公开(公告)号：US20240214081A1

公开(公告)日：2024-06-27

申请号：US18174437

申请日：2023-02-24

申请人： NXP USA, Inc.

发明人： Vijay Ahirwar ,  Oliver Jérôme Célestin Jamin ,  Nilesh Nilkanth Khude

IPC分类号： H04B17/14 ,  H04B17/19 ,  H04B17/21

CPC分类号： H04B17/14 ,  H04B17/19 ,  H04B17/21

摘要： Polar transmitter calibration Various embodiments relate to a transmit and receive system using polar modulation, including: a transmitter configured to produce a transmit signal using modulation; a receiver configured to receive a transmit signal using in-phase/quadrature (IQ) processing; a Tx/Rx switch configured to loop a transmitted signal from the transmitter back to the receiver for calibration; and a controller configured to: command the transmitter to generate a real signal; command the Tx/Rx switch to loop the real signal back to the receiver to produce a first received signal; command the transmitter to generate an imaginary signal; command the Tx/Rx switch to loop the imaginary signal back to the receiver to produce a second received signal; determine a compensation parameter based on the first received signal and the second received signal; and command the receiver to compensate a third received signal based upon the compensation parameter.

公开(公告)号：US20240213926A1

公开(公告)日：2024-06-27

申请号：US18146502

申请日：2022-12-27

申请人： NXP USA, Inc.

发明人： Frederik Vanaverbeke ,  Roy McLaren

IPC分类号： H03F1/02 ,  H03F1/56 ,  H03F3/21

CPC分类号： H03F1/0288 ,  H03F1/56 ,  H03F3/211 ,  H03F2200/387 ,  H03F2200/451 ,  H03F2203/21131 ,  H03F2203/21139

摘要： A multiple-mode RF power amplifier includes two power amplifiers, output combiner circuitry, and a switchable impedance circuit. The power amplifiers receive first and second input RF signals and produce first and second amplified RF signals. The output combiner circuitry combines the amplified RF signals to produce a combined amplified RF signal. The switchable impedance circuit has an input terminal coupled to an isolated port of the output combiner circuitry. When the switchable impedance circuit is in a first state, the isolated port is coupled through the switchable impedance circuit to a first impedance to configure the multiple-mode RF power amplifier as a balanced amplifier. When the switchable impedance circuit is in a second or third state, the isolated port is coupled through the switchable impedance circuit to a second or third impedance to configure the multiple-mode RF power amplifier as a first or second type of Doherty power amplifier.

公开(公告)号：US12021950B2

公开(公告)日：2024-06-25

申请号：US17105212

申请日：2020-11-25

申请人： NXP USA, INC.

发明人： Liwen Chu ,  Hongyuan Zhang ,  Huiling Lou

IPC分类号： H04L69/14 ,  H04L69/322

CPC分类号： H04L69/14 ,  H04L69/322

摘要： Aspects of the disclosure are directed to an apparatus having a multi-link device (MLD) including processing circuitry to communicate signals with one of a plurality of remote devices over multiple communications link. The MLD and the one of the remote devices operate in first and second communication-specific configurations as follows. A physical layer convergence procedure protocol data unit (PPDU) is transmitted in one of the links while a PPDU is communicated in another one of the links under a first configuration. A PPDU is communicated in a first one of the respective communications links with an ending time set based on a PPDU communicated in a second one of the respective communications links in a second configuration. Such approaches may be carried out based on capabilities relating to simultaneous transmission and reception of MLDs that are communicating.

公开(公告)号：US20240186303A1

公开(公告)日：2024-06-06

申请号：US18062166

申请日：2022-12-06

申请人： NXP USA, Inc.

发明人： Zhiwei Gong ,  Scott M Hayes ,  Michael B. Vincent ,  Leo van Gemert ,  Antonius Hendrikus Jozef Kamphuis ,  Wen Hung Huang

IPC分类号： H01L25/16 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/14 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538

CPC分类号： H01L25/165 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/566 ,  H01L23/145 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/16 ,  H01L2224/16235 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043

摘要： A package is formed that encapsulates first and second components having respective first and second thickness differing from each other. Each component has lower surface provided with electrical contact pads and an upper surface opposite the lower surface. A volume of molding material encapsulates the first component. The package includes a set redistribution layers including a set of electrically-conductive interconnects surrounded by electrically-insulating material. The redistribution layers are disposed above the upper surface of the first component. The package includes one or more electrically conductive interconnects that pass through the redistribution layers to the lower surface of the first component; The second component is disposes at a location adjacent to the first component. A first portion of the second component is surrounded by the volume of molding material and a second portion of the second component is surrounded by one or more of the redistribution layers.

公开(公告)号：US20240184733A1

公开(公告)日：2024-06-06

申请号：US18073503

申请日：2022-12-01

申请人： NXP USA, Inc.

发明人： Kenneth Jaramillo

IPC分类号： G06F13/42 ,  H04B3/36

CPC分类号： G06F13/4282 ,  H04B3/36 ,  G06F2213/0042

摘要： A detector circuit of an eUSB repeater is coupled to a USB bus to detect a wake signal from a device through the USB bus and to send a forced resume signal to the device in response thereto. Repeater logic of the eUSB repeater repeats the received wake signal to the host. The host has a suspend state and an active state. The detector circuit detects the host resume signal from the host in the active state and stops sending the forced resume signal to the device in response thereto.

公开(公告)号：US20240178931A1

公开(公告)日：2024-05-30

申请号：US18523816

申请日：2023-11-29

申请人： NXP USA, Inc.

发明人： Yan Zhang ,  Amer Al-Baidhani ,  Rui Cao

IPC分类号： H04L1/00 ,  H04L5/00

CPC分类号： H04L1/0003 ,  H04L5/0044 ,  H04W84/12

摘要： In an IEEE 802.11 wireless system, a wireless STA is configured to signal a plurality of different spatial stream encoding values to a second STA device in a wireless personal area network in accordance with IEEE 802.11 protocol by generating a signaling physical layer protocol data unit (PPDU) which comprises a dedicated user information field which directly or indirectly identifies a plurality of different modulation and coding selection (MCS) values or different modulation orders used to encode different spatial streams from a plurality of spatial streams Nss used in a beamformed MIMO transmission of a data packet for each scheduled user of the signaling PPDU.

公开(公告)号：US20240171238A1

公开(公告)日：2024-05-23

申请号：US18512796

申请日：2023-11-17

申请人： NXP USA, Inc.

发明人： Sayak Roy ,  Ankit Sethi ,  Sudhir Srinivasa

IPC分类号： H04B7/06 ,  H04L5/00

CPC分类号： H04B7/0617 ,  H04B7/0634 ,  H04L5/0048 ,  H04W84/12

摘要： One example discloses a method for beamforming feedback reduction in a WLAN (wireless local area network), including: generating a per-tone beamforming feedback matrix by vectorizing a set of steering vectors using vectorization based dimension reduction (DR-Vec); performing lossy compression on the vectors; reducing the per-tone beamforming feedback matrix to one vector; and generating per-tone beamforming angle information using only the one vector.

公开(公告)号：US20240171132A1

公开(公告)日：2024-05-23

申请号：US18173855

申请日：2023-02-24

申请人： NXP USA, Inc.

发明人： Laure Bollinger ,  Yuanyuan Dong ,  Aniket Anant Wadodkar ,  Liang Xu

IPC分类号： H03F1/56 ,  H03F1/02 ,  H03F3/21 ,  H03F3/213

CPC分类号： H03F1/565 ,  H03F1/0288 ,  H03F3/211 ,  H03F3/213 ,  H03F2200/387

摘要： A power amplifier device includes an amplification path implemented within a power amplifier package. The amplification path includes input and output package leads, a transistor die with transistor input and output terminals and a power transistor, and a two-stage input impedance matching circuit electrically coupled between the input package lead and the transistor input terminal. The two-stage input impedance matching circuit has a double T-match topology that includes a first resonator coupled to the first input package lead, and a second resonator coupled between the first resonator and the transistor input terminal. The amplification path also includes an output impedance matching circuit coupled between the transistor output terminal and the first output package lead, and a second output harmonic termination circuit coupled to the first output package lead.

公开(公告)号：US11990384B2

公开(公告)日：2024-05-21

申请号：US16852064

申请日：2020-04-17

申请人： NXP USA, Inc.

发明人： Elie A. Maalouf ,  Eduard Jan Pabst

IPC分类号： H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/367 ,  H01L23/373 ,  H01L23/48 ,  H01L23/528 ,  H01L23/538 ,  H01L23/66 ,  H01L25/07 ,  H03F1/02 ,  H03F1/30 ,  H03F3/21

CPC分类号： H01L23/3121 ,  H01L21/56 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/481 ,  H01L23/528 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L24/81 ,  H01L25/072 ,  H03F1/0288 ,  H03F1/301 ,  H03F3/21 ,  H01L2223/6616 ,  H01L2223/6644 ,  H01L2224/16227 ,  H01L2224/8112 ,  H01L2224/81815 ,  H03F2200/451

摘要： A power amplifier module includes a module substrate, a power transistor die, and a heat spreader. The module substrate has first, second, and third module pads exposed at a mounting surface. The power transistor die has an input/output surface that faces the mounting surface, an opposed ground surface, an input pad electrically coupled to the first module pad, an output pad electrically coupled to the second module pad, and an integrated power transistor. In an embodiment, the power transistor is a field effect transistor with a gate terminal coupled to the input pad, a drain terminal coupled to the output pad, and a source terminal coupled to the ground surface. The heat spreader has a thermal contact surface that is physically and electrically coupled to the ground surface of the power transistor die. An electrical ground contact structure is connected between the thermal contact surface and the third module pad.

公开(公告)号：US20240162861A1

公开(公告)日：2024-05-16

申请号：US18054971

申请日：2022-11-14

申请人： NXP USA, Inc.

发明人： Kevin Kim ,  Vikas Shilimkar ,  Joseph Gerard Schultz

IPC分类号： H03F1/02 ,  H01L23/66

CPC分类号： H03F1/0288 ,  H01L23/66 ,  H01L2223/6655 ,  H03F2200/451

摘要： A power amplifier device includes a transistor die with an elongated bondpad coupled to a terminal of an integrated transistor. The device also includes a substrate formed from a stack of alternating dielectric and patterned conductive layers. An elongated die contact is exposed at a first substrate surface and is attached to the elongated bondpad to provide a uniform connection between the die contact and the elongated bondpad. A vertical interconnect structure is connected to the die contact and extends towards the second substrate surface. A circuit includes passive component(s) coupled to the second substrate surface and to the vertical interconnect structure. An encapsulation material layer covers the passive component(s) and the second substrate surface. A plurality of device interconnects are coupled to the substrate, electrically coupled to the power transistor die, and exposed at a contact surface of the power amplifier device.