Abstract:
A VCSEL illuminator module includes a module forming a physical cavity having electrical contacts positioned on an inner surface of the module that feed through the module to electrical contacts positioned on an outer surface of the module. A VCSEL device is positioned on the inner surface module and includes electrical contacts that are electrically connected to the electrical contacts on the inner surface of the module. The VCSEL device generates an optical beam when current is applied to the electrical contacts. An optical element is positioned adjacent to an emitting surface of the VCSEL device and is configured to modify the optical beam generated by the VCSEL device.
Abstract:
A high efficiency optical ignition device is provided in a two-part compact and robust package to be mounted directly on an internal combustion engine chamber. The ignition device ignites a combustion fuel with a high intensity plasma generated by a high power laser beam from a solid state laser operable in Q-switched, or non-Q-switched mode for producing short or long pulses, respectively. Multiple pulses are generated, and duration and frequency of the laser beam pulses are controlled by controlling an optical pump module to pump the solid state laser. The optical pump module comprises a semiconductor laser, preferably a VCSEL device. One or more laser beams are precisely directed, each one to a desired location anywhere within the combustion chamber for more efficient and near complete burning of the combustion fuel. The robust packaging is well suited to withstand mechanical and thermal stresses of the internal combustion engine.
Abstract:
A miniature structured light illuminator is provided. The miniature structured light illuminator uses a semiconductor surface emitting array including VCSEL or RC-LED array and an array of microlens elements to generate a wide range of structured light illumination patterns. The emission beam from a surface emitter array may be selectively directed, steered, focused or expanded, by applying a lateral displacement of the microlens array, such that centers of the emission beam and microlens array are misaligned. Emitted beams may be directed through small optical components to project the structured light pattern to a distant plane. The surface emitting arrays may be configured in addressable form to be activated separately for continuous or pulsed operation with very fast pulses having
Abstract:
A set of VCSEL fabrication methods has been invented which enhance the performance and long time reliability of VCSEL devices and arrays of devices. Wafer bow caused by growing a large number of epitaxial layers required to fabricate VCSEL device generates strain and results in bowing/warping of the device wafer. The stress so generated is eliminated by applying a stress compensation layer on the substrate to a surface opposite to the epitaxial layer surface. New oxidation equipment designs and process parameters are described which produce more precision apertures and reduce stress in the VCSEL device. An ultrathin fabrication procedure is described which enables high power VCSELs to be made for high power operation at many different wavelengths. A low temperature electrical contacting process improves VCSEL long term reliability.
Abstract:
Optical pump modules comprising VCSEL and VCSEL array devices provide high optical power for configuring fiber optic gain systems such as fiber laser and fiber amplifier particularly suited for high power operation. Pump modules may be constructed using two reflector or three reflector VCSEL devices optionally integrated with microlens arrays and other optical components, to couple high power pump beams to an optical fiber output port, particularly suited to couple light to an inner cladding of a double-clad fiber suitable for a high power gain element. Multiple-pumps may be combined to increase pump power in a modular fashion without significant distortion to signal, particularly for short pulse operation. The pump modules may be operated in CW, QCW and pulse modes to configure fiber lasers and amplifiers using single end, dual end, and regenerative optical pumping modes.
Abstract:
VCSEL arrays with planar electrical contacts readily adaptable for surface mounting are provided. Monolithic VCSEL arrays are configured in array patterns on two and three-dimensional surfaces for configuring optical illuminator modules. Illuminator modules are easily expandable by increasing the array size or by modularly arranging more arrays with or without a transparent substrate, in different shapes by tiling array modules monolithically on a common substrate, or by tiling small modules. The surface mountable illuminator modules are easily assembled on a thermally conductive surface that may be air or liquid cooled for efficient heat dissipation. Array modules may be integrated with other electronic circuits such as current drivers, sensors, controllers, processors, etc. on a common platform, for example, a single or multiple layer printed circuit boards (PCB) to assemble illumination systems for different applications including a gesture recognition apparatus and a battery operated portable illuminator devices.
Abstract:
A wavelength locker comprising a semiconductor or air gap etalon is used to monitor and maintain the output wavelength of a coherent radiation source. Said etalon may be fabricated from a commercially available silicon wafer, with individual regions of the wafer, each functioning as a separate etalon, etched or otherwise processed to produce different thicknesses. Illumination by the coherent radiation source generated transmitted signal intensities that are detected and processed to determine the output wavelength of the coherent radiation source. A wavelength tuner is then used to maintain or vary the output wavelength based on continuous measurements of etalon signal intensity.
Abstract:
Ohmic contacts, including materials and processes for forming n-type ohmic contacts on n-type semiconductor substrates at low temperatures, are disclosed. Materials include reactant layers, n-type dopant layers, capping layers, and in some instances, adhesion layers. The capping layers can include metal layers and diffusion barrier layers. Ohmic contacts can be formed on n-type semiconductor substrates at temperatures between 150 and 250° C., and can resist degradation during operation.
Abstract:
A multilayer interconnect is described which enables electrically connecting a complex distribution of VCSEL or other light emitter elements in a large high density addressable array. The arrays can include many groups of VCSEL elements interspersed among each other to form a structured array. Each group can be connected to a contact pad so that each group of light emitter elements can be activated separately.
Abstract:
A VCSEL illuminator package includes one or more VCSELs in a substrate. The one or more VCSELs are operable to generate a VCSEL output radiation beam. An encapsulant covers the one or more VCSELs, and an optical structure is integrated in the encapsulant. The optical structure is disposed in a path of the VCSEL output radiation beam and is operable to change at least one of a propagation characteristic or intensity distribution of the VCSEL output radiation beam exiting the encapsulant.