公开(公告)号：US20230314482A1

公开(公告)日：2023-10-05

申请号：US18295738

申请日：2023-04-04

Applicant: Microfabrica Inc.

Inventor： Arun S. Veeramani ,  Ming Ting Wu ,  Dennis R. Smalley

IPC: G01R1/073 ,  G01R31/28

CPC classification number: G01R1/07371 ,  G01R31/2831

Abstract: Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and a dual array plate mounting and retention configuration. The probes may comprise one or more mounting features that extend laterally from a body portion of the probe and the lower and upper array plates, in combination, capture: (1) at least one of the mounting features to inhibit excessive downward vertical movement of the probe body relative to the array plates, (2) at least one of the mounting features to inhibit excessive upward vertical movement of the probe body relative to the array plates, and (3) at least one of the mounting features to inhibit excessive lateral movement of the probe relative to the array plates, and wherein the at least one lower and upper plates longitudinally contact each other in a stacked assembly.

公开(公告)号：US11774467B1

公开(公告)日：2023-10-03

申请号：US17464644

申请日：2021-09-01

Applicant: Microfabrica Inc.

Inventor： Onnik Yaglioglu

IPC: G01R1/073 ,  C25D1/10 ,  G03F7/20 ,  G03F7/00

CPC classification number: G01R1/073 ,  C25D1/10 ,  G03F7/70025

Abstract: Probe structures, probe arrays, have varying intrinsic material properties along their lengths. Methods of forming probes and probe arrays comprise varying the plating parameters to provide varying intrinsic material properties. Some embodiments provide deposition templates created using multiphoton lithography to provide probes with varying lateral configurations along at least portion of their lengths.

公开(公告)号：US20230243872A1

公开(公告)日：2023-08-03

申请号：US18295748

申请日：2023-04-04

Applicant: Microfabrica Inc.

Inventor： Arun S. Veeramani ,  Ming Ting Wu ,  Dennis R. Smalley

IPC: G01R1/067 ,  G01R1/073

CPC classification number: G01R1/06733 ,  G01R1/06722 ,  G01R1/07314

Abstract: Probe for making contact between two electronic circuit elements comprises a feature selected from the group consisting of: (A) at least one first tip and second tip arm supporting a shunting element that makes an electrical connection to at least one standoff while shunting current flow away from a spring element of the probe that joins a respective standoff and supports the respective tip arm, and (B) both of the first tip arm and the second tip arm support a respective shunting element that makes an electrical connection to the at least one respective standoff while shunting current flow away from a respective spring element that joins the respective standoff and supports the respective tip arm.

公开(公告)号：US20230201968A1

公开(公告)日：2023-06-29

申请号：US17723348

申请日：2022-04-18

Applicant: Microfabrica Inc.

Inventor： Arun S. Veeramani ,  Heath A. Jensen ,  Uri Frodis ,  Christopher G. Wiita ,  Michael S. Lockard ,  Irina Boguslavsky ,  Pavel Lembrikov ,  Dennis R. Smalley ,  Richard T. Chen

IPC: B23K26/38 ,  C25D5/02 ,  B23K26/382

CPC classification number: B23K26/38 ,  C25D5/028 ,  B23K26/382

Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

公开(公告)号：US10961967B1

公开(公告)日：2021-03-30

申请号：US16551652

申请日：2019-08-26

Applicant: Microfabrica Inc.

Inventor： Gregory P. Schmitz ,  Ming Ting Wu ,  Uri Frodis ,  Eli Baldwin ,  Gabriel Jacobsohn

IPC: F02M61/04 ,  F02M61/18 ,  F02M61/14 ,  F02M61/16 ,  C25D7/00 ,  B33Y80/00

Abstract: Embodiments are directed to fuel injectors for internal combustion engines (e.g. engines with reciprocating pistons and with compression-ignition or spark-ignition, Wankel engines, turbines, jets, rockets, and the like) and more particularly to improved nozzle configurations for use as part of such fuel injectors. Other embodiments are directed to enabling fabrication technology that can provide for formation of nozzles with complex configurations and particularly for technologies that form structures via multiple layers of selectively deposited material or in combination with fabrication from a plurality of layers where critical layers are planarized before attaching additional layers thereto or forming additional layers thereon. Other embodiments are directed to methods and apparatus for integrating such nozzles with injector bodies.

公开(公告)号：US20200335425A1

公开(公告)日：2020-10-22

申请号：US16840305

申请日：2020-04-03

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/473 ,  F28F3/12 ,  F28F13/06 ,  H01L21/48 ,  H05K7/20

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.

公开(公告)号：US10801119B2

公开(公告)日：2020-10-13

申请号：US16182989

申请日：2018-11-07

Applicant: Microfabrica Inc.

Inventor： Gregory P. Schmitz ,  Michael S. Lockard ,  Ming-Ting Wu ,  Eric C. Miller ,  Adam L. Cohen

IPC: G07F19/00 ,  C25D1/00 ,  B32B15/01 ,  C25D5/02 ,  C25D5/48 ,  C25D1/08 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y80/00 ,  B33Y70/00 ,  C25D7/00

Abstract: A counterfeiting deterrent device according to one implementation of the disclosure includes a plurality of layers formed by an additive process. Each of the layers may have a thickness of less than 100 microns. At least one of the layers has a series of indentations formed in an outer edge of the layer such that the indentations can be observed to verify that the device originated from a predetermined source. According to another implementation, a counterfeiting deterrent device includes at least one raised layer having outer edges in the shape of a logo. A light source is configured and arranged to shine a light through a slit in a substrate layer of the device and past an intermediate layer to light up the outer edge of the raised layer. The layers of the device are formed by an additive process and have a thickness of less than 100 microns each.

公开(公告)号：US10297421B1

公开(公告)日：2019-05-21

申请号：US15206782

申请日：2016-07-11

Applicant: Microfabrica Inc.

Inventor： Rulon J. Larsen, III ,  Adam L. Cohen

IPC: C25D5/10 ,  C25D5/48 ,  C25D7/12 ,  H01J37/32

Abstract: Embodiments are directed to forming reentrant multi-layer micro-scale or millimeter scale three dimensional structures, parts, components, or devices where each layer is formed from a plurality of deposited materials and more specifically where each layer is formed from at least one metal structural material and at least one organic sacrificial material (e.g. polymer) that are co-planarized and a portion of the sacrificial material located on a plurality of layers is removed after formation of the plurality of layers via one or more plasma etching operations.

公开(公告)号：US10096537B1

公开(公告)日：2018-10-09

申请号：US15475074

申请日：2017-03-30

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/34 ,  H01L23/427 ,  F28D15/04

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide thermal management or cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins. Other embodiments of the invention are directed to heat spreaders (e.g. heat pipes or vapor chambers) that provide enhanced thermal management via enhanced wicking structures and/or vapor creation and flow structures. Other embodiments provide enhanced methods for making such arrays and spreaders.

公开(公告)号：US09953899B2

公开(公告)日：2018-04-24

申请号：US15283013

申请日：2016-09-30

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/473 ,  H01L21/48 ,  H05K7/20 ,  F28F3/12 ,  F28F13/06

CPC classification number: H01L23/4735 ,  F28F3/12 ,  F28F13/06 ,  F28F2260/02 ,  H01L21/4871 ,  H01L21/4882 ,  H01L23/473 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20281

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.