ,  Dante M. Pietrantoni ,  David W. Martin ,  Yuhua Tong ,  Michael S. Roetker ,  Scott J. Griffin ,  Markus R. Silvestri

IPC: C08L81/06 ,  B32B3/10 ,  C08K5/521

CPC classification number: C08K3/04 ,  C08L81/06 ,  C08L83/04

Abstract: There is described an intermediate transfer member comprising a seamless layer comprising a polyphenylsulfone and a polysiloxane having dispersed therein carbon black particles. The composition used to manufacture the seamless intermediate transfer member is also described.

Abstract translation: 描述了一种中间转印部件，其包括无机层，该无缝层包含聚苯基砜和分散有炭黑颗粒的聚硅氧烷。 还描述了用于制造无缝中间转印部件的组合物。

公开(公告)号：US08213845B2

公开(公告)日：2012-07-03

申请号：US12573297

申请日：2009-10-05

Applicant: Jonathan H. Herko ,  Jin Wu ,  Scott J. Griffin ,  Michael S. Roetker ,  Dante M. Pietrantoni ,  David W. Martin ,  Francisco J. Lopez

Inventor： Jonathan H. Herko ,  Jin Wu ,  Scott J. Griffin ,  Michael S. Roetker ,  Dante M. Pietrantoni ,  David W. Martin ,  Francisco J. Lopez

IPC: G03G15/01

CPC classification number: G03G15/161 ,  G03G15/162

Abstract: An intermediate transfer member substrate with an overcoat and a process for preparing the intermediate transfer member substrate with an overcoat layer by application of corona treatment to the surface of the intermediate transfer member substrate to enhance the interfacial adhesion between the overcoat and intermediate transfer member substrate.

Abstract translation: 具有外涂层的中间转印部件基板和通过对中间转印部件基板的表面进行电晕处理来制备具有外涂层的中间转印部件基板的方法，以增强外涂层和中间转印部件基板之间的界面粘合。

公开(公告)号：US20120155920A1

公开(公告)日：2012-06-21

申请号：US12970800

申请日：2010-12-16

Applicant: JIN WU

Inventor： JIN WU

IPC: G03G15/02 ,  G03G5/06

CPC classification number: G03G15/75 ,  G03G5/0564 ,  G03G5/0614 ,  G03G5/0696 ,  G03G5/14708

Abstract: The presently disclosed embodiments are directed to charge transport layers useful in electrostatography. More particularly, the embodiments pertain to an improved electrostatographic imaging member having a specific photoreceptor material package comprising an undercoat layer, a charge generation layer, a charge transport layer comprising Tm-TBD/tris(butadienylaryl)amine, and an overcoat layer. The charge transport layer molecule provides substantially reduced C zone residual potential and therefore alleviates the problems of low optical density and ghosting.

Abstract translation: 目前公开的实施例涉及用于静电放电的电荷传输层。 更具体地，实施例涉及具有包含底涂层，电荷产生层，包含Tm-TBD /三（丁二烯基芳基）胺的电荷传输层和外涂层的特定感光体材料封装的改进的静电摄影成像构件。 电荷传输层分子提供显着降低的C区残留电位，因此减轻了低密度和重影的问题。