Abstract:
A multilayer electrode structure has a conductive layer including aluminum, an oxide layer formed on the conductive layer, and an oxygen diffusion barrier layer. The oxide layer includes zirconium oxide and/or titanium oxide. The oxygen diffusion barrier layer is formed at an interface between the conductive layer and the oxide layer by re-oxidizing the oxide layer. The oxygen diffusion barrier layer includes aluminum oxide.
Abstract:
Provided is a semiconductor memory device testable with a single data rate (SDR) or a dual data rate (DDR) pattern in a merged data input/output pin (DQ) test mode. The device includes a first path circuit, a second path circuit, and a merged output generator configured to generate a merged data bit having a SDR and/or DDR pattern.
Abstract:
A multi-dielectric film including at least one first dielectric film that is a composite film made of zirconium-hafnium-oxide and at least one second dielectric film that is a metal oxide film made of amorphous metal oxide. Adjacent ones of the dielectric films are made of different materials.
Abstract:
Capacitors having upper electrodes that include a lower electrode, a dielectric layer and an upper electrode that includes a conductive metal nitride layer and a doped polysilicon germanium layer are provided. At least part of the conductive metal nitride layer is oxidized and/or at least part of the dielectric layer is nitridized.
Abstract:
A semiconductor memory device including a bit line sense amplifier for amplifying a voltage corresponding to a charge stored in a capacitor of a memory cell and outputting an amplified voltage and an I/O sense amplifier for receiving the output of the bit line sense amplifier, amplifying a voltage level of the output and outputting an amplified voltage level is disclosed. The semiconductor memory device includes a sense amplification enable signal control portion which receives an initial sense amplification enable signal, sequentially delays the initial sense amplification enable signal by a plurality of predetermined time periods and selectively outputs a plurality of delayed sense amplification enable signals in view of both an operation speed and a manufacturing yield of a semiconductor memory device; a plurality of clocked sense amplifiers which each receive an output signal of the I/O sense amplifier, amplify the output signal of the I/O sense amplifier in response to each of the plurality of delayed sense amplification enable signals, and sequentially output an output signal of a power voltage level or a ground voltage level in response; and a previous-step output driving circuit which sequentially receives the output signals of the plurality of clocked sense amplifiers, delays the output signals of the plurality of clocked sense amplifiers by a predetermined time period, and then intercepts an output of the clocked sense amplifier of a previous step.
Abstract:
A sense amplifier circuit of a semiconductor memory device and a method of operating the same, in which the sense amplifier circuit includes a bit line sense amplifier connected with a bit line to sense and amplify a signal of the bit line, and a calibration circuit calibrating a voltage level of the bit line based on a logic threshold value of the bit line sense amplifier. The bit line sense amplifier senses and amplifies the signal of the bit line after the voltage level of the bit line is calibrated. The bit line sense amplifier may include a 2-stage cascade latch, which includes a first inverter having an input terminal connected with the bit line; and a second inverter which has an input terminal connected with an output terminal of the first inverter and an output terminal connected with the bit line and is enabled/disabled in response to a sensing control signal. The calibration circuit includes a switch element that is connected between the output terminal of the first inverter and the bit line and is turned on or off in response to a calibration control signal.
Abstract:
An LCD shuts down an inverter when a supply time of a high current from the inverter to a lamp exceeds an allowable time, and also controls the allowable time according to an ambient temperature, thereby minimizing damage to a lamp due to overheating in a high-brightness driving operation.
Abstract:
In a method of manufacturing a dielectric structure, after a first dielectric layer is formed on a substrate by using a metal oxide doped with silicon, the substrate is placed on a susceptor of a chamber. By treating the first dielectric layer with a plasma in controlling a voltage difference between the susceptor and a ground, a second dielectric layer is formed on the first dielectric layer. The second dielectric layer including a metal oxynitride doped with silicon having enough content of nitrogen is formed on the first dielectric layer. Therefore, dielectric properties of the dielectric structure comprising the first and the second dielectric layers can be improved and a leakage current can be greatly decreased. By adapting the dielectric structure to a gate insulation layer and/or to a dielectric layer of a capacitor or of a non-volatile semiconductor memory device, capacitances and electrical properties can be improved.
Abstract:
Example embodiments of the present invention disclose a non-volatile semiconductor memory device, which may include a dielectric layer having an enhanced dielectric constant. A tunnel oxide layer pattern and a floating gate may be sequentially formed on a substrate. A dielectric layer pattern including metal oxide doped with Group III transition metals may be formed on the floating gate using a pulsed laser deposition process. The dielectric layer pattern having an increased dielectric constant may be formed of metal oxide doped with a transition metal such as scandium, yttrium, or lanthanum.
Abstract:
A gas injection apparatus, which can sequentially supply a substrate with at least two kinds of source gases reacting with each other in a container, and thin film deposition equipment including the gas injection apparatus, are provided. The gas injection apparatus includes a base plate, a first gas supply region protruding from the base plate, a second gas supply region protruding from the base plate and adjacent the first gas supply region, and a trench defined by a sidewall of the first gas supply region and a sidewall of the second gas supply region. The sidewall of the first gas supply region and the sidewall of the second gas supply region face each other and extend in a radial direction on the base plate.