Abstract:
A method erases a memory cell of a semiconductor device that includes a group of memory cells. Each memory cell includes a group of storage regions. The method includes determining that each storage region of the group of storage regions of a first memory cell is to be erased and erasing the group of storage regions of the first memory cell via a single hot hole injection process.
Abstract:
A memory device and a method of fabrication are provided. The memory device includes a semiconductor substrate and a charge trapping dielectric stack disposed over the semiconductor substrate. A gate electrode is disposed over the charge trapping dielectric stack, where the gate electrode electrically defines a channel within a portion of the semiconductor substrate. The memory device includes a pair of bitlines, where the bitlines have a lower portion and a substantially trapezoidal shaped upper portion.
Abstract:
An iron-protein hydrolysate complex which may be used to fortify foods and beverages with iron. The complex is formed of ferrous ions chelated to partially hydrolyzed egg white protein. The hydrolyzed egg white protein has a molecular weight in the range of about 500 to about 10,000. The complexes are sufficiently stable as to be suitable for use in sterilized products, such as retorted products. Moreover, despite the stability, the iron in the complexes has substantially the same bioavailability as ferrous sulfate.
Abstract:
A replaceable roller bogie for a single sheet feeder includes pre-feed and separation rollers mounted on a frame which also has a frame positioning lever thereon. Roller drive gears are mounted between spaced plates on the frame and include a pre-feed roller clutch gear with elastomeric teeth which is mounted in slots on the frame which limit motion travel of the clutch gear to prevent over engagement of gear teeth on the clutch gear with gear teeth on the pre-feed roller drive gear. The replaceable bogie is pivotally supported on the sheet feeder and held in place by a manually operable release and latch mechanism.
Abstract:
One aspect of the present invention provides a process for forming IC devices with ESD protection transistors. According to one aspect of the invention, an ESD protection transistor is provided with a light doping and then, after forming spacers, a heavy doping. The heavy doping with spacers in place can lower the sheet resistance, enhance the bipolar effect for the transistor, reduce the transistor's capacitance, and reduce the junction breakdown voltage, all without causing short channel effects. The invention thereby provides ESD protection transistors that are compact, highly sensitive, and fast-switching. The spacers can be formed at the same time as spacers for other transistors, such as other transistors in a peripheral region of the device.
Abstract:
A planar transistor structure is disclosed that minimizes resistance in the source region and simplifies fabrication of the semiconductor device. The device includes a row of transistors where each transistor includes a stack gate structure and a drain, and a layer of type-2 polysilicon is used to interconnect the transistors in each row. A source region is provided adjacent to the layer of type-2 polysilicon that includes a contact and a N-type junction extending across the source region that provides a planar electrical path between the drains of the transistors and the contact, thereby reducing resistance of the source region.
Abstract:
A method of forming a contact in a flash memory device utilizes a local interconnect process technique. The local interconnect process technique allows the contact to butt against or overlap a stacked gate associated with the memory cell. The contact can include tungsten. The stacked gate is covered by a barrier layer which also covers the insulative spacers.
Abstract:
A system and method for providing at least one memory cell on a semiconductor is disclosed. The method and system include providing a tunneling barrier on the semiconductor, providing at least one floating gate having a corner, and oxidizing the tunneling barrier, a portion of the semiconductor, and the at least one floating gate. A portion of the at least one floating gate including the corner is disposed above the tunneling barrier. The portion of the semiconductor oxidizes at a first rate and at least the corner of the at least one floating gate oxidizes at a second rate. The second rate is sufficiently higher than the first rate to provide a desired thickness of the tunneling barrier a distance from the corner of the at least one floating gate for a particular rounding of the corner of the at least one floating gate.
Abstract:
A system and method for providing a flash memory is disclosed. The flash memory includes a plurality of memory cells. Each memory cell includes a source and a gate. The method and system include providing a plurality of word lines and a plurality of select devices. Each word line is coupled with the gate of each memory cell of a portion of the plurality of memory cells. Each word line provides a specific voltage to the portion of the plurality of memory cells during a read of a memory cell of the portion of the plurality of memory cells. The plurality of select devices correspond with the plurality of word lines. Each select device is coupled with the source of each memory cell of the portion of the plurality of memory cells coupled with the corresponding word line. Each select device couples the source of each memory cell of the portion of the plurality of memory cell with a specific potential during the read of the memory cell. The method and system reduce the number of memory cells coupled in parallel with the memory cell during the read.
Abstract:
A method of forming a contact in a flash memory device utilizes a local interconnect process technique. The local interconnect process technique allows the contact to butt against or overlap a stacked gate associated with the memory cell. The contact can include tungsten. The stacked gate is covered by a barrier layer which also covers the insulative spacers.